Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/19/2012CN102834478A Adhesive composition, adhesive sheet, and method for producing semiconductor device
12/19/2012CN102834351A Molded oxide and process for producing same
12/19/2012CN102832353A Organic light emitting structures, methods of forming organic light emitting structures, organic light emitting display devices and methods of manufacturing organic light emitting display devices
12/19/2012CN102832254A Array substrate, method for producing same and display panel
12/19/2012CN102832248A Silicon carbide MOSFET (metal-oxide-semiconductor field effect transistor) based on semi-super junction and manufacturing method
12/19/2012CN102832247A Split-gate structure in trench-based silicon carbide power device
12/19/2012CN102832246A Semiconductor device and method of manufacturing the same
12/19/2012CN102832244A Semiconductor device with device-side electrode exposed at substrate end and manufacture method thereof
12/19/2012CN102832243A Semiconductor device and manufacturing method thereof
12/19/2012CN102832242A Semiconductor device with groove MOS (Metal Oxide Semiconductor) structure and manufacturing method thereof
12/19/2012CN102832238A Silicon carbide device with ohmic contact protection layer and production method of silicon carbide device
12/19/2012CN102832236A Strained channel field effect transistor
12/19/2012CN102832235A Oxide semiconductor and method for manufacturing same
12/19/2012CN102832234A Groove type semiconductor power device, method for producing same and terminal protection structure
12/19/2012CN102832231A Compound semiconductor device and method of manufacturing the same
12/19/2012CN102832228A Display device and electronic apparatus
12/19/2012CN102832226A Active component array substrate and method for making the same
12/19/2012CN102832224A Method for thinning wafer
12/19/2012CN102832223A 晶圆减薄方法 Wafer thinning method
12/19/2012CN102832221A Semiconductor device provided with vertical apparatus and non-vertical apparatus and method for forming the same
12/19/2012CN102832220A Three-demensional semiconductor memory devices having double-intersection array and methods of fabricating the same
12/19/2012CN102832218A Strain SiGe vertical CMOS (complementary metal-oxide-semiconductor transistor) integrated device and preparation method thereof
12/19/2012CN102832217A Strain SiGe vertical channel Si-based BiCMOS integrated device based on auto-alignment technology, and preparation method thereof
12/19/2012CN102832215A Large dimension device and method of manufacturing same in gate last process
12/19/2012CN102832214A Large dimension device and method of manufacturing same in gate last process
12/19/2012CN102832200A Semiconductor structure and methods of forming same
12/19/2012CN102832199A Mixed-media copper-diffusion-resistant blocking layer for copper interconnection and fabrication method of blocking layer
12/19/2012CN102832198A Copper interconnection structure adopting novel alloy seed crystal layer and preparation method of structure
12/19/2012CN102832197A Metal interconnection structure and forming method thereof
12/19/2012CN102832192A Back-side contact formation
12/19/2012CN102832190A Semiconductor device with flip chip and manufacturing method of semiconductor device
12/19/2012CN102832189A Multi-chip packaging structure and multi-chip packaging method
12/19/2012CN102832182A Semiconductor package and manufacturing method of semiconductor package
12/19/2012CN102832180A Chip package and method for forming the same
12/19/2012CN102832176A Packaging method of quantum effect photoelectric detector and readout integrated circuit
12/19/2012CN102832175A Method for improving performance of device of SONOS (silicon-oxide-nitride-oxide-silicon) structure
12/19/2012CN102832174A Method for improving static random access memory reading redundancy
12/19/2012CN102832173A Bit line structure and manufacturing method thereof
12/19/2012CN102832172A Low-voltage metal gate complementary metal oxide semiconductor and manufacturing method thereof
12/19/2012CN102832171A Method for manufacturing semiconductor device
12/19/2012CN102832170A Manufacturing method of array substrate, array substrate and display device
12/19/2012CN102832169A Array substrate and preparation method thereof and display device
12/19/2012CN102832168A Trench-first copper interconnection manufacturing method
12/19/2012CN102832167A Preparation method of metal hard mask layer and semiconductor manufacturing method
12/19/2012CN102832166A Integrated circuits including barrier polish stop layers and methods for the manufacture thereof
12/19/2012CN102832165A Improved gap filling method for dual damascene process
12/19/2012CN102832164A Method for forming conductive contact
12/19/2012CN102832163A Method for forming opening
12/19/2012CN102832162A Air bridge three-dimensional circuit and manufacturing method thereof
12/19/2012CN102832161A Method for forming through-silicon-via
12/19/2012CN102832160A Preparation method of SOI (silicon on insulator) silicon wafer
12/19/2012CN102832159A High-speed oscillating-bar assembly for picking and placing tiny light objects at high speed
12/19/2012CN102832158A Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
12/19/2012CN102832157A Automatic pipe layout mechanism for receiving pipes of integrated circuits
12/19/2012CN102832156A Substrate transfer hand and substrate transfer device including the substrate transfer hand
12/19/2012CN102832155A Repair device, repair method, and component manufacturing method
12/19/2012CN102832154A Method used for detecting and repairing leakage defect of film solar battery
12/19/2012CN102832153A Method for determining machine generating granule defects in ion injection process section
12/19/2012CN102832152A Online contact hole detection method
12/19/2012CN102832151A Method for measuring dopant concentration during plasma ion implantation
12/19/2012CN102832150A Method for detecting growing length of nickel metal silicide in plane
12/19/2012CN102832149A Probe head formation methods employing guide plate raising assembly mechanism
12/19/2012CN102832148A Joint apparatus and joint method
12/19/2012CN102832147A Wafer low-temperature bonding method
12/19/2012CN102832146A IGBT (insulated gate bipolar translator) module packaging process and IGBT module with bidirectional heat radiation
12/19/2012CN102832145A Packaging method of high frequency internal matching power device
12/19/2012CN102832144A Metal bump formation
12/19/2012CN102832143A Semiconductor plastic package feeding gauge and feeding method
12/19/2012CN102832142A Manufacturing method for packaging structure
12/19/2012CN102832141A Manufacturing process of carrier-free package based on framework
12/19/2012CN102832140A Machining method of metal packaging shell of large-scale and large-power integrated circuit
12/19/2012CN102832139A Flat packaging body without pins around, and packaging method of flat packaging body
12/19/2012CN102832138A Method for forming packaging substrate with ultrathin seed layer
12/19/2012CN102832137A Manufacturing method for heat radiation device
12/19/2012CN102832136A Dual bit NROM (nitride read only memory) and method and structure for increasing electron injection efficiency thereof
12/19/2012CN102832135A Method for preparing FinFET on germanium and III-V semiconductor material substrate
12/19/2012CN102832134A Preparation method of trench grid VDMOS (vertical double-diffused metal oxide semiconductor) device with ultra-thin source region
12/19/2012CN102832133A Method for preparing independent bigrid FinFET (Fin Field Effect Transistor) on bulk silicon
12/19/2012CN102832132A Method for manufacturing semiconductor device
12/19/2012CN102832131A Method for manufacturing flexible IGZO (In-Ga-Zn-O) thin film transistor
12/19/2012CN102832130A Method for manufacturing flexible semitransparent IGZO (In-Ga-Zn-O) thin film transistor (TFT)
12/19/2012CN102832129A Manufacturing method for semiconductor device
12/19/2012CN102832128A Manufacturing method of semiconductor device
12/19/2012CN102832127A Metal source-drain SOI (Silicon On Insulator) MOS (Metal Oxide Semiconductor) transistor and forming method thereof
12/19/2012CN102832126A Semiconductor structure and manufacturing method thereof
12/19/2012CN102832125A Method for manufacturing semiconductor component
12/19/2012CN102832124A Method of manufacturing nitride semiconductor device
12/19/2012CN102832123A Power electric switch device and manufacturing method thereof
12/19/2012CN102832122A Bipolar punch-through semiconductor device and method for manufacturing the same
12/19/2012CN102832121A Manufacture method of fast recovery diode
12/19/2012CN102832120A Method for applying prestress on nanometer device surface
12/19/2012CN102832119A Method for forming low temperature silicon dioxide film
12/19/2012CN102832118A Method for etching bottom anti-reflective coating in dual damascene structure
12/19/2012CN102832117A Spalling methods to form multi-junction photovoltaic structure and photovoltaic device
12/19/2012CN102832116A Thin film strip structure, solar cell and manufacturing method of thin film strip structure
12/19/2012CN102832115A Method for controlled layer transfer
12/19/2012CN102832114A Method and system for determining chemical mechanical polishing removal rate of aluminum metal gate
12/19/2012CN102832113A Method for forming conductive contact
12/19/2012CN102832112A Method for forming metal silicide
12/19/2012CN102832111A Method for increasing conversion efficiency of solar cell
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