| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/29/2008 | US7405387 System and method for attenuating the effect of ambient light on an optical sensor |
| 07/29/2008 | US7405366 Interposer and electronic device fabrication method |
| 07/29/2008 | US7405365 Wiring substrate and method for manufacturing the same |
| 07/29/2008 | US7405364 Decoupled signal-power substrate architecture |
| 07/29/2008 | US7405363 Connecting sheet |
| 07/29/2008 | US7405362 Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same |
| 07/29/2008 | US7405155 Circuit package and method of plating the same |
| 07/29/2008 | US7405109 Method of fabricating the routing of electrical signals |
| 07/29/2008 | CA2205811C Multifunctional cyanate ester and epoxy blends |
| 07/24/2008 | WO2008089474A2 Apparatus and method for reduced delamination of an integrated circuit module |
| 07/24/2008 | WO2008088831A2 Coiled circuit device with active circuitry and methods for making the same |
| 07/24/2008 | WO2008088725A2 High-current traces on plated molded interconnect device |
| 07/24/2008 | WO2008088505A1 Apparatus and method for high speed signals on a printed circuit board |
| 07/24/2008 | WO2008087976A1 Printed wiring board and method for manufacturing the same |
| 07/24/2008 | WO2008087972A1 Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies |
| 07/24/2008 | WO2008087172A1 Method for the production of structured, electrically conductive surfaces |
| 07/24/2008 | WO2008059342A3 Method of treating a material, the so obtained treated material and devices containing said material |
| 07/24/2008 | US20080176732 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required |
| 07/24/2008 | US20080176426 Electrical connector with improved housing |
| 07/24/2008 | US20080176035 Circuit board structure and fabrication method of the same |
| 07/24/2008 | US20080176005 For metal-graphite composite material having substrate with surface having a carbon fiber content which is 10% or less of the carbon fiber content of the material, metal-containing intermediate layer (especially a zincate), and a metal coating (aluminum or alloy); hermetically sealed; corrosion resistant |
| 07/24/2008 | US20080174978 Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 07/24/2008 | US20080174977 Electronic component contained substrate |
| 07/24/2008 | US20080174976 Electronic Circuit Component |
| 07/24/2008 | US20080174975 Flexible wiring substrate and method for producing the same |
| 07/24/2008 | US20080174973 Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment |
| 07/24/2008 | US20080174972 Electronic device with flip module having low height |
| 07/24/2008 | US20080174003 Apparatus and method for reduced delamination of an integrated circuit module |
| 07/24/2008 | US20080173479 Modular method and system for insulated bus bar cable harness termination concept |
| 07/24/2008 | US20080173477 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 07/24/2008 | US20080173476 Embedded waveguide and embedded electromagnetic shielding |
| 07/24/2008 | US20080173474 Universal systems printed circuit board for interconnections |
| 07/24/2008 | US20080173473 Multilayered printed circuit board and manufacturing method thereof |
| 07/24/2008 | US20080173472 Printed circuit board and electronic apparatus |
| 07/24/2008 | US20080173471 Element substrate and method of manufacturing the same |
| 07/24/2008 | US20080173470 Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards |
| 07/24/2008 | US20080173469 Multilayer wiring board |
| 07/24/2008 | US20080173468 Wiring substrate, method for manufacturing the same, and electronic apparatus |
| 07/24/2008 | US20080172871 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 07/24/2008 | DE202006020419U1 Leiterstruktur Conductor structure |
| 07/24/2008 | DE112006002475T5 Harzzusammensetzung, blattförmig ausgebildeter Körper, Prepreg, gehärteter Körper, Laminat und Mehrschichtlaminat Resin composition, leaf-shaped design body, prepreg, hardened body, laminate and multi-layer laminate |
| 07/24/2008 | DE10297754B4 Speichermodul mit einem Übertragungspfad für Highspeed-Daten und einem Übertragungspfad für Lowspeed-Daten, Speichersystem mit einem solchen Speichermodul und Verfahren zum Übertragen von Daten in einem solchen Speichermodul Memory module with a transmission path for high-speed data and a transmission path for low-speed data storage system with such a memory module and method for transmitting data in such a memory module |
| 07/24/2008 | DE102007004247A1 Verfahren zum Bearbeiten von extrudierten Kunststoffplatten Method for processing extruded plastic sheets |
| 07/24/2008 | DE102007003182A1 Elektrisches Bauelement Electrical component |
| 07/24/2008 | DE102007002858A1 Electronic component, has carrier unit including separating unit partially overlapping with electrical contact point, where separating unit is partially free from mechanically penetratable material e.g. silicone or epoxy resin |
| 07/24/2008 | DE102007002323A1 Electronics-flat system for e.g. clothing article in textile structure, has electronic component arranged on upper and lower sides of printed circuit boards in dry area, and electrical connecting contacts arranged in dry area on sides |
| 07/24/2008 | CA2675033A1 Method for producing structured electrically conductive surfaces |
| 07/23/2008 | EP1947917A2 Manufacturing method of electronic device |
| 07/23/2008 | EP1947739A1 Holding member, packaging structure, and electronic component |
| 07/23/2008 | EP1947694A1 Supporting substrate for electronic components |
| 07/23/2008 | EP1947671A2 Plasma Display Device |
| 07/23/2008 | EP1947654A1 Conductive powder and process for producing the same, conductive powder paste, and process for producing the conductive powder paste |
| 07/23/2008 | EP1946625A1 Electronic circuit arrangement and method for producing an electronic circuit arrangement |
| 07/23/2008 | EP1820235B1 A stripline arrangement and a method for production thereof |
| 07/23/2008 | EP1665333A4 Coupler resource module |
| 07/23/2008 | EP1448725A4 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 07/23/2008 | CN201091081Y Printed circuit board composite structure and electronic device |
| 07/23/2008 | CN101228774A Acoustic path for a wireless communications device |
| 07/23/2008 | CN101228667A Composite porous resin base material and method for manufacturing same |
| 07/23/2008 | CN101228626A A package for a die |
| 07/23/2008 | CN101227814A Shrapnel on circuit board and electromagnetic shielding assembly |
| 07/23/2008 | CN101227803A Circuit board with conductive structures and manufacturing method thereof |
| 07/23/2008 | CN101227799A Electronic device and method of manufacturing same |
| 07/23/2008 | CN101227798A Electronic device and method of manufacturing the same |
| 07/23/2008 | CN101227795A Flexible printing wiring board |
| 07/23/2008 | CN101227794A Flexible substrate integrated waveguides |
| 07/23/2008 | CN101227793A Circuit structure |
| 07/23/2008 | CN101226914A Chip carrier substrate capacitor and method for fabrication thereof |
| 07/23/2008 | CN101226908A Projection structure with ring-shaped support and manufacturing method thereof |
| 07/23/2008 | CN101226798A Transient voltage protection circuit boards and manufacturing method |
| 07/23/2008 | CN101224650A Auxiliary material for laminating flexible circuit board and laminating process thereof |
| 07/23/2008 | CN100405885C Fan structure |
| 07/23/2008 | CN100405884C Throughplating of flexible printed boards |
| 07/23/2008 | CN100405882C Mounting structure mounting substrate, electro-optical device, and electronic apparatus |
| 07/23/2008 | CN100405881C Wiring board |
| 07/23/2008 | CN100405880C Pin connection structure, and method for modifying definition of pin position |
| 07/23/2008 | CN100405744C Tuner unit, receiver and electronic apparatus |
| 07/23/2008 | CN100405684C Arc discharge protector |
| 07/23/2008 | CN100405594C Interposer for decoupling integrated circuits on a circuit board |
| 07/23/2008 | CN100405583C High-frequency wiring structure and method for producing the same |
| 07/23/2008 | CN100405562C Method for producing wiring base board |
| 07/23/2008 | CN100405532C Method of soldering semiconductor part and mounting structure of semiconductor part |
| 07/23/2008 | CN100405506C Conducting material with anisotropy |
| 07/23/2008 | CN100405505C Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same |
| 07/23/2008 | CN100405336C Wiring architecture for transmission wires in high speed printed circuit board |
| 07/23/2008 | CN100405149C Device and method of making a device having a flexible layer structure |
| 07/23/2008 | CN100405137C On-glass direct wiring liquid crystal displaying plate and producing method thereof |
| 07/23/2008 | CN100404597C Thermally conductive adhesive composition and process for device attachment |
| 07/23/2008 | CN100404240C Process for producing polyester film |
| 07/23/2008 | CN100404192C Method and system for laser trimming of resistors |
| 07/22/2008 | US7403397 Switching power-supply module |
| 07/22/2008 | US7402896 Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
| 07/22/2008 | US7402894 Integrated circuit carrier |
| 07/22/2008 | US7402892 Printed circuit board for connecting of multi-wire cabling to surge protectors |
| 07/22/2008 | US7402760 Multi-layer printed wiring board and manufacturing method thereof |
| 07/22/2008 | US7402759 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board |
| 07/22/2008 | US7402758 Telescoping blind via in three-layer core |
| 07/22/2008 | US7402756 Flexible circuit board |
| 07/22/2008 | US7402755 Circuit board with quality-indicator mark and method for indicating quality of the circuit board |
| 07/22/2008 | US7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |