Patents for H05K 1 - Printed circuits (98,583)
12/2014
12/25/2014US20140376196 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
12/25/2014US20140376195 Methods of forming dual sided coreless package structures with land side capacitor
12/25/2014US20140376194 Signal referencing for memory
12/25/2014US20140376193 Electric component module and method of manufacturing the same
12/25/2014US20140376190 Electronic system with heat extraction and method of manufacture thereof
12/25/2014US20140376189 Interposer, method for manufacturing interposer, and semiconductor device
12/25/2014US20140376156 Graphene mounted on aerogel
12/25/2014US20140375908 Touch pad with flexible substrate
12/25/2014US20140375619 Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus
12/25/2014US20140374897 Thermal interface material for integrated circuit package and method of making the same
12/25/2014US20140374153 Printed circuit board and method for manufacturing same
12/25/2014US20140374152 Circuit board for mounting electronic components
12/25/2014US20140374151 Wire bonding method for flexible substrates
12/25/2014US20140374150 Package substrate and method for manufacturing package substrate
12/25/2014US20140374149 Pad structure and mounted structure
12/25/2014US20140374148 Conductive connection structure for conductive wiring layer of flexible circuit board
12/25/2014US20140374147 Attenuation reduction grounding structure for differential-mode signal transmission lines of flexible circuit board
12/25/2014US20140374146 Metal nanonetwork and method for producing the same, and conductive film and conductive substrate using metal nanonetwork
12/25/2014US20140374145 Hermetically-sealed electrical circuit apparatus
12/25/2014US20140374144 Method for the temporary connection of a product substrate to a carrier substrate
12/25/2014US20140374143 Dry film, layered structure, printed wiring board, and process for producing layered structure
12/25/2014US20140374142 Metal-plated laminated board, and printed wiring board
12/25/2014US20140374141 Fabricating a conductive trace structure and substrate having the structure
12/25/2014US20140374140 Array subatrate, manufacturing method thereof, and flat panel display device
12/24/2014CN204046986U 具有柔性电路板的防水结构 Waterproof flexible circuit board structure
12/24/2014CN204046940U 新型埋入式元器件的封装结构及电路板 New package structure embedded components and circuit boards
12/24/2014CN204046939U 具有电路板的电子单元 A circuit board having electronic unit
12/24/2014CN204046938U 一种pcb板以及压接装置 One kind pcb board and crimping device
12/24/2014CN204046937U 一种带有机导电膜的线路板拼装结构 Circuit board assembly structure of a machine with a conductive film
12/24/2014CN204046936U 模块电源的新型pcb板结构 The new structure of the module power supply pcb board
12/24/2014CN204046935U 一种新型的热风焊盘 A new hot pad
12/24/2014CN204046934U 一种沉厚铜线路板 One kind SHEN copper circuit board
12/24/2014CN204046933U 多层线路板 Multi-layer circuit board
12/24/2014CN204046932U 封装结构 Package
12/24/2014CN204046931U 大功率放大管的安装结构和夹具 Power amplification tube mounting structures and fixtures
12/24/2014CN204046930U 一种连片fpc One kind of contiguous fpc
12/24/2014CN204046929U 一种混合膜集成电路 A hybrid film integrated circuits
12/24/2014CN204046928U 一种高精密压屏fpc A high-precision pressure screen fpc
12/24/2014CN204046927U 一种带使用面积保护孔的fpc A method of using the area to protect the hole with fpc
12/24/2014CN204046926U 一种带高精密打靶孔fpc A tape of high-precision shooting holes fpc
12/24/2014CN204046925U 一种防钻偏定位的fpc An anti-drilling biased positioning fpc
12/24/2014CN204046924U 加固型印制板 Rugged PCB
12/24/2014CN204046923U 散热pcb板 Cooling pcb board
12/24/2014CN204046922U 防护型pcb板 Protection type pcb board
12/24/2014CN204046921U 散热型印制板 Thermally PCB
12/24/2014CN204046920U 紧固型pcb板 Fastening Type pcb board
12/24/2014CN204046919U 一种加强散热的线路板 A way of strengthening the heat of the board
12/24/2014CN204046918U 一体散热式电路板 One radiating-in circuit board
12/24/2014CN204046917U 一种具有抗干扰功能的印刷电路板 A kind of anti-interference function of printed circuit boards
12/24/2014CN204046150U 一种电压监控电路 A voltage-monitoring circuit
12/24/2014CN204045771U 一种线路板与导电端子连接结构 A circuit board connection structure and conductive terminals
12/24/2014CN104247587A 具有pcb和两个外壳部分的电子单元 Pcb and an electronic unit having two housing portions
12/24/2014CN104247583A 多层配线基板及其制造方法以及探针卡 Multilayer wiring board and its manufacturing method, and a probe card
12/24/2014CN104247582A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof
12/24/2014CN104247581A 表面安装基板 Surface mount base
12/24/2014CN104247579A 光伏背板的激光图案化 PV backplane laser patterning
12/24/2014CN104247578A 电路板组件 Circuit board assembly
12/24/2014CN104247577A 结构体 Structure
12/24/2014CN104247576A 2层挠性配线用基板及挠性配线板及其制造方法 2 layer flexible wiring substrate and flexible wiring board and its manufacturing method
12/24/2014CN104247165A 具有低剖面表面安装的印刷电路板插头叶片的小形状因数模块化插头 Small form factor modular plug connector having a printed circuit board mounted blade of the low-profile surface
12/24/2014CN104246973A 用于形成导电图形的基材以及使用所述基材形成的导电图形 Conductive patterns and using a substrate for the substrate to form a conductive pattern formed
12/24/2014CN104246909A 导电浆料、固化物、电极以及电子设备 Conductive paste, cured, an electrode and an electronic device
12/24/2014CN104246687A 具有电气设备的面板 Electrical equipment having a panel
12/24/2014CN104246044A 变压器绝缘纸和其它不导电的变压器组件 Transformer insulating paper and other non-conductive Transformer Components
12/24/2014CN104246015A 电子部件用金属材料、使用其的连接器端子、连接器及电子部件 Metal material for electronic components, using the same connector terminal, the connector and the electronic component
12/24/2014CN104246013A 表面处理铜箔 Surface treated copper foil
12/24/2014CN104245778A 树脂组合物、预浸料以及覆金属箔层叠板 The resin composition, a prepreg and metal-clad laminated board
12/24/2014CN104244669A 电子产品壳体及应用其的电子产品 Electronic products shell and application of its electronic products
12/24/2014CN104244614A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
12/24/2014CN104244608A 一种具有钢质镀金插针组的电路板插接系统 Steel pins having a gold-plated circuit board connector system for group
12/24/2014CN104244603A 部件内置型布线基板的制造方法及半导体装置 Method of manufacturing a component built-in wiring board and semiconductor device
12/24/2014CN104244583A 电路板和具有该电路板的照明装置 And a lighting device having the circuit board of the circuit board
12/24/2014CN104244582A 埋入式高密度互连印刷电路板及其制作方法 Embedded high density interconnect printed circuit board and its production method
12/24/2014CN104244581A 多层电路的高导热装置 High thermal conductivity of a multilayer circuit means
12/24/2014CN104244580A 软性电路板的差模信号传输线抗衰减接地结构 Flexible printed board differential mode attenuation of the signal transmission line anti-ground structure
12/24/2014CN104244579A 封装基板及其制造方法 Package substrate and manufacturing method thereof
12/24/2014CN104244578A 整合式电路板及电子装置 Integrated circuit boards and electronic devices
12/24/2014CN104244577A Pcb独立光学对位点防咬蚀结构 Pcb Optical independent loci anti corrosion structure bite
12/24/2014CN104244576A 一种印刷电路板测试点的布局方法及其印刷电路板 A printed circuit board test points of a printed circuit board layout method and
12/24/2014CN104244575A 一种具有多颜色阻焊层的电路板 Solder resist layer having a multi-color board
12/24/2014CN104244574A Pcb信号布线结构及电子产品接口 Pcb signal wiring structure and electronic products interface
12/24/2014CN104244573A 一种柔性电路板及该柔性线路板回流焊接方法 A flexible circuit board and the flexible circuit board reflow soldering method
12/24/2014CN104244572A Pcb板结构 Pcb board structure
12/24/2014CN104244571A 受到防护的印刷电路板岛 By protection of the printed circuit board island
12/24/2014CN104244570A 刚柔性印刷电路板及其制造方法 Rigid printed circuit board and its manufacturing method
12/24/2014CN104244569A 软性电路板高频信号传输线的抗衰减控制结构 Flexible printed circuit board anti-high-frequency signal transmission line attenuation control structure
12/24/2014CN104244568A 软性电路板的导电线路层导接结构 Conductive trace layer conductive connection structure of the flexible printed circuit board
12/24/2014CN104244567A 一种多层电路板制作方法及多层电路板 A multi-layer circuit board production methods and multi-layer circuit board
12/24/2014CN104244566A 一种镍钯合金镀层线路板和生产方法 A nickel-palladium alloy plated circuit boards and production methods
12/24/2014CN104244565A 用于印刷电路板中的增层材及其制法、可内埋元件的印刷电路板 Jiqizhifa by layer material for printed circuit boards can be buried in the printed circuit board components
12/24/2014CN104244564A 立体电路及其制作方法 Three-dimensional circuit and method of making
12/24/2014CN104244563A 电路板结构及其制作方法 Board structure and production methods
12/24/2014CN104241997A 射频连接器及使用该连接器的印制板部件 RF connectors and use the connector PCB components
12/24/2014CN104240950A 多层陶瓷电容器和安装有该多层陶瓷电容器的板 Multilayer ceramic capacitors and multilayer ceramic capacitor is mounted in the plate
12/24/2014CN104240946A 多层陶瓷电容器及安装有该多层陶瓷电容器的板 Multilayer ceramic capacitors and multilayer ceramic capacitor is mounted in the plate
12/24/2014CN104240897A 感应器和包括该感应器的电子器件 Sensors and the sensor comprises an electronic device
12/24/2014CN104235663A 一种led软灯条的生产工艺 One kind of led strip light of the production process
12/24/2014CN104231970A 各向异性导电糊及使用其的印刷布线基板 The anisotropic conductive paste and using the same printed wiring board
12/24/2014CN104231897A 线路板涂层剂 PCB coating agent
12/24/2014CN104231625A 软性基板用组合物及其所形成的软性基板 Flexible substrate and the flexible substrate composition formed by
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