Patents for H05K 1 - Printed circuits (98,583)
01/2008
01/24/2008US20080020231 Epoxy Resin Composition
01/24/2008US20080019877 Gas Detecting Arrangement
01/24/2008US20080019105 Microcircuit card attached to an adapter base, card base and manufacturing method
01/24/2008US20080017719 Card apparatus and method of producing the same
01/24/2008US20080017412 Multilayer interconnection board
01/24/2008US20080017411 High-speed signal transmission structure having parallel disposed and serially connected vias
01/24/2008US20080017410 Method for forming a plated microvia interconnect
01/24/2008US20080017409 Multilayer board
01/24/2008US20080017407 Interposer and electronic device using the same
01/24/2008US20080017406 Thermal conduit
01/24/2008US20080017405 Circuit board and anti-static module thereof
01/24/2008US20080017404 Miniature circuitry and inductive components and methods for manufacturing same
01/24/2008US20080017403 Method of manufacturing circuit-forming board and material of circuit-forming board
01/24/2008US20080017402 Substrate module with high thermal conductivity and its fabrication method of same
01/24/2008DE102006033477B3 Leiterträger und Anordnung mit Leiterträger Ladder rack and ladder rack arrangement with
01/24/2008DE102006033269A1 Verfahren zum Herstellen eines flexiblen Leiterträgers und Anordnung mit dem flexiblen Leiterträger A method for producing a flexible conductor carrier arrangement and with the flexible conductor carrier
01/24/2008DE102006033175A1 Elektronikanordnung Electronics assembly
01/23/2008EP1881749A2 Method of fabricating an electrical connecting element, and electrical connecting element
01/23/2008EP1881748A2 Multi-layer laminate substrates useful in electronic type appliactions
01/23/2008EP1881747A1 Printed circuit board and electronic device having the same
01/23/2008EP1881746A2 Cooling device for light emitting diode (LED) module and method for fabricating the same
01/23/2008EP1881555A1 Mobile communication terminal
01/23/2008EP1881362A1 Light source module, light source apparatus and liquid crystal display
01/23/2008EP1881352A1 Optical transceiver
01/23/2008EP1880587A1 Printed circuit board
01/23/2008EP1658658A4 A flexible flat cable termination structure for a clockspring
01/23/2008EP1342252B1 Multi-layer and user-configurable micro-printed circuit board
01/23/2008EP1310518B1 Dielectric resin foam and lens antenna comprising the same
01/23/2008EP1279242B1 Rugged shock-resistant backplane for embedded systems
01/23/2008CN201011747Y Circuit board module
01/23/2008CN201011746Y Device for heating printed-circuit board
01/23/2008CN101112140A Multilayer printed wiring board and its manufacturing method
01/23/2008CN101112137A Connection component, multilayer substrate
01/23/2008CN101112136A System component of a control device
01/23/2008CN101112135A Improved matched-impedance surface-mount technology footprints
01/23/2008CN101112134A Packaging installation module
01/23/2008CN101112133A 表面安装连接器 Surface mount connector
01/23/2008CN101111129A Manufacturing method of printed circuit board
01/23/2008CN101111128A Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embe
01/23/2008CN101111126A 电路板 Circuit board
01/23/2008CN101111125A Multilayer interconnection board
01/23/2008CN101111124A Silver alloy material, circuit board, electronic device and method of producing circuit board
01/23/2008CN101111123A Hybrid multilayer circuit board and its manufacturing method
01/23/2008CN101110412A A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same
01/23/2008CN101110404A Hybrid integrated circuit device, and method for fabricating the same, and electronic device
01/23/2008CN101109871A Light source module, light source apparatus and liquid crystal display
01/23/2008CN101108956A Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
01/23/2008CN100364371C Device for connecting electric components
01/23/2008CN100364370C Wiring structure
01/23/2008CN100364086C Semiconductor device and electronic device, and methods for manufacturing thereof
01/23/2008CN100364078C Circuit board, process for producing the same and power module
01/23/2008CN100364077C High wireability microvia substrate
01/23/2008CN100364043C Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
01/22/2008US7321967 System and method for configuring capabilities of printed circuit boards
01/22/2008US7321497 Electronic circuit apparatus and method for stacking electronic circuit units
01/22/2008US7321496 Flexible substrate, multilayer flexible substrate and process for producing the same
01/22/2008US7321495 Capacitor and method for manufacturing the same
01/22/2008US7321099 Component mounting substrate and structure
01/22/2008US7321098 Laminate ceramic circuit board and process therefor
01/22/2008US7321097 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same
01/22/2008US7320936 Plating of multi-layer structures
01/22/2008US7320607 Main board for portable terminal
01/22/2008US7320606 Electrical connector with terminal having flat indentation
01/22/2008US7320603 Flat connector
01/20/2008CA2552620A1 An anchoring member to facilitate fastening daughter boards to a mother board and a method for use
01/17/2008WO2008008552A2 Build-up printed wiring board substrate having a core layer that is part of a circuit
01/17/2008WO2008008193A1 RF Rx FRONT END MODULE FOR PICOCELL AND MICROCELL BASE STATION TRANSCEIVERS
01/17/2008WO2008007673A1 Flexible light guide and laminate board for optical/electrical composite wiring board
01/17/2008WO2008007613A1 Wiring board and solid-state imaging device
01/17/2008WO2008007472A1 Electronic device, method for manufacturing same, and liquid crystal display device
01/17/2008US20080014772 Component mounting position correcting method and component mouting apparatus
01/17/2008US20080014771 Universal-Serial-Bus (USB) Flash-Memory Device With Metal Wrap Formed Over Plastic Housing
01/17/2008US20080014770 Coupling assembly
01/17/2008US20080014768 Rigid-flexible printed circuit board and method of manufacturing the same
01/17/2008US20080014767 Electric Junction Box
01/17/2008US20080014766 Data tracking method and system applied in semiconductor manufacturing
01/17/2008US20080013295 Capacitor sheet and electronic circuit board
01/17/2008US20080013294 Power card connection structure
01/17/2008US20080013292 Rollable Electronic Panel Device
01/17/2008US20080013291 Thermal flow sensor having streamlined packaging
01/17/2008US20080013290 Printed circuit board thickness adaptors
01/17/2008US20080012905 Inkjet printhead integrated circuit with work transmitting structures
01/17/2008US20080012425 Power supply equipment with matching indicators on converter and connector adapters
01/17/2008US20080011509 Fractal and space-filling transmission lines, resonators, filters and passive network elements
01/17/2008US20080011508 Electronic parts packaging structure and method of manufacturing the same
01/17/2008US20080011507 Build-up printed wiring board substrate having a core layer that is part of a circuit
01/17/2008US20080011506 Method of Reducing Noise Induced From Reference Plane Currents
01/17/2008US20080010823 Method for increasing a production rate of printed wiring boards
01/17/2008US20080010822 Method for increasing a production rate of printed wiring boards
01/17/2008DE112006000155T5 Sensor mit schmalem Montageprofil Sensor with narrow mounting profile
01/17/2008DE10234705B4 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen Electroplating and plating system for coating already formed conductive structures
01/17/2008DE102006032441A1 Device has printed circuit board, module which comprising electro-technical element and mechanically loadable electrical contact element on side, and module is electrically connected on side
01/17/2008DE102006032436A1 Device for arrangement of electronic element on printed circuit board, has support element, electro-technical element, which is arranged on support element, and cover that is provided with electro-technical element for support element
01/17/2008DE102005051940B4 Leiterplatte mit Schirmanschluß PCB with shield connection
01/17/2008DE102004005361B4 Verfahren zur Herstellung von metallischen Leitbahnen und Kontaktflächen auf elektronischen Bauelementen A process for the production of metallic interconnects and contact surfaces on electronic components
01/16/2008EP1879437A1 A marking apparatus used in a process for producing multi-layered printed circuit board
01/16/2008EP1879228A1 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
01/16/2008EP1878328A2 Apertures for signal shaping using ground and signal pth back-drilling
01/16/2008EP1878327A2 Generic patterned conductor for customizable electronic devices
01/16/2008EP1878326A2 Orthogonal backplane connector