Patents for H05K 1 - Printed circuits (98,583)
04/2006
04/12/2006CN1758833A Multi-layer board manufacturing method
04/12/2006CN1758830A High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
04/12/2006CN1758829A Printed circuit board and method of fabricating same
04/12/2006CN1758828A Printed circuit board structure for high-speed signal
04/12/2006CN1758098A Display modular and its sealing method
04/12/2006CN1251563C Protection film coated on basic plate for multi-layer substrate formation use, apparatus and method for checking basic plates
04/12/2006CN1251562C Composite laminate and its manufacturing method
04/12/2006CN1251561C Wiring board
04/12/2006CN1251560C Parts built in module and its making method
04/12/2006CN1251362C Electric component with conducting circuit
04/12/2006CN1251350C Filter circuit apparatus and manufacturing method thereof
04/12/2006CN1251349C 微波电路 Microwave Circuits
04/12/2006CN1251325C Chip packaging substrate
04/12/2006CN1251319C Microelectronic component insert making method
04/12/2006CN1250478C Photosensitive ceramic blank plate, ceramic package and process for producing same
04/12/2006CN1250394C Copper-clad laminate
04/11/2006US7027308 Printed circuit board method and apparatus
04/11/2006US7027307 Clock routing in multiple channel modules and bus systems
04/11/2006US7027304 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
04/11/2006US7027289 Extended thin film capacitor (TFC)
04/11/2006US7027262 Spindle motor structure mounted directly on a base plate of a thin type flexible disk drive
04/11/2006US7027043 Wiring substrate connected structure, and display device
04/11/2006US7026884 High frequency component
04/11/2006US7026835 Engagement probe having a grouping of projecting apexes for engaging a conductive pad
04/11/2006US7026708 Low profile chip scale stacking system and method
04/11/2006US7026572 Stripping insulation from flat cables
04/11/2006US7026545 Flex cable having a return-signal path and method for reducing length and impedance of a return-signal path
04/11/2006US7026436 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics
04/11/2006US7026190 Method of manufacturing circuit device
04/11/2006US7026188 Electronic device and method for manufacturing the same
04/11/2006US7026054 Laminate utilizing a metal layer activated by nitrogen plasma treatment
04/11/2006US7026033 Heat-resistant synthetic fiber sheet
04/11/2006US7026032 Controlling particle size; interpenetrating polymer nertwork; thin film, high speed digital circuits
04/11/2006US7025849 Method of attaching optical waveguide component to printed circuit board
04/11/2006US7025845 Surface mounted device type package using coaxial cable
04/11/2006US7025604 High current output pin
04/11/2006US7025027 Channel-shaped connection device for electrical lines of internal combustion engines
04/11/2006US7024764 Method of making an electronic package
04/06/2006WO2006036692A1 Flexible cable for high-speed interconnect
04/06/2006WO2006036282A1 Circuit board assembly with reduced capacitive coupling
04/06/2006WO2006035908A1 Silver paste composition
04/06/2006WO2006035853A1 Printed circuit board, a printed circuit assembly and electronic apparatus
04/06/2006WO2006035128A2 Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
04/06/2006WO2005109975A3 Broadband balance-to-unbalance transformer
04/06/2006US20060073737 Board-mounting device
04/06/2006US20060073715 Connector mounted to display board
04/06/2006US20060073714 Electrical connector assembly
04/06/2006US20060073711 Electronic apparatus
04/06/2006US20060073709 High density midplane
04/06/2006US20060073639 Electronic parts packaging structure and method of manufacturing the same
04/06/2006US20060073316 HDD suspension and its manufacture
04/06/2006US20060073277 Method for producing a partially metallized film-type element
04/06/2006US20060072871 Electronic circuit board
04/06/2006US20060072297 Circuit Module Access System and Method
04/06/2006US20060072202 Rearview mirror constructed for efficient assembly
04/06/2006US20060071323 Method for processing a thin film substrate
04/06/2006US20060071311 Surface-mounted microwave package and corresponding mounting with a multilayer circuit
04/06/2006US20060071083 Security tag and process for making same
04/06/2006US20060071052 Method and apparatus for determining solder paste composition quality
04/06/2006US20060070978 Method for manufacturing a bump-attached wiring circuit board
04/06/2006US20060070769 Printed circuit board and method of fabricating same
04/06/2006US20060070493 Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
04/06/2006DE19964099B4 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme A process for producing three-dimensionally arranged leading and connecting structures for volume and energy flows
04/06/2006DE102005044349A1 Leiterplattenanordnung mit integrierter Antenne Printed circuit board assembly with integrated antenna
04/06/2006DE102005043014A1 Leiterplatine und Verfahren zu deren Herstellung Printed circuit board and process for their preparation
04/06/2006DE102004049154A1 Electrical device e.g. control device, has heat conductive component retainer dissipating part of lost heat of electrical component, where additional device is not arranged between electrical component and component retainer
04/06/2006DE102004048274A1 Filter element for filtering electromagnetic waves, especially bandpass filter or band blocking filter, has resonator held at distance from contacting structure in recess in circuit board by suitable attachment arrangement
04/06/2006DE102004047590A1 Formteil mit elektrischer Leiterbahn Molding with electrical conductor
04/06/2006DE102004045948A1 Oberflächenmontierbares Bauelement Surface mount device
04/06/2006DE10104267B4 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation
04/05/2006EP1643596A2 Interconnect structure
04/05/2006EP1643582A1 Method of fabricating rechargeable batteries
04/05/2006EP1643552A1 Module including circuit elements
04/05/2006EP1642917A1 Epoxy resin composition
04/05/2006EP1642483A1 Method for transmission of signals in a circuit board and a circuit board
04/05/2006EP1642379A1 Circuit arrangement for emv-suppression of a direct current motor, and switching module
04/05/2006EP1642346A1 Light-emitting diode thermal management system
04/05/2006EP1642176A1 Ground connection of a printed circuit board placed in a wristwatch type electronic device
04/05/2006EP1641591A1 Method for separating flat ceramic workpieces with a calculated radiation spot length
04/05/2006EP1485251A4 Silicone resin based composites interleaved for improved toughness
04/05/2006EP1480834A4 Marking substrates
04/05/2006EP1392093B1 Method for manufacturing ceramic multilayered board
04/05/2006EP1162867B1 Multilayer printed wiring board and method of producing multilayer printed wiring board
04/05/2006EP0817548B1 Printed wiring board and method for manufacturing the same
04/05/2006CN2770275Y Improvement of printing circuit board ground plane structure
04/05/2006CN1757269A Substrate and method for producing same
04/05/2006CN1757111A Printed wiring board, method for manufacturing same, lead frame package and optical module
04/05/2006CN1756872A Wet-process nonwoven fabric and process for producing the same
04/05/2006CN1756716A Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
04/05/2006CN1756593A Use of dispersions in making electronic devices
04/05/2006CN1756474A 射频模块及其制造方法 RF module and manufacturing method thereof
04/05/2006CN1756472A Straight blow type radiating converter
04/05/2006CN1756461A Method for forming wiring pattern, wiring pattern, and electronic apparatus
04/05/2006CN1756459A Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus
04/05/2006CN1756457A Mounting structure mounting substrate, electro-optical device, and electronic apparatus
04/05/2006CN1756456A Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment
04/05/2006CN1756455A Flexible substrate
04/05/2006CN1755992A Connector and electronic apparatus having the same
04/05/2006CN1755919A Circuit device and manufacturing method thereof
04/05/2006CN1755847A Surface mount coil component and surface mount coil component mounted substrate