Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/1990
04/10/1990US4915655 Telephone connector
04/10/1990US4914829 Image alignment indicators
04/10/1990US4914815 Method for manufacturing hybrid integrated circuits
04/10/1990CA1267693A1 Portable radio transceiver housing structurally supported by a battery
04/05/1990WO1990003662A1 Hybrid microchip bonding article
04/05/1990DE3931809A1 Curable formulation based on reaction prod. of polyphenylene ether - with unsatd. carboxylic acid or anhydride, polyepoxide cpd. and epoxy cure catalyst
04/05/1990DE3833441A1 Process for metallising aluminium oxide substrates
04/04/1990EP0362161A2 Method of manufacturing a substrate for microwave integrated circuits
04/04/1990EP0361985A1 Hybrid microchip bonding article
04/04/1990EP0361777A2 Lubrication of printed circuit card contact tabs
04/04/1990EP0361721A1 Dielectric ceramic composition
04/04/1990EP0361462A2 Process for producing copper or silver/polyimide composite article
04/04/1990EP0361461A2 Process for producing metal-polyimide composite article
04/04/1990EP0361195A2 Printed circuit board with moulded substrate
04/04/1990EP0361193A2 Circuit board with an injection-moulded substrate
04/04/1990EP0360971A2 Mounting substrate and its production method, and printed wiring board having connector function and its connection method
04/04/1990EP0360811A1 Solder connector device.
04/04/1990EP0277118B1 Removable commoning bar
04/04/1990CN1041079A Multi-layer printed circuit boards
04/04/1990CN1041045A Photosensitive semi-aqueous developable ceramic coating composition
04/03/1990US4914260 Ceramic multi-layer printed circuit boards
04/03/1990US4914259 Molded circuit board
04/03/1990US4913955 Glass fiber woven cloth; impregnated with acrylonitrile-butadiene copolymer reacted with epoxy resin
04/03/1990US4913784 Process for metallizing a ceramic substrate
04/03/1990US4913662 Flat, flexible, cable construction and connector attached thereto
04/03/1990US4912844 Methods of producing printed circuit boards
04/03/1990US4912843 Method for repairing interconnect interruptions
03/1990
03/29/1990DE3832856A1 Printed circuit board having a thermally conductive element
03/28/1990EP0360727A1 Contact element for electrical conductor
03/28/1990EP0360647A1 Coding device especially for printed circuit boards
03/28/1990EP0360558A2 Shielded jumper
03/28/1990EP0360385A1 Metallised polymeric films
03/28/1990EP0360295A2 Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made
03/28/1990EP0359775A1 Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
03/28/1990CN1040903A Moulded printed circuit board
03/27/1990US4912772 Connector and circuit package apparatus for pin array circuit module and circuit board
03/27/1990US4912769 Hearing aid comprising a printed circuit board and hearing coil
03/27/1990US4912603 High density printed wiring board
03/27/1990US4912597 Assembly of electric impedance elements
03/27/1990US4912288 Moulded electric circuit package
03/27/1990US4912284 Electrical circuits
03/27/1990US4912190 Epoxy resin formulation having an extremely short hardening time for the production of epoxy glass laminates in continuously operating double-belt presses
03/27/1990US4912178 New phenolic resin compositions
03/27/1990US4912020 Printed circuit boards and method for manufacturing printed circuit boards
03/27/1990US4912019 Ceramic particles in binder
03/27/1990US4911771 Laminated printed circuit board and process for its manufacture
03/22/1990WO1990003101A1 Improvements relating to printed circuit boards
03/22/1990WO1990003100A1 Printed circuit boards and method for manufacturing printed circuit boards
03/22/1990WO1990003098A1 Preparing articles for soldering
03/22/1990WO1990003045A1 Method of forming holes in ceramic ic packages
03/22/1990WO1990002640A1 Apparatus for punching and/or cutting sheets of material
03/22/1990DE3930858A1 Modular electronic power circuit - with power components supported by metallised ceramics layer and enclosed by overlying insulation layer
03/22/1990DE3832299A1 Method for producing a three-dimensional conductor moulding having a recessed conductor-track layout
03/22/1990DE3831961A1 Holder for hybrid boards having electronic components
03/21/1990EP0359566A2 I/O relay interface module
03/21/1990EP0359562A2 Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition
03/21/1990EP0359518A2 Improvements in aluminium nitride substrates
03/21/1990EP0359413A2 Hybrid circuits
03/21/1990EP0359238A2 Array antenna device having IC units with IF conversion circuits for coupling antenna elements and signal combiner
03/21/1990EP0358937A2 3-D circuit board
03/21/1990EP0358783A1 Polyimide molecular weight enhancement by solvent extraction
03/20/1990US4910643 Thick film, multi-layer, ceramic interconnected circuit board
03/20/1990US4910584 Semiconductor device
03/20/1990US4910499 Tag and method of making same
03/20/1990US4910415 Interconnection between a battery cell and a printed circuit board in an electric apparatus
03/20/1990US4910077 Polynorbornene laminates and method of making the same
03/20/1990US4910045 Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces
03/20/1990US4909909 Laminating using high frequency circuit
03/20/1990US4909886 Process for producing copper-clad laminate
03/20/1990US4909742 IC card and mating socket
03/20/1990US4908940 Method of manufacturing two-layer printed circuit sheet
03/20/1990US4908939 Method of making coaxial interconnection boards
03/20/1990US4908933 Method of manufacturing a substrate for mounting electronic components
03/14/1990EP0358504A2 Electrical components
03/14/1990EP0358332A2 Circuit board and method of soldering
03/14/1990EP0357961A2 Method and apparatus for boring holes into a printing platen
03/14/1990EP0357769A1 Vernier structure for flip chip bonded devices
03/14/1990EP0357612A1 Electrical switching and control apparatus.
03/14/1990EP0357608A1 High-frequency component.
03/13/1990US4908740 Integral composite structure with predetermined electrically conductive networks and method for producing same
03/13/1990US4908738 Drive motor control unit
03/13/1990US4908735 Electronic apparatus reducing generation of electro magnetic interference
03/13/1990US4908734 Housing for motor control unit
03/13/1990US4908696 Connector and semiconductor device packages employing the same
03/13/1990US4908590 Chip-like LC filter
03/13/1990US4908586 Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof
03/13/1990US4908427 Polymer composition
03/13/1990US4908296 Photosensitive semi-aqueous developable ceramic coating composition
03/13/1990US4908275 Film carrier and method of manufacturing same
03/13/1990US4908258 High dielectric constant flexible sheet material
03/13/1990US4907991 Connective jumper
03/13/1990US4907977 Computer backpanel inversion coupler
03/08/1990WO1990002406A1 Process for making noble metal coated metallic particles, and resulting conductive materials
03/08/1990DE3829117A1 Metal core printed circuit board
03/07/1990EP0357486A1 Process for producing a connection zone for a hyperfrequency circuit of the triplate type, and circuit so obtained
03/07/1990EP0357307A2 Printed-wiring board
03/07/1990EP0357196A1 Metallised polymeric films
03/07/1990EP0357088A2 Multilayer wiring substrate
03/07/1990EP0357063A2 Photosensitive ceramic coating composition
03/07/1990EP0356887A2 Method to selectively direct electromagnetic rays onto a given part of an object
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