Patents for H05K 1 - Printed circuits (98,583) |
---|
06/11/2014 | CN103857172A Transparent printing circuit board |
06/11/2014 | CN103857171A Printed circuit board |
06/11/2014 | CN103857170A Extension PCB |
06/11/2014 | CN103857169A Printed circuit board and electric car |
06/11/2014 | CN103855125A High-heat-conductive patterned circuit baseplate |
06/11/2014 | CN103854858A Multilayered ceramic capacitor and board for mounting the same |
06/11/2014 | CN103854852A Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component therein |
06/11/2014 | CN103854851A Multilayered ceramic capacitor and mounting structure of circuit board having multilayered ceramic capacitor mounted thereon |
06/11/2014 | CN103854850A Multilayered ceramic capacitor and board for mounting the same |
06/11/2014 | CN103854824A Inductor and manufacturing method thereof |
06/11/2014 | CN103854671A Suspension board with circuit |
06/11/2014 | CN103851361A Design method of honeycomb type LED (light emitting diode) lamp panel structure and modular light source module structure |
06/11/2014 | CN103849118A Resin composition for printed circuit board, insulating film, prepreg and printed circuit board |
06/11/2014 | CN103847211A Method for producing metal-clad laminate, and printed wiring board |
06/11/2014 | CN102775731B Glue solution for preparing FR-4 (fiberglass board) copper-clad plate and preparation method |
06/11/2014 | CN102766375B Method for preparing low viscosity ultraviolet (UV) curing solder resist ink |
06/11/2014 | CN102365738B Assembly of optoelectronic components |
06/11/2014 | CN102334391B Multi-layer circuit carrier and method for the production thereof |
06/11/2014 | CN101845216B Curable resin composition, dry membrane and printed circuit board using same |
06/11/2014 | CN101808460B Routing method for PCB and PCB |
06/10/2014 | US8749990 Multiple-board power converter |
06/10/2014 | US8749986 Flexible midplane and architecture for a multi-processor computer system |
06/10/2014 | US8749985 Mounting apparatus |
06/10/2014 | US8749076 Resin paste composition |
06/10/2014 | US8748753 Printed circuit board |
06/10/2014 | US8748752 Member mounting method and member assembly |
06/10/2014 | US8748751 Electronic component package and method for producing electronic component package |
06/10/2014 | US8748750 Printed board assembly interface structures |
06/10/2014 | US8748749 Patterned transparent conductors and related manufacturing methods |
06/10/2014 | US8748513 Epoxy resin composition, and prepreg and printed circuit board using the same |
06/10/2014 | US8747164 Card edge connector |
06/10/2014 | US8745863 Method of manufacturing multi-layer printed circuit board |
06/10/2014 | US8745859 Component built-in module, and manufacturing method for component built-in module |
06/10/2014 | US8745841 Aluminum bonding member and method for producing same |
06/05/2014 | WO2014085558A1 Mechanical spacer with non-spring electrical connections for a multiple printed circuit board assembly |
06/05/2014 | WO2014085156A1 Electrical components and methods of manufacturing electrical components |
06/05/2014 | WO2014084783A1 Modular connector |
06/05/2014 | WO2014084555A1 Epoxy resin composition, and printed circuit board comprising insulation layer using epoxy resin composition |
06/05/2014 | WO2014084385A1 Copper foil with carrier |
06/05/2014 | WO2014084384A1 Carrier-supported copper foil |
06/05/2014 | WO2014084321A1 Copper foil with carrier, process for producing copper foil with carrier, printed wiring board, and printed circuit board |
06/05/2014 | WO2014084318A1 Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package |
06/05/2014 | WO2014084310A1 Amino-modified siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package |
06/05/2014 | WO2014084226A1 Resin composition, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit board |
06/05/2014 | WO2014084020A1 Connecting structure for circuit board |
06/05/2014 | WO2014083959A1 Connection structure for circuit boards |
06/05/2014 | WO2014083952A1 Structure |
06/05/2014 | WO2014082761A1 Electrical connection interface for connecting electrical leads for high speed data transmission |
06/05/2014 | WO2014082386A1 Resin composition and use thereof |
06/05/2014 | US20140154939 Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same |
06/05/2014 | US20140154894 Method and Device for Producing an Electric Contact Sensor Plate |
06/05/2014 | US20140154893 Electrical connector and method of making it |
06/05/2014 | US20140154501 Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
06/05/2014 | US20140154479 Resin composition for printed circuit board, insulating film, prepreg and printed circuit board |
06/05/2014 | US20140154463 Substrate structure and manufacturing method thereof |
06/05/2014 | US20140153210 Advanced device assembly structures and methods |
06/05/2014 | US20140153205 Wiring board and method for manufacturing the same |
06/05/2014 | US20140153204 Electronic component embedded printing circuit board and method for manufacturing the same |
06/05/2014 | US20140153201 Low profile memory module |
06/05/2014 | US20140153200 Printed circuit board |
06/05/2014 | US20140153199 Mounting apparatus for conversion card |
06/05/2014 | US20140153196 Mounting structure of chip component and electronic module using the same |
06/05/2014 | US20140153194 Memory module socket with terminating apparatus |
06/05/2014 | US20140153193 Phase change heat sink for transient thermal management |
06/05/2014 | US20140153189 Electric power converter |
06/05/2014 | US20140153172 Symmetrical hexagonal-based ball grid array pattern |
06/05/2014 | US20140152383 Integrated circuits and systems and methods for producing the same |
06/05/2014 | US20140151876 Semiconductor package and process for fabricating same |
06/05/2014 | US20140151111 Carbon nanostructure-coated fibers of low areal weight and methods for producing the same |
06/05/2014 | US20140151109 Conductive pattern and manufacturing method thereof |
06/05/2014 | US20140151108 Base substrate, mounting structure, module, electronic apparatus, and moving object |
06/05/2014 | US20140151107 Touch member and method of manufacturing the same |
06/05/2014 | US20140151106 Wiring board and method for manufacturing wiring board |
06/05/2014 | US20140151105 Base substrate, resonator, oscillator, sensor, electronic device, electronic apparatus, and moving object |
06/05/2014 | US20140151104 Electronic component embedded substrate and manufacturing method thereof |
06/05/2014 | US20140151103 Laminated chip electronic component, board for mounting the same, and packing unit thereof |
06/05/2014 | US20140151101 Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component therein |
06/05/2014 | US20140151100 Electronic component embedded printed circuit board |
06/05/2014 | US20140151099 Wiring board and laser drilling method thereof |
06/05/2014 | US20140151098 Conductive substrate comprising conductive pattern and touch panel comprising same |
06/05/2014 | US20140151097 Method and Structure to Improve the Conductivity of Narrow Copper Filled Vias |
06/05/2014 | US20140151096 Low temperature/high temperature solder hybrid solder interconnects |
06/05/2014 | US20140151095 Printed circuit board and method for manufacturing the same |
06/05/2014 | US20140151094 Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film |
06/05/2014 | US20140151093 Carrier tape for tab-package and manufacturing method thereof |
06/05/2014 | US20140151092 Pcb with visible circuit and method for making and using pcb with visible circuit |
06/05/2014 | US20140151091 Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same |
06/05/2014 | US20140151090 Stress relief structure |
06/05/2014 | US20140151089 Printed circuit board and method for manufacturing the same |
06/05/2014 | US20140150257 Method of manufacturing a circuit board |
06/05/2014 | DE202014003487U1 Verbindungsanordnung und Schaltanordnung Connector assembly and switching arrangement |
06/05/2014 | DE19955538B4 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht Conductor carrier layer for Einlaminierung in a chip card, process for preparing a conductor carrier layer injection-molding tool for carrying out the method for producing a conductor carrier layer |
06/05/2014 | DE102013224643A1 Systeme und Verfahren zum Einbetten von Bauelementen in Leiterplattenstrukturen Systems and methods for embedding components in PCB structures |
06/04/2014 | EP2739127A2 Printed circuit board, and lighting device and backlight unit including the same |
06/04/2014 | EP2739126A1 Electronic device |
06/04/2014 | EP2739125A1 Electrical connection interface for connecting electrical leads for high speed data transmission |
06/04/2014 | EP2737781A1 Method for assembling microelectronic-chip device in fabric, chip device, and fabric containing a crimped chip device |
06/04/2014 | CN203632967U 一种拼接式大片fpc One kind of tiled large fpc |
06/04/2014 | CN203632966U 一种软性电路板拼接结构 A soft board mosaic structure |
06/04/2014 | CN203632965U 一种电路板及其led灯 A circuit board and led lights |