Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
Patents for H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
02/2014
02/27/2014US20140054580 Array substrate and manufacturing method thereof
02/27/2014US20140054579 Thin film transistor substrate and method of manufacturing the same
02/27/2014US20140054551 Gate tunable tunnel diode
02/27/2014US20140054550 Method for n-doping graphene
02/27/2014US20140054549 Gated circuit structure with ultra-thin, epitaxially-grown tunnel and channel layer
02/27/2014US20140054548 Techniques for forming non-planar germanium quantum well devices
02/27/2014US20140054547 Device with strained layer for quantum well confinement and method for manufacturing thereof
02/27/2014US20140054546 Dynamic Random Access Memory Unit And Method For Fabricating The Same
02/27/2014US20140054540 Device including semiconductor nanocrystals & method
02/27/2014US20140054532 Access device, fabrication method thereof, and semiconductor memory device having the same
02/27/2014US20140053894 GRADED GeSn ON SILICON
02/27/2014DE112012002481T5 Siliciumcarbid-Halbleitervorrichtung und Verfahren zum Herstellen einer Siliciumcarbid-Halbleitervorrichtung Silicon carbide semiconductor device and method of manufacturing a silicon carbide semiconductor device
02/27/2014DE102013216171A1 Abbildungsvorrichtung und Verfahren zu deren Betrieb Imaging device and method for its operation
02/27/2014DE102012111822A1 Vorrichtung und Verfahren für Multi-Gate-Transistoren Apparatus and method for multi-gate transistors,
02/27/2014DE102005024630B4 Halbleitersensor für eine dynamische Größe mit Selbstdiagnosefunktion Semiconductor sensor dynamic quantity with self-diagnostic function
02/26/2014EP2701205A1 Method of manufacturing quantum dot device, quantum dot device manufactured by using the method, and method of measuring electron mobility of quantum dot device
02/26/2014EP2701203A1 Gate driving circuit and display apparatus having the same
02/26/2014EP2701202A2 High breakdown voltage semiconductor device with an insulated gate formed in a trench, and manufacturing process thereof
02/26/2014EP2701201A1 Semiconductor device and method for producing same
02/26/2014EP2701200A2 Compound semiconductor device and manufacturing method of the same
02/26/2014EP2701199A2 Nitride semiconductor and fabricating method thereof
02/26/2014EP2701198A2 Device with strained layer for quantum well confinement and method for manufacturing thereof
02/26/2014EP2701197A1 Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
02/26/2014EP2701196A2 Semiconductor Device with an Inclined Source/Drain and Associated Methods
02/26/2014EP2701184A1 COMPOUND GaN SUBSTRATE AND METHOD FOR PRODUCING SAME, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
02/26/2014EP2701182A2 Semiconductor laminate, semiconductor device, method for producing semiconductor laminate, and method for manufacturing semiconductor device
02/26/2014EP2700093A1 A starting substrate for semiconductor engineering having substrate-through connections and a method for making same
02/26/2014EP2700089A2 Select devices
02/26/2014CN203456473U High-power diode package chip
02/26/2014CN203456472U Thin film transistor and display apparatus
02/26/2014CN203456471U Thin-film transistor, array substrate and display device
02/26/2014CN203456470U Super junction MOSFET device
02/26/2014CN203456469U Thyristor chip
02/26/2014CN203456468U 绝缘栅双极型晶体管 Insulated gate bipolar transistors
02/26/2014CN203456467U Barrier layer, thin film transistor, and array substrate
02/26/2014CN203455566U Thin film transistor array substrate and liquid crystal display device
02/26/2014CN203455564U Array substrate and display device
02/26/2014CN103608925A Methods of manufacturing thin film transistor devices
02/26/2014CN103608924A Oxide-type semiconductor material and sputtering target
02/26/2014CN103608923A Current aperture vertical electron transistors
02/26/2014CN103608906A Method for producing amorphous oxide thin film and thin film transistor
02/26/2014CN103608905A Method for manufacturing semiconductor device
02/26/2014CN103608896A Method for producing semiconductor device
02/26/2014CN103608310A Electrically conductive oxide and method for producing same, and oxide semiconductor film
02/26/2014CN103606566A Trench Schottky diode structure and manufacturing method thereof
02/26/2014CN103606565A Technology for manufacturing sensitive element of pressure sensor
02/26/2014CN103606564A Electrical programming-ultraviolet light erasing memory device structure and preparation method thereof
02/26/2014CN103606563A Junctionless tunneling field effect transistor and formation method thereof
02/26/2014CN103606562A Buried N-type layer partial silicon-on-insulator LDMOS transistor
02/26/2014CN103606561A 功率mos管及其制造方法 Power mos tube and its manufacturing method
02/26/2014CN103606560A Microwave integrated circuit and exchange circuit-used micro crack influence-reduced high-charge mobility transistor
02/26/2014CN103606559A Method for manufacturing semiconductor device
02/26/2014CN103606558A A bipolarity film transistor
02/26/2014CN103606557A Collector-electrode short-circuit IGBT structure integrating diode
02/26/2014CN103606556A 半导体装置 Semiconductor device
02/26/2014CN103606555A Pnp晶体管 Pnp Transistor
02/26/2014CN103606554A A bipolar transistor which raises a BVceo and a production technique thereof
02/26/2014CN103606553A Transistor having circular collector region
02/26/2014CN103606552A Npn晶体管 Npn Transistor
02/26/2014CN103606551A Silicon carbide channel-type semiconductor device and manufacturing method thereof
02/26/2014CN103606548A Zener breakdown high-voltage ESD (Electronic Static Discharge) protective device with small-hysteresis SCR (Selective Catalytic Reduction) structure
02/26/2014CN103606544A Electrostatic discharge resistant LDMOS device
02/26/2014CN103606524A 一种mosfet结构及其制造方法 One kind of structure and manufacturing method mosfet
02/26/2014CN102543727B Silicon-germanium heterojunction bipolar transistor (SiGe HBT) structure, pseudo buried layer structure and manufacturing method for SiGe HBT
02/26/2014CN102487077B Vertical parasitic PNP device in BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor) process and preparation method thereof
02/26/2014CN102456719B Device capable of improving reverse breakdown voltage of PN (positive and negative) junction
02/26/2014CN102412296B Super junction semiconductor device structure and manufacturing method thereof
02/26/2014CN102412274B Vertically parasitic PNP device in germanium-silicon HBT (heterojunction bipolar transistor) process and fabrication method thereof
02/26/2014CN102403364B Thin film transistor for display panel and method for making the same
02/26/2014CN102403256B Buried layer and manufacturing method, long hole contact and triode
02/26/2014CN102376758B Insulated gate bipolar transistor, manufacturing method thereof and trench gate structure manufacturing method
02/26/2014CN102263061B Self-aligned multiple gate transistor formed on bulk substrate and manufacture method thereof
02/26/2014CN102263035B Method for forming oxide thin film transistor (OTFT)
02/26/2014CN102254826B Bi-grid oxide groove mosfet and three or four mask process with passage stop groove
02/26/2014CN102237461B Light emitting device, light emitting device package and lighting system
02/26/2014CN102214585B Method of forming gate in metal-oxide semiconductor field-effect transistor
02/26/2014CN102194700B Manufacturing method of super-junction semiconductor device
02/26/2014CN101849289B Methods and devices for fabricating tri-layer beams
02/26/2014CN101740612B Contact structure for semiconductor device having trench shield electrode and method
02/26/2014CN101653828B Silver nanoparticles and process for producing same
02/25/2014US8659532 Semiconductor device
02/25/2014US8659516 Display device
02/25/2014US8659512 Organic light emitting diode display and method for manufacturing the same
02/25/2014US8659174 Semiconductor device
02/25/2014US8659173 Isolated wire structures with reduced stress, methods of manufacturing and design structures
02/25/2014US8659172 Semiconductor device and method of confining conductive bump material with solder mask patch
02/25/2014US8659170 Semiconductor device having conductive pads and a method of manufacturing the same
02/25/2014US8659169 Corner structure for IC die
02/25/2014US8659167 Sensor packaging method and sensor packages
02/25/2014US8659163 Semiconductor device having through electrode and method of fabricating the same
02/25/2014US8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
02/25/2014US8659159 Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same
02/25/2014US8659158 Thermally inkjettable acrylic dielectric ink formulation and process
02/25/2014US8659143 Stub minimization for wirebond assemblies without windows
02/25/2014US8659142 Stub minimization for wirebond assemblies without windows
02/25/2014US8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
02/25/2014US8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659133 Etched surface mount islands in a leadframe package
02/25/2014US8659124 Physical structure for use in a physical unclonable function
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