Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/30/2012CN102484138A 布线层、半导体装置、液晶显示装置 A wiring layer, a semiconductor device, a liquid crystal display device
05/30/2012CN102484137A Semiconductor device, liquid crystal display device equipped with semiconductor device, and process for production of semiconductor device
05/30/2012CN102484136A Semiconductor device, active matrix substrate, and display device
05/30/2012CN102484135A Thin-film transistor and method for manufacturing the thin-film transistor
05/30/2012CN102484134A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/30/2012CN102484126A 碳化硅绝缘栅型半导体器件及其制造方法 SiC insulated gate type semiconductor device and its manufacturing method
05/30/2012CN102484125A Light emitting devices with embedded void-gap structures through bonding of structured materials on active devices
05/30/2012CN102484124A 氮化物半导体装置 The nitride semiconductor device
05/30/2012CN102484114A Nonvolatile semiconductor memory device and method for fabricating same
05/30/2012CN102484111A 制造磁性随机存取存储器的系统和方法 Manufacturing of the magnetic random access memory systems and methods
05/30/2012CN102484106A Method for producing an integrated circuit and resulting foil chip
05/30/2012CN102484102A Electronic device and method for manufacturing electronic device
05/30/2012CN102484100A Method for chip to wafer bonding
05/30/2012CN102484099A Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
05/30/2012CN102484098A Semiconductor device, and method for supplying electric power to same
05/30/2012CN102484097A Semiconductor-on-insulator with back side support layer
05/30/2012CN102484096A 使用离子束在过孔内的选择性纳米管生长 Ion beam through holes in the selective growth of nanotubes
05/30/2012CN102484095A Vias and conductive routing layers in semiconductor substrates
05/30/2012CN102484094A 绝缘体上的半导体和使用阳极连接工艺中的温度梯度来形成该半导体的方法 Connected to the anode of the semiconductor and the use of the process of the temperature gradient on the insulator to form the semiconductor Method
05/30/2012CN102484093A 使用三重植入通过裂开分离硅薄膜的方法 By using the method of cleaving triple implanted silicon thin film separation
05/30/2012CN102484092A 用以容纳基材的装置及其制造方法 Apparatus for receiving a substrate and a manufacturing method
05/30/2012CN102484091A 用于工具的缓冲存储和运输装置 Buffer means for storing and transporting tools
05/30/2012CN102484090A 基板处理设备 The substrate processing apparatus
05/30/2012CN102484089A 平板精密悬浮系统 Tablet sophisticated suspension system
05/30/2012CN102484088A 卡匣 Cassettes
05/30/2012CN102484087A 部件移送装置及方法 Component transfer device and method
05/30/2012CN102484086A 基于等离子体信号与基板位置和电位相耦合来优化等离子体释放的方法和设备 Based on the location of the plasma and the substrate potential of the signal is coupled to a method and apparatus to optimize the release of plasma
05/30/2012CN102484085A 利用光学吸收边波长测量薄膜的温度 Using optical absorption edge wavelength measurement temperature film
05/30/2012CN102484084A Scanner Performance Comparison And Matching Using Design And Defect Data
05/30/2012CN102484083A Semiconductor device and production method therefor
05/30/2012CN102484082A 用于焊料凸块模具填充的真空转移 Vacuum Transfer for mold filling solder bumps
05/30/2012CN102484081A Methods and structures for a vertical pillar interconnect
05/30/2012CN102484080A Semiconductor device
05/30/2012CN102484079A Encapsulation process and structure for electronic devices
05/30/2012CN102484077A Field effect transistor, semiconductor substrate, method for manufacturing field effect transistor, and method for producing semiconductor substrate
05/30/2012CN102484076A Iii族氮化物半导体层积晶圆及iii族氮化物半导体设备 Iii nitride semiconductor wafer, and iii stacking nitride semiconductor device
05/30/2012CN102484075A 半导体器件及制造半导体器件的方法 Semiconductor device and manufacturing method of a semiconductor device
05/30/2012CN102484074A 结晶硅膜的形成方法、使用了该结晶硅膜的薄膜晶体管以及显示装置 The method for forming a crystalline silicon film, a thin film transistor using the crystalline silicon film, and a display device
05/30/2012CN102484073A 半导体装置的制造方法以及半导体装置 The method of manufacturing a semiconductor device and a semiconductor device
05/30/2012CN102484072A Current-amplifying transistor device and current-amplifying, light-emitting transistor device
05/30/2012CN102484071A 半导体基板热处理装置 Semiconductor substrate heat treatment device
05/30/2012CN102484070A 用于铝-硅氮化物的化学气相沉积处理 For an aluminum - silicon nitride chemical vapor deposition process thereof
05/30/2012CN102484069A Semiconductor device and process for production thereof
05/30/2012CN102484068A 制造硅质膜的方法和用于该方法的聚硅氮烷膜处理液 The method of producing a siliceous film and the polysilazane film is used in the process of treating liquid
05/30/2012CN102484067A 包括铝-硅氮化物钝化的用于形成iii-v半导体结构的方法 Including aluminum - silicon nitride passivation method for forming a semiconductor structure iii-v
05/30/2012CN102484066A 干式蚀刻法 Dry etching method
05/30/2012CN102484065A 基板处理装置的运行方法 Method of operating a substrate processing apparatus
05/30/2012CN102484064A 倾斜刻蚀应用中提高流体运送的装置和方法 Tilt etching apparatus and method for improving the application of fluid delivery
05/30/2012CN102484063A 射频(rf)接地返回装置 Radio frequency (rf) ground return means
05/30/2012CN102484062A 测量晶片偏压的方法与装置 Bias measurement method and apparatus for wafer
05/30/2012CN102484061A Reduced isotropic etchant material consumption and waste generation
05/30/2012CN102484060A Method for etching of silicon surfaces
05/30/2012CN102484059A Polishing agent, method for producing compound semiconductor, and method for manufacturing semiconductor device
05/30/2012CN102484058A Cmp抛光垫及其制造方法 Cmp polishing pad and its manufacturing method
05/30/2012CN102484057A Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
05/30/2012CN102484056A 用于抑制金属微细结构体的图案倒塌的处理液和使用其的金属微细结构体的制造方法 Patterning the metal for inhibiting collapse of the fine structure of the treatment liquid and the manufacturing method thereof using a fine metal structure
05/30/2012CN102484055A 晶片干燥装置以及利用该装置的晶片干燥方法 Wafer using a wafer drying device and drying method of the apparatus
05/30/2012CN102484054A 耐腐蚀性cmp修整工件及其制造和使用方法 Corrosion cmp trim piece and its manufacturing and use
05/30/2012CN102484053A Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning
05/30/2012CN102484052A 基于纳米结构的nand闪存单元及其外围电路的形成方法 Nand flash memory cell is formed and its peripheral circuits nanostructure-based approach
05/30/2012CN102484051A 光致电压器件结构和方法 The photovoltaic device structure and method
05/30/2012CN102484050A 用于区分硅基板上的一组高掺杂区域与一组轻掺杂区域的方法 A set of high-doped regions of the silicon substrate and to distinguish a group of lightly doped regions of the method for
05/30/2012CN102484049A 半导体元件用外延基板、半导体元件用外延基板的制造方法以及半导体元件 The method of manufacturing an epitaxial substrate for semiconductor device, a semiconductor element and a semiconductor epitaxial substrate elements
05/30/2012CN102484048A Aluminum porous media
05/30/2012CN102484047A Semipolar nitride-based devices on partially or fully relaxed alloys with misfit dislocations at the heterointerface
05/30/2012CN102484046A 支承装置以及曝光装置 Supporting apparatus and exposure apparatus
05/30/2012CN102484045A Plasma light source system
05/30/2012CN102484044A Process for production of silicon carbide substrate, process for production of semiconductor device, silicon carbide substrate, and semiconductor device
05/30/2012CN102484043A 控制限制环位置的直接驱动装置及其方法 Ring position of the control limits direct drive apparatus and method
05/30/2012CN102484042A 生产半导体晶片的方法 Method for producing a semiconductor wafer
05/30/2012CN102484041A 高温计 Pyrometer
05/30/2012CN102484040A 用于制造半导体薄片的装置和利用分子束通过蒸发来沉积材料的装置 Manufacturing a semiconductor device and a sheet by using a molecular beam evaporation apparatus for depositing material
05/30/2012CN102483930A 多维微结构的制造技术 Manufacturing technology of multi-dimensional microstructures
05/30/2012CN102483590A 用于形成铜基配线的光刻胶剥离剂组合物 For forming a copper-based wiring photoresist stripper composition
05/30/2012CN102483587A 曝光装置用光照射装置、光照射装置的控制方法、曝光装置以及曝光方法 The exposure apparatus irradiating apparatus, a control method of the light irradiation apparatus, exposure apparatus and exposure method
05/30/2012CN102483585A 光谱纯度滤光片、光刻设备、和制造光谱纯度滤光片的方法 The spectral purity filters, lithographic apparatus and a method for manufacturing a spectral purity filter
05/30/2012CN102483580A 物体处理装置、曝光装置及曝光方法、以及元件制造方法 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
05/30/2012CN102483579A Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
05/30/2012CN102483578A 物体处理装置、曝光装置及曝光方法、以及元件制造方法 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
05/30/2012CN102483574A Radiation-sensitive resin composition and compound
05/30/2012CN102483569A Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition
05/30/2012CN102483568A Manufacturing method of half tone mask
05/30/2012CN102483549A Liquid crystal display device and method for manufacturing liquid crystal display device
05/30/2012CN102483438A 基板检查装置以及基板检查装置中的对位方法 Substrate inspection device and substrate inspection apparatus for positioning method
05/30/2012CN102483437A 测试设备与相关方法 Test Equipment and Related Methods
05/30/2012CN102483378A Separation Of Doping Density And Minority Carrier Lifetime In Photoluminescence Measurements On Semiconductor Materials
05/30/2012CN102482797A 半导体基板、半导体基板的制造方法、半导体生长用基板、半导体生长用基板的制造方法、半导体元件、发光元件、显示面板、电子元件、太阳能电池元件及电子设备 The method of manufacturing a semiconductor substrate, a semiconductor substrate, the semiconductor growth substrate for growth, a method of manufacturing a semiconductor substrate, a semiconductor element, a light emitting element, a display panel, electronic components, solar cell element and an electronic device
05/30/2012CN102482788A System For Converting Energy With An Enhanced Electric Field
05/30/2012CN102482779A Stress-reduced ni-p/pd stacks for bondable wafer surfaces
05/30/2012CN102482777A Method for forming metal oxide film, metal oxide film and apparatus for forming metal oxide film
05/30/2012CN102482771A Titanium-containing precursors for vapor deposition
05/30/2012CN102482758A 基板处理方法 The substrate processing method
05/30/2012CN102482613A 硅锭切片用水溶性切削液 Silicon ingot slicing with a water-soluble cutting fluid
05/30/2012CN102482555A Cmp compositions and methods for suppressing polysilicon removal rates
05/30/2012CN102482533A Photo-patternable dielectric materials and formulations and methods of use
05/30/2012CN102482507A 近红外吸收膜组合物 Near infrared absorbing film composition
05/30/2012CN102482240A Novel compound, process for preparation thereof, radiation -sensitive compositions containing the novel compound, and cured films
05/30/2012CN102482156A Sintered in-ga-zn-o-type oxide
05/30/2012CN102482114A 混合金属氧化物 Mixed metal oxides
05/30/2012CN102482072A 具有应力隔离的mems器件及其制造方法 Mems device and its manufacturing method having a stress isolation
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