Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/12/2012CN102820320A Silicon-on-semiinsulator semiconductor device and method for manufacturing same
12/12/2012CN102820319A Oxide thin film transistor and method of fabricating the same
12/12/2012CN102820307A Double poly-crystal plane strain BiCMOS integrated device based on SOI (Silicon On Insulator) substrate and preparation method
12/12/2012CN102820306A Tri-polycrystal strain SiGe BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method
12/12/2012CN102820305A Mixed-crystal-face strain-Si vertical-channel CMOS (complementary metal oxide semiconductor) integrated device and preparation method
12/12/2012CN102820304A Multibit non-volatile memory and operating method and forming method thereof
12/12/2012CN102820300A Dynamic random access memory and manufacturing method thereof
12/12/2012CN102820298A IC (integrated circuit) comprising multiple MOS (metal oxide semiconductor) tubes, and photoetching method and preparation method for aluminum line of IC
12/12/2012CN102820297A Strain SiGe vertical return type channel BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method
12/12/2012CN102820296A Double poly-crystal SOI (Silicon On Insulator) BiCMOS integrated device based on crystal plane selection and preparation method
12/12/2012CN102820295A Double-strain plane BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor Transistor) integrated device and preparation method
12/12/2012CN102820294A Integration of superjunction MOSFET and diode
12/12/2012CN102820291A Back panel for flat panel display apparatus, flat panel display apparatus comprising the same, and method of manufacturing the back panel
12/12/2012CN102820290A Connector Design for Packaging Integrated Circuits
12/12/2012CN102820288A 功率模块及其制造方法 And a method of manufacturing a power module
12/12/2012CN102820282A 3D integration microelectronic assembly for integrated circuit devices and method of making same
12/12/2012CN102820281A 3D integration microelectronic assembly for integrated circuit devices and method of making same
12/12/2012CN102820280A Non-hierarchical metal layers for integrated circuits
12/12/2012CN102820279A Vertically mutual crossing semiconductor capacitor
12/12/2012CN102820276A QFN package and manufacturing process thereof
12/12/2012CN102820274A 3D Integrated Microelectronic Assembly With Stress Reducing Interconnects And Method Of Making Same
12/12/2012CN102820272A Packaging structure embedded with electronic elements and method of fabricating the same
12/12/2012CN102820270A Package substrate and fabrication method thereof
12/12/2012CN102820269A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/12/2012CN102820268A Bonding structure and preparation method thereof
12/12/2012CN102820266A Stress allocating method of front metal dielectric layer
12/12/2012CN102820265A Performance enhancement in transistors by reducing the recessing of active regions and removing spacers
12/12/2012CN102820264A Chip package structure and manufacturing method thereof
12/12/2012CN102820263A Method for manufacturing semiconductor device
12/12/2012CN102820262A Glass through hole manufacturing and interconnecting method
12/12/2012CN102820261A Aluminum etching method
12/12/2012CN102820260A Method for improving via hole pattern performance expression
12/12/2012CN102820259A Semiconductor device and method of forming a power MOSFET
12/12/2012CN102820258A Method for copper dual damascene structure having ultralow dielectric constant layer
12/12/2012CN102820257A Through silicon via structure and method
12/12/2012CN102820256A Method for preparing inter-metal dielectric layer
12/12/2012CN102820255A Method for physics vapor deposition (PVD) film
12/12/2012CN102820254A Method for manufacturing semiconductor integrated circuit
12/12/2012CN102820253A Preparation method of high mobility ratio double channel material based on silicon-on-insulator (SOI) substrate
12/12/2012CN102820252A Preparation method of high mobility ratio double channel material based on bonding process
12/12/2012CN102820251A Method for preparing SOI (silicon on insulator) material with high-K dielectric buried layer on basis of bonding technology
12/12/2012CN102820250A Sectional pin for semiconductor coating equipment
12/12/2012CN102820249A Substrate frame suction apparatus and control method for the same
12/12/2012CN102820248A Feeding system of die bonder
12/12/2012CN102820247A Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus
12/12/2012CN102820246A Component shifting device with floating guiding centralizing mechanism
12/12/2012CN102820245A Thin-film process system with wafer storage groove and wafer accessing method thereof
12/12/2012CN102820244A Automatic cracking device and automatic cracking method of battery piece
12/12/2012CN102820243A Semiconductor wafer production device
12/12/2012CN102820242A Online chip cleaning and drying equipment
12/12/2012CN102820241A Method for testing reliability of time-dependent dielectric breakdown of oxide medium layer
12/12/2012CN102820240A Chip-on-glass (COG) interconnection resistance prediction method based on machine vision
12/12/2012CN102820239A Detection method for predetermined lines of division
12/12/2012CN102820238A High accuracy beam placement for local area navigation
12/12/2012CN102820237A Method for measuring thickness of metal in semiconductor device
12/12/2012CN102820236A Lead bonding method for lead frame plastically packaged in advance
12/12/2012CN102820235A Packaging device for coating glass on surface of chip component
12/12/2012CN102820234A Method of sealing and molding an optical device with resin
12/12/2012CN102820233A Surface-mounted power diode packaging technology
12/12/2012CN102820232A Ceramic package and product encapsulation integrated machine
12/12/2012CN102820231A Annular island plating device of integrated chip lead frame
12/12/2012CN102820230A Fin-last replacement metal gate FinFET
12/12/2012CN102820229A Semiconductor device having gradient doping profile
12/12/2012CN102820228A Preparation method of semiconductor device
12/12/2012CN102820227A Method for forming deep-groove super PN junction
12/12/2012CN102820226A Manufacturing method of multilayer metal-silicon oxide-metal capacitor
12/12/2012CN102820225A Manufacturing method for high-pressure quick soft recovery diode with diffusing buffer layer
12/12/2012CN102820224A Interface layer treatment method for TFT (thin film transistor) dry etching process
12/12/2012CN102820223A Chemical-mechanical polishing method for simultaneously polishing phase-change material and tungsten
12/12/2012CN102820222A Film forming method
12/12/2012CN102820221A Formation method of low-temperature silicon dioxide film
12/12/2012CN102820220A Forming method of low-temperature silica film
12/12/2012CN102820219A Forming method of low-temperature silica film
12/12/2012CN102820218A Thinning method of wafer
12/12/2012CN102820217A Processing device
12/12/2012CN102820216A Method for manufacturing semiconductor device
12/12/2012CN102820215A Method for manufacturing grid electrode
12/12/2012CN102820214A Semiconductor process
12/12/2012CN102820213A Method for growing single crystal GaN nanometer pipes by utilizing InN nanometer rods as nucleation layers
12/12/2012CN102820212A Formation method of deep groove super positive-negative (PN) junction
12/12/2012CN102820211A Non-polar A-plane GaN film preparation method
12/12/2012CN102820210A Method for cleaning chemically and mechanically polished silicon wafer
12/12/2012CN102820209A Preparation method of on-insulator material of high k dielectric buried layer
12/12/2012CN102820208A Method for controlling temperature of wafer in rapid thermal processing and rapid thermal processing using method
12/12/2012CN102820207A Method and device for preventing dichloroethylene of oxidized furnace tube from losing effectiveness
12/12/2012CN102820206A Heat reflection device and semiconductor processing device
12/12/2012CN102820205A Installation structure of force sensor on bonder and bonder
12/12/2012CN102820204A Scanning and photoresist removing system using radiofrequency and dielectric-barrier atmospheric-pressure glow plasmas
12/12/2012CN102819192A Resist underlayer composition and method of manufacturing integrated circuit device using the same
12/12/2012CN102819156A Method of fabricating fringe field switching liquid crystal display device
12/12/2012CN102819133A Transflective liquid crystal displayer array substrate, manufacture method thereof and liquid crystal display screen
12/12/2012CN102817082A Preparation method for silicon films
12/12/2012CN102817055A Ultrathin palladium plating and gold plating process for lead wire frame
12/12/2012CN102817052A Electroplating mold for electroplating with characteristics of high precision and selectivity
12/12/2012CN102816532A Polishing solution for 3D packaging silicon
12/12/2012CN102816530A Chemical-mechanical polishing solution
12/12/2012CN102814725A Chemical mechanical polishing method
12/12/2012CN102814359A Integrated chip lead frame leveling device
12/12/2012CN102332398B Method for manufacturing two high-K gate dielectric/metal gate structures
12/12/2012CN102324436B Large-mismatch silicon-based substrate antimonide transistor with high electron mobility and manufacturing method thereof
1 ... 775 776 777 778 779 780 781 782 783 784 785 786 787 788 789 790 791 792 793 794 795 ... 6590