Patents for H05K 1 - Printed circuits (98,583)
06/2014
06/19/2014US20140168920 Component-mounting printed board and method of manufacturing the same
06/19/2014US20140168919 Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure
06/19/2014US20140168913 Method and apparatus for reducing stress on mounted electronic devices
06/19/2014US20140168911 Electronic device with chip module
06/19/2014US20140168909 Gapped attachment structures
06/19/2014US20140168904 Wireless internet router
06/19/2014US20140168903 Passive cooling system integrated into a printed circuit board for cooling electronic components
06/19/2014US20140168902 Semiconductor package
06/19/2014US20140168899 Package substrate and electronic assembly
06/19/2014US20140166355 Method of manufacturing printed circuit board
06/19/2014US20140166354 Circuit board and manufacturing method thereof
06/19/2014US20140166353 Electrical interconnect formed through buildup process
06/19/2014US20140166351 Multilayer ceramic capacitor and circuit board for mounting the same
06/19/2014US20140166350 Methods for Forming Metallized Dielectric Structures
06/19/2014US20140166349 Ceramic substrate and method of manufacturing the same
06/19/2014US20140166348 Printed circuit board
06/19/2014US20140166347 Printed circuit board and method for manufacturing the same
06/19/2014US20140166346 Ceramic substrate, and method of manufacturing the same
06/19/2014US20140166345 Transparent conducting glass and method of manufacturing same
06/19/2014US20140166344 Multilayer substrate
06/19/2014US20140166343 Electronic component embedded substrate and method of manufacturing electronic component embedded substrate
06/19/2014US20140165269 Flexible computing fabric
06/18/2014EP2744311A1 Method for producing resonating patterns suitable for the performance of passive RF functions
06/18/2014EP2744310A1 Wiring substrate and method for manufacturing same and semiconductor device
06/18/2014EP2744309A1 Electric connecting element
06/18/2014EP2743978A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
06/18/2014EP2743317A1 Flexible conductive material
06/18/2014EP2742784A1 Method for manufacturing a component interconnect board
06/18/2014EP2742783A1 High resolution printing
06/18/2014EP2742782A1 Method for manufacturing a led matrix and a device comprising a led matrix
06/18/2014DE102012223077A1 Kontaktanordnung für einen mehrlagigen Schaltungsträger Contact arrangement for a multilayer circuit carrier
06/18/2014DE102012112389A1 Elektrische Baugruppe zur Montage auf einer Hutschiene Electrical assembly for mounting on a DIN rail
06/18/2014CN203661419U 显示装置 The display device
06/18/2014CN203661418U 一种电动车控制器结构 An electric vehicle controller structure
06/18/2014CN203661417U 柔性电路板拼版结构和冲切模具 Imposition flexible circuit board structure and the Die
06/18/2014CN203661416U 薄型化hdi高密度板结构 Hdi thin high-density structure
06/18/2014CN203661415U 软硬电路板结合装置及手机相机模组 Flex circuit board combining device and mobile phone camera module
06/18/2014CN203661414U Pcb拼板 Pcb puzzle
06/18/2014CN203661413U 一种阶梯式印制板 One kind of stepped PCB
06/18/2014CN203661412U 插接手指含拉带的柔性电路板 Plug your fingers to pull the flexible circuit board containing bands
06/18/2014CN203661411U 一种钢片补强片 One kind of steel reinforcing sheet
06/18/2014CN203661410U 电容屏类柔性电路板 Capacitive screen class flexible circuit board
06/18/2014CN203661409U 电源模块用正极氧化膜印刷基板 The power module substrate of the positive electrode oxide film printing
06/18/2014CN203661408U 一种pcb散热焊盘 One kind pcb thermal pad
06/18/2014CN203661407U 一种fr4补强材料接地 One kind fr4 ground reinforcing material
06/18/2014CN203661406U 一种防止喷锡时铜基面上锡的pcb板 A copper-based surfaces to prevent the spray tin tin pcb board
06/18/2014CN203661405U 软性电路板用测试防呆结构 Flexible circuit board test foolproof structure
06/18/2014CN203661404U 高平整阶梯盲槽线路板的压合结构 Laminated structure of the high level of the ladder blind slot board
06/18/2014CN203661403U 新型条状fr产品补强结构 The new strip fr product reinforcing structure
06/18/2014CN203661402U 印刷电路板 A printed circuit board
06/18/2014CN203661401U 一种包括多层扁平导线的led灯电路板 Comprising a multi-layer flat conductor led lamp circuit board
06/18/2014CN203656875U 基于柔性电路的led灯 Based on the flexible circuit led lights
06/18/2014CN103875315A Flexible printed circuit board for electrically contacting and mechanically fixing a lamp in a luminaire
06/18/2014CN103874347A Novel high-intensity high-performance multilayer substrate surface symmetrical structure and manufacturing method
06/18/2014CN103874342A Circuit board assembling method and circuit board
06/18/2014CN103874337A Nonmetal base material metallization method and product
06/18/2014CN103874328A Multilayer circuit board and inner layer core plate thereof
06/18/2014CN103874327A Copper-clad plate and manufacturing method thereof
06/18/2014CN103874326A Printed circuit board and method of manufacturing printed circuit board
06/18/2014CN103874325A Laminate structure, manufacturing method, and light emitting device
06/18/2014CN103874324A Multi-color solder mask layer
06/18/2014CN103874323A Coplane electromagnetic band gap plate based on vertical cascade connection and manufacturing method thereof
06/18/2014CN103874322A Metal wire layout structure on insulation layer and preparation method thereof
06/18/2014CN103874321A Circuit board and manufacturing method thereof
06/18/2014CN103874320A Circuit board and manufacturing method thereof
06/18/2014CN103874319A Current detection circuit layout method
06/18/2014CN103874318A Peripheral circuit structure
06/18/2014CN103872002A Stretchable and foldable electronic devices
06/18/2014CN103871741A 多层陶瓷电容器及用于安装该多层陶瓷电容器的电路板 The multilayer ceramic capacitors and multilayer ceramic capacitors for mounting the circuit board
06/18/2014CN103871740A Multilayer ceramic capacitor and board for mounting the same
06/18/2014CN103871737A Multilayer ceramic capacitor and board for mounting same
06/18/2014CN103871428A Suspension board with circuit
06/18/2014CN103865431A Conducting resin composite material, preparation method of conducting resin composite material and printed circuit board containing conducting resin composite material
06/18/2014CN103865264A Composition for flexible substrate and flexible substrate
06/18/2014CN102822112B Metal base substrate and manufacturing method thereof
06/18/2014CN102782074B Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer
06/18/2014CN102469687B Circuit board
06/18/2014CN102468261B QFN semiconductor package and fabrication method thereof
06/18/2014CN102300909B Prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
06/18/2014CN102300415B Method for preparing uniformly-conductive silver wire used for printed electronics
06/18/2014CN102194778B Display wiring substrate and display apparatus
06/18/2014CN102169247B Liquid crystal panel module and liquid crystal display device using the same
06/18/2014CN101978558B Connector and electrical tracks assembly
06/18/2014CN101672959B Optical transceiver
06/17/2014US8755196 Wiring board and method for manufacturing the same
06/17/2014US8755195 ESD discharge path on chasis-mounted PCB assembly
06/17/2014US8755192 Rack-mounted computer system with shock-absorbing chassis
06/17/2014US8754525 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
06/17/2014US8754338 On-chip interconnects with reduced capacitance and method of afbrication
06/17/2014US8754337 Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package
06/17/2014US8754336 Wiring board and method of producing the same
06/17/2014US8754335 Ceramic electronic component and wiring board
06/17/2014US8754334 Multilayer printed wiring board
06/17/2014US8754333 Printed circuit board incorporating fibers
06/17/2014US8754332 Display device
06/17/2014US8754328 Laminate circuit board with a multi-layer circuit structure
06/17/2014CA2836453A1 System and method for voltage and current sensing
06/12/2014WO2014088358A1 Printed circuit board
06/12/2014WO2014088357A1 Printed circuit board and manufacturing method therefor
06/12/2014WO2014088025A1 Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body
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