Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/20/2012DE112010003087T5 Verfahren zur Herstellung von Transistoren mit selbstausrichtenden Steuerelektroden (Gate) und Source-/Drainzonen A process for the fabrication of transistors with self-aligned control electrodes (gate) and the source / drain regions
12/20/2012DE102012209891A1 Verfahren für eine gesteuerte Entfernung einer Halbleiterelementschicht von einem Grundsubstrat A method for controlled removal of a semiconductor element layer on a base substrate
12/20/2012DE102012209887A1 Abplatzverfahren zur Bildung einer Mehrfach-Photovoltaikstruktur Abplatzverfahren to form a multi-photovoltaic structure
12/20/2012DE102012209708A1 Verfahren zur gesteuerten Schichtübertragung Method for the controlled transfer layer
12/20/2012DE102012209706A1 Verfahren zur Herstellung von zwei Bauelement-Wafern aus einem einzelnen Basissubstrat durch Anwendung eines gesteuerten Abspaltprozesses A process for producing two component wafers from a single base substrate by application of a controlled Abspaltprozesses
12/20/2012DE102012105345A1 Verfahren zum Strukturieren eines Substrats A method for patterning a substrate
12/20/2012DE102011118364B3 Verfahren zum Ätzen und Halbleiterbauelement A method of etching semiconductor component and
12/20/2012DE102011115498A1 Storage device e.g. wafer stage for mounting substrate e.g. wafer in microlithography projection exposure system, has coupling unit arranged such that fixing unit is coupled by magnetic forces to supporting unit
12/20/2012DE102011104515A1 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips A method for fabricating a plurality of optoelectronic semiconductor chips
12/20/2012DE102011104305A1 Herstellungsverfahren für ein Halbleiterbauelement mit einer Leiterschicht im Halbleiterkörper und Halbleiterbauelement Manufacturing method for a semiconductor device having a conductor layer in the semiconductor body and the semiconductor component
12/20/2012DE102011104225A1 Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung Apparatus and method for positioning an electronic component and / or of a carrier relative to a discharge means
12/20/2012DE102011104219A1 Method for loading support plate for mounting semiconductor chip, involves heating chip contacts by the heat of laser radiation portion in the optical waveguide of positioning element
12/20/2012DE102011077833A1 Verfahren zur Bearbeitung von Substraten und Vorrichtung dazu Method for processing substrates and apparatus therefor
12/20/2012DE102011077784A1 Projektionsanordnung Projection device
12/20/2012DE102011077661A1 Metallgateelektrodenstrukturen mit großem Epsilon, die durch eine Reduzierung des Gatefüllaspektverhältnisses in einer Austauschgatetechnologie hergestellt sind Metal gate electrode structures with large Epsilon, which are prepared by a reduction of the Gatefüllaspektverhältnisses in a replacement gate technology
12/20/2012DE102011077526A1 Verfahren zur Herstellung einer Halbleitereinrichtung A process for producing a semiconductor device
12/20/2012DE102011004757B4 Vertikale Speichertransistoren mit einem sich frei einstellenden Körperpotential, die in Vollsubstratbauelementen hergestellt sind und vergrabene Abfrage- und Wortleitungen aufweisen und Verfahren zur Herstellung der Speichertransistoren Vertical memory transistors having a free adjusting body potential, which are prepared in bulk devices, and have buried query and word lines, and methods of fabrication of the memory transistors
12/20/2012DE102009048436B4 Verfahren zum Schleifen einer Halbleiterscheibe A method of grinding a semiconductor wafer
12/20/2012DE102008035537B4 Halbleitervorrichtung und Verfahren zu ihrer Bildung Semiconductor device and methods for their formation
12/20/2012DE102005048860B4 Schutzfilmmittel zum Laservereinzeln und Waferverarbeitungsverfahren unter Verwendung des Schutzfilmmittels Means for Laservereinzeln protective film and wafer processing method using the protective film by means of
12/20/2012DE10129263B4 Nichtflüchtiger ferroelektrischer Speicher und Verfahren zum Erfassen mangelhafter Zellen in diesem Non-volatile ferroelectric memory and method for detecting defective cells in this
12/19/2012EP2535940A1 Bipolar diode and method for manufacturing the same
12/19/2012EP2535937A1 Electronic device
12/19/2012EP2535933A1 Integrated circuit chip comprising protecting means against attacks
12/19/2012EP2535932A1 Integrated circuit chip comprising protecting means against attacks
12/19/2012EP2535927A2 Covering material for a microchip, microchip with covering material and method for producing such a microchip
12/19/2012EP2535925A1 Back-side contact formation
12/19/2012EP2535924A1 Integrated circuit comprising an insulation trench and corresponding method
12/19/2012EP2535923A1 Detection method and detection device
12/19/2012EP2535768A1 Underlayer film material, and method for formation of multilayer resist pattern
12/19/2012EP2535441A1 Copper filled opening with a cap layer
12/19/2012EP2535439A1 Flexible substrate position control device
12/19/2012EP2535343A2 Organoaminosilane precursors and methods for making and using same
12/19/2012EP2535144A1 Wire saw
12/19/2012EP2535143A1 Method of cutting workpiece with wire saw, and wire saw
12/19/2012EP2534705A2 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
12/19/2012EP2534700A2 Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
12/19/2012EP2534698A1 Method for single side texturing
12/19/2012EP2534690A1 Systems and methods for a continuous-well decoupling capacitor
12/19/2012EP2534687A2 Systems and methods providing arrangements of vias
12/19/2012EP2534683A2 Interconnect pattern for transceiver package
12/19/2012EP2534681A2 Bond pad with multiple layer over pad metallization and method of formation
12/19/2012EP2534680A1 Component placement on flexible and/or stretchable substrates
12/19/2012EP2534679A1 Semiconductor device and driving method of the same
12/19/2012EP2534678A1 Interconnection structure made of redirected carbon nanotubes
12/19/2012EP2534677A2 Thin wafer carrier
12/19/2012EP2534676A1 Apparatus and method for transporting substrates
12/19/2012EP2534675A2 Interconnect pattern for high performance interfaces
12/19/2012EP2534674A1 An adjustable shadow mask assembly for use in solar cell fabrications
12/19/2012EP2534673A1 Method for manufacturing a metal oxide semiconductor
12/19/2012EP2534092A2 Semiconductor component and corresponding production method
12/19/2012CN202616278U Vacuum adsorption servo stepping transmission apparatus for solar cell
12/19/2012CN202616277U Novel high-precision automatic fluid adding system device
12/19/2012CN202616272U Small carrier disposing structure
12/19/2012CN202616220U High-voltage isolation structure based on silicon on insulator
12/19/2012CN202616219U Isolation structure of high voltage device of high voltage BCD technology
12/19/2012CN202616218U Vacuum suction nozzle
12/19/2012CN202616217U Wafer loading fixture
12/19/2012CN202616216U Adsorption platform for light emitting diode wafer
12/19/2012CN202616215U Thin wall disc-like object clamping device easy to clean
12/19/2012CN202616214U Integrated circuit encapsulation sheet feeding machine
12/19/2012CN202616213U Chip carrying device
12/19/2012CN202616212U Full-automatic feeding and discharging device for laser processing semiconductor chip
12/19/2012CN202616211U Chip packing carrier tape
12/19/2012CN202616210U Solar cell module bearing box
12/19/2012CN202616209U Silicon wafer turnover loading tray
12/19/2012CN202616208U Loading frame for lead frame with staggered pins
12/19/2012CN202616207U Gouge preventing device for loading table of polycrystalline texture surface making machine
12/19/2012CN202616206U A diode collecting device of a diode straightening machine and the diode straightening machine
12/19/2012CN202607073U Full-automatic semiconductor chip laser machining device
12/19/2012CN1734755B Solderable top metalization and passivation for source mounted package
12/19/2012CN1678443B Methods and apparatus of field-induced pressure imprint lithography
12/19/2012CN102834927A Paste composition for solar cell, method for producing same, and solar cell
12/19/2012CN102834924A Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side, and photovoltaic module
12/19/2012CN102834921A Method for manufacturing semiconductor device
12/19/2012CN102834919A High voltage SCRMOS in BiCMOS process technologies
12/19/2012CN102834914A Method for manufacturing laminated body, and laminated body
12/19/2012CN102834913A 静电吸盘 Electrostatic chuck
12/19/2012CN102834912A Support structures for various apparatuses including opto-electrical apparatuses
12/19/2012CN102834911A Methodologies for rinsing tool surfaces in tools used to process microelectronic workpieces
12/19/2012CN102834910A Component transfer device and method
12/19/2012CN102834909A Component transfer device and method
12/19/2012CN102834908A Cassette jig for wafer cleaning apparatus and cassette assembly having the same
12/19/2012CN102834907A Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
12/19/2012CN102834906A Forming functionalized carrier structures with coreless packages
12/19/2012CN102834905A An adjustable shadow mask assembly for use in solar cell fabrications
12/19/2012CN102834904A Laser beam positioning system
12/19/2012CN102834903A Sheet for forming resin film for chip and method of manufacturing semiconductor chip
12/19/2012CN102834902A Etching method and device
12/19/2012CN102834901A Spalling for a semiconductor substrate
12/19/2012CN102834900A Base film for dicing sheet, and dicing sheet
12/19/2012CN102834899A Laser processing apparatus
12/19/2012CN102834898A N-type diffusion layer forming composition, method of producing n-type diffusion layer, and method of producing solar cell element
12/19/2012CN102834868A Semiconductor memory device having a three-dimensional structure
12/19/2012CN102834855A 显示装置 The display device
12/19/2012CN102834780A Exposure method and exposure apparatus
12/19/2012CN102834774A Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the composition and pattern forming method
12/19/2012CN102834552A Method for etching conductive metal oxide layer using microelectrode
12/19/2012CN102834547A Etching liquid for a copper/titanium multilayer thin film
12/19/2012CN102834479A Polishing agent for polishing copper and polishing method using the same
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