Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1989
10/04/1989EP0335783A1 Casing for an electronic circuit
10/04/1989EP0335679A2 Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
10/04/1989EP0335565A2 Process for producing printed wiring board
10/04/1989EP0335548A2 Impedance controlled connector interface
10/04/1989EP0335337A2 Flexible base materials for printed circuits
10/04/1989EP0335281A2 Method of making user adapted printed circuit boards
10/04/1989EP0335249A2 Electrical connector
10/04/1989EP0335123A2 Multilayer printed-circuit board comprising surface-mounted memories
10/04/1989EP0323505A4 Cathode surface treatment for electroforming metallic foil or strip.
10/03/1989US4872092 Coupler terminal block
10/03/1989US4871831 Functionalized with both saturated and unsaturated halides
10/03/1989US4871608 Lamination green sheets of glass and conductor pastes
10/03/1989US4871595 Polybenzobisthiazoles
10/03/1989US4871418 Etching of polyoxymethylene glycol substrate which has patterned photoresist coating
10/03/1989US4871324 Backplane for supporting removable modular
10/03/1989US4871319 Molded circuit board for ribbon cable connector
10/03/1989US4871317 Surface mounted component adaptor for interconnecting of surface mounted circuit components
10/03/1989US4870751 Nucleation, ablation
10/03/1989US4870746 Method of making a multilayer printed circuit board having screened-on resistors
10/03/1989CA1262070A1 Irradiation cross-linkable thermostable polymer system, for microelectronic applications
09/1989
09/28/1989DE3904542A1 Contact device
09/28/1989DE3808364A1 Printed circuit board
09/27/1989EP0334499A2 A prepreg sheet
09/27/1989EP0334397A2 Circuit board
09/27/1989EP0334393A2 Electromagnetic relay with symmetric reaction
09/27/1989EP0334279A2 Ceramic parting agent, process for producing and use of it
09/27/1989EP0334084A2 Use of a silk screen paste for manufacturing electrally conductive coatings on flexible plastic sheet materials
09/27/1989EP0333995A2 An apparatus of chamfering planar plate
09/27/1989EP0333994A2 A method of chamfering planar plate
09/26/1989US4870377 Electronic circuit substrate construction
09/26/1989US4870225 Mounting arrangement of chip type component onto printed circuit board
09/26/1989US4870224 Integrated circuit package for surface mount technology
09/26/1989US4870138 Semi-interpenetrating polymer networks
09/26/1989US4869983 Sulfonyl-containing styrene derivatives and their use in electrophotographic processes
09/26/1989US4869970 Radiation attenuation shielding
09/26/1989US4869956 Polymer/copper laminate and method for fabrication thereof
09/26/1989US4869926 Method of production galvanically deposited aluminum layers for use as contacts of microcircuits
09/26/1989US4869778 Method of forming a patterned aluminum layer and article
09/26/1989US4869767 Process for placing single or multiple patterned layers of conductive material on a substrate
09/26/1989US4868980 Method of designing and manufacturing circuits using universal circuit board
09/26/1989EP0242369A4 Surface mountable integrated circuit packages having solder bearing leads.
09/26/1989CA1261975A1 Solder joint
09/26/1989CA1261945A1 Printed wiring board means with integral dew sensor
09/26/1989CA1261481A1 Printed circuit board capable of preventing electromagnetic interference
09/26/1989CA1261420A1 Pin board matrix
09/26/1989CA1261109A1 High density para-aramid papers
09/26/1989CA1260810A1 Fluorescent solder paste mixture
09/26/1989CA1260625A1 Multilayer printed circuit board with domain partition
09/26/1989CA1260624A1 Unidirectional conduction metal to metal adhesive
09/26/1989CA1260623A2 Flexible cable assembly
09/26/1989CA1260337A1 Secondary metallization by glass displacement in ceramic substrate
09/26/1989CA1260174A1 Para-phenylene sulfide, block copolymers, process for the production of the same and use thereof
09/26/1989CA1259946A1 Forming ceramic tiles by electrodeposition on anodized support
09/21/1989WO1989008973A1 Inductive element and method of manufacture
09/21/1989WO1989008926A1 Vernier structure for flip chip bonded devices
09/21/1989WO1989008923A1 Method of producing laminated ceramic electronic parts
09/21/1989WO1989008908A1 Led display module
09/21/1989DE3843230C1 Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks
09/21/1989DE3807892A1 SMD radio-frequency transformer for wave soldering
09/20/1989EP0333550A1 Process for producing printed circuits on a three-dimensional plastic carrier, and carrier so equipped
09/20/1989EP0333374A2 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
09/20/1989EP0333252A2 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
09/20/1989EP0333237A2 Integrated circuit chip carrier
09/20/1989EP0333160A2 Laminated board for testing electronic components
09/20/1989EP0333132A2 Semiconductor device having multilayered wiring structure with a small parasitic capacitance
09/20/1989EP0332889A2 Method of constructing a high performance printed circuit board assembly
09/20/1989EP0332880A2 Process for the production of metal toners
09/20/1989EP0332834A1 Low dielectric printed circuit boards
09/20/1989EP0332764A1 Plastic substrate for thermal ink jet printer
09/20/1989EP0332747A2 Tape automated bonding package
09/19/1989US4868712 Three dimensional integrated circuit package
09/19/1989US4868637 Mixture of dielectric polymer and conductive particles; becomes conductive when concentrated by pressure to decrease spacing between particles
09/19/1989US4868584 Consisting of biphenyltetracarboxylic acid and aromatic diamine
09/19/1989US4868462 High voltage transformer for high frequency medical X-ray generator
09/19/1989US4868350 High performance circuit boards
09/19/1989US4868349 Plastic molded pin-grid-array power package
09/19/1989US4868253 Substrate for electroless metal plating
09/19/1989US4868252 Dispersion with fluoroacrylic ester
09/19/1989US4868071 Thermally stable dual metal coated laminate products made from textured polyimide film
09/19/1989US4868059 Electrical laminates
09/19/1989US4868047 Printed wiring board
09/19/1989US4868034 Non-oxidizing copper thick film conductors
09/19/1989US4868008 Copper sulfide
09/19/1989US4867935 Multilayer, dielectrics, hollow microspheres
09/19/1989US4867843 Ammonium fluoride, ammonium sulfate, sulfuric acid, water and sodium hydroxide
09/19/1989US4867235 Composite heat transfer means
09/19/1989CA1259528A1 Metalized substrates and process for producing
09/19/1989CA1259514A1 Photosensitive ceramic coating composition
09/14/1989DE3807618A1 Epoxy resin base material
09/14/1989DE3807617A1 Epoxy resin base material
09/13/1989EP0332561A2 Low Dielectric composite substrate
09/13/1989EP0332457A2 Multilayered ceramic substrates and method for manufacturing of the same
09/13/1989EP0332384A2 A circuit system, a composite metal material for use therein, and a method for making the material
09/13/1989EP0331965A2 Blends of poly(arylene sulfides), organic carbonates, further thermoplasts and glassfibers
09/13/1989EP0331953A1 Printed circuit board with a cooling device
09/13/1989EP0331909A1 High performance circuit boards
09/13/1989EP0331818A1 Method for obtaining electrical interconnect using a solderable mechanical fastener
09/12/1989US4866683 Integrated acoustic receiver or projector
09/12/1989US4866573 Surface mounted coil
09/12/1989US4866571 Semiconductor package
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