Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2012
05/30/2012EP2456589A1 Lead free high temperature compound
05/30/2012EP2173645B1 Arrangement for the contactless transport of flat substrates
05/30/2012EP2139026B1 Reflective mask blank for euv lithography
05/30/2012EP2122631B1 High speed otp sensing scheme
05/30/2012EP2102900B1 Self-constrained anisotropic germanium nanostructure from electroplating
05/30/2012EP1981685B1 Double side wafer grinder and methods for assessing workpiece nanotopology
05/30/2012EP1846944B1 Electromagnetic switch device in particular a contactor
05/30/2012EP1843972B1 Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers
05/30/2012EP1759411B1 Method for transferring plates
05/30/2012EP1637624B1 Thin film forming apparatus
05/30/2012EP1548817B1 Method of eliminating boron contamination of annealed wafer
05/30/2012EP1488452B1 A method for making nanoscale wires and gaps for switches and transistors
05/30/2012EP1466364B1 Panel for electronic components and method for the production thereof
05/30/2012EP1456891B1 Imaging device in a projection exposure facility
05/30/2012EP1409156B1 Method of fabricating conductive nanotube articles
05/30/2012EP1192506B1 Photoresist removal process using forming gas plasma
05/30/2012EP1186009B1 Method for removal of sic
05/30/2012EP1137061B1 Operating method and device
05/30/2012DE202012001810U1 Vorrichtung zum Verarbeiten von Substraten An apparatus for processing substrates
05/30/2012CN202259394U Vacuum sucking disk
05/30/2012CN202259387U Cushion plate of clamp for etching silicon wafer
05/30/2012CN202259385U Mesh belt structure and solar battery sheet production device composed of same
05/30/2012CN202259230U Retaining block of support plate for flat plate type film-forming device
05/30/2012CN202259229U Lead wire framework transmission clamp
05/30/2012CN202259228U Lead frame grabbing structure
05/30/2012CN202259227U Arranging device for lead frames
05/30/2012CN202259226U Transmission device
05/30/2012CN202259225U Mechanical arm for delivery of substrate
05/30/2012CN202259224U Feeding device of lead frame
05/30/2012CN202259223U Mechanical arm for transmitting silicon chip
05/30/2012CN202259222U Crystal boat and furnace tube
05/30/2012CN202259221U Round quartz boat
05/30/2012CN202259220U Graphite positioning column
05/30/2012CN202259219U Liquid crystal sheet load bearing support capable of being adjusted accurately
05/30/2012CN202259218U Integrated silicon wafer bearing box
05/30/2012CN202259217U Demonstrating and washing integrated disc
05/30/2012CN202259216U Polishing etching frame
05/30/2012CN202259215U Device for heating single crystal support
05/30/2012CN202259214U Shield mechanism
05/30/2012CN202259213U Corrosion carrier suitable for wafers of different sizes
05/30/2012CN202259212U Quartz flange
05/30/2012CN202259211U Semiconductor product inspection bench
05/30/2012CN202259210U Silicon block measurement bearing device and silicon block measuring system
05/30/2012CN202259209U Detecting device for crystalline silicon cell slice
05/30/2012CN202259208U Device for detecting electric leakage position of solar cell panel
05/30/2012CN202259207U Detector used for detecting back contact solar cell
05/30/2012CN202259206U Silicon wafer sorting test bench
05/30/2012CN202259205U Gold ball bonding capillary chopper
05/30/2012CN202259204U Packaging die capable of simultaneously packaging a plurality of chip structures
05/30/2012CN202259203U Novel die structure for lead frame joint filling operation
05/30/2012CN202259202U Tool for manufacturing lead wire framework
05/30/2012CN202259201U Thrust device of integrated circuit lead frame before preheating
05/30/2012CN202259200U Chip lead adjusting device
05/30/2012CN202259199U Porcelain plate for manufacturing semiconductor devices
05/30/2012CN202259198U Deburring device for lead frame
05/30/2012CN202259197U Slice arranging device for lead frame
05/30/2012CN202259196U Removing device for silicon wafer edge oxidation films within various ranges
05/30/2012CN202259195U Device for performing dry etching on hard inorganic material substrate
05/30/2012CN202259194U Device capable of improving texture surface of polycrystalline silicon trough-type acid texture
05/30/2012CN202259193U Texturing machine
05/30/2012CN202259192U Semiconductor chip gold-plating bubbling device
05/30/2012CN202259191U Film plating machine
05/30/2012CN202259190U Chip bonding device for naked copper lead wire framework
05/30/2012CN202258597U Through hole-free thin film resistor with dielectric cap layer
05/30/2012CN202256956U Silicon based liquid crystal screen laminating machine structure
05/30/2012CN202247021U Wet-method rotary corrosion device for silicon wafer
05/30/2012CN202245328U Device for circularly taking out box-packed silicon wafers
05/30/2012CN202245325U Substrate carrying manipulator equipment
05/30/2012CN202241462U Double-row super tiny chip stacking die
05/30/2012CN202240278U Welding wire location device for power semiconductor
05/30/2012CN202239303U Cooling cabinet structure
05/30/2012CN202239174U Device for cutting off connection rib between outer pins of lead frame
05/30/2012CN202239161U Blanking guide rail structure
05/30/2012CN202238829U Cleaning basket
05/30/2012CN202238756U Wet-process cleaning equipment
05/30/2012CN1988179B Non-volatile floating gate memory cells with polysilicon storage unit and fabrication methods thereof
05/30/2012CN1981344B Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
05/30/2012CN1947067B Rinse solution for lithography
05/30/2012CN1929107B Movable transfer chamber and substrate-treating apparatus including the same
05/30/2012CN1928721B Moving phase grating mark and method for utilizing same in detecting image forming quality of photoetching machine
05/30/2012CN1878670B Hot pressing ceramic distortion control
05/30/2012CN1865375B Adhesive sheet for cutting and cutting method using the adhesive sheet
05/30/2012CN1858911B Tft array panel, liquid crystal display including same, and method of manufacturing tft array panel
05/30/2012CN1808708B Method of forming a low capacitance semiconductor device and structure therefor
05/30/2012CN1750252B Guard ring for improved matching
05/30/2012CN1574079B Memory unit and semiconductor device
05/30/2012CN1555559B Selective operation of a multi-state non-volatile memory system in a binary mode
05/30/2012CN1542929B Process for fabricating Semiconductor device
05/30/2012CN1541037B White balance improved flat panel disply
05/30/2012CN1279515B Method for manufacturing photoelectric device
05/30/2012CN102484940A 局部等离子体约束和压强控制装置及其方法 Local plasma constraints and pressure control device and method
05/30/2012CN102484939A 等离子体处理装置和基板处理方法 The substrate processing apparatus and plasma processing method
05/30/2012CN102484938A 等离子体光源 The plasma source
05/30/2012CN102484188A Led Equipment Purpose Wafer, Method For Manufacturing Same, And Led-equipped Structure Using Led Equipment Purpose Wafer
05/30/2012CN102484180A Gallium nitride compound semiconductor light-emitting element
05/30/2012CN102484178A 具有曲率控制层的iii族氮化物发光装置 Iii nitride light-emitting device having a curvature control layer
05/30/2012CN102484167A Masked ion implant with fast-slow scan
05/30/2012CN102484141A Photo-crosslinkable material for organic thin film transistor insulating layer
05/30/2012CN102484140A Manufacturing method of semiconductor device
05/30/2012CN102484139A 氧化物半导体层及半导体装置 The oxide semiconductor layer, and a semiconductor device