Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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12/05/2012 | CN102810506A Electrical connection for chip scale packaging |
12/05/2012 | CN102810505A Semiconductor process |
12/05/2012 | CN102810504A Process for growing thick aluminium |
12/05/2012 | CN102810503A Manufacturing method of semiconductor device |
12/05/2012 | CN102810502A Method for forming shallow trench isolating structure |
12/05/2012 | CN102810501A Well region forming method and semiconductor substrate |
12/05/2012 | CN102810500A Buffer units, substrate processing apparatuses, and substrate processing methods |
12/05/2012 | CN102810499A Apparatus and method for treating substrate |
12/05/2012 | CN102810498A Heating apparatus, coating apparatus and heating method |
12/05/2012 | CN102810497A Broken wafer recovery system |
12/05/2012 | CN102810496A Purge apparatus and load port |
12/05/2012 | CN102810495A Fluid delivery device and fluid delivery method |
12/05/2012 | CN102810494A System and method for compensating for magnetic noise |
12/05/2012 | CN102810493A Structure and layout method of circuit module via chain |
12/05/2012 | CN102810492A Processing procedure monitoring method after CMP for metal gate |
12/05/2012 | CN102810491A Method for monitoring processing procedure for removing polycrystalline silicon replaced gate through gate-last technology |
12/05/2012 | CN102810490A Method of manufacturing a semiconductor device |
12/05/2012 | CN102810489A Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device |
12/05/2012 | CN102810488A Semiconductor sensor device and method of packaging same |
12/05/2012 | CN102810487A Method for joining metal-ceramic substrates to metal bodies |
12/05/2012 | CN102810486A Method for manufacturing semiconductor device |
12/05/2012 | CN102810485A Manufacture method of chip package structure semi-finished product |
12/05/2012 | CN102810484A Semiconductor device fabrication method and semiconductor device |
12/05/2012 | CN102810483A Oxide semiconductor film and preparation method thereof, thin film transistor and preparation method |
12/05/2012 | CN102810482A Method for manufacturing semiconductor devices |
12/05/2012 | CN102810481A Manufacturing method of semiconductor device |
12/05/2012 | CN102810480A Semiconductor device manufacture method |
12/05/2012 | CN102810479A Polycrystalline silicon thin-film transistor manufacturing method capable of driving in nickel and adjusting threshold voltage simultaneously |
12/05/2012 | CN102810478A Forming method for transistor |
12/05/2012 | CN102810477A Semiconductor device and method for forming same |
12/05/2012 | CN102810476A Method for manufacturing fin field-effect transistors |
12/05/2012 | CN102810475A High-density groove-type power semiconductor structure and manufacturing method thereof |
12/05/2012 | CN102810474A Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics |
12/05/2012 | CN102810473A Method for improving chemical mechanical polishing performance of tungsten bolt |
12/05/2012 | CN102810472A Method of reducing striation on a sidewall of a recess |
12/05/2012 | CN102810471A Method of forming a trench by a silicon-containing mask |
12/05/2012 | CN102810470A Method of reducing microloading effect |
12/05/2012 | CN102810469A Splinter device and method of wafer |
12/05/2012 | CN102810468A Interface optimization method of high-k gate dielectric |
12/05/2012 | CN102810467A Metal gate forming method |
12/05/2012 | CN102810466A Method for manufacturing a semiconductor substrate |
12/05/2012 | CN102810465A Method for growing SiO2 passivation layer on SiC material |
12/05/2012 | CN102810464A Photoetching method |
12/05/2012 | CN102810463A Contact hole etching method |
12/05/2012 | CN102810462A Preparation method for semiconductor rectifying device with high breakdown voltage |
12/05/2012 | CN102810461A Substrate processing apparatus and substrate processing method |
12/05/2012 | CN102810460A Method of fabricating a deep trench device |
12/05/2012 | CN102810459A Method for cleaning wafer after chemical-mechanical |
12/05/2012 | CN102810458A Solution of WSI (tungsten silicide) linear granules |
12/05/2012 | CN102810457A Method for promoting wafer stop rule and implementing batch wafer stop by system |
12/05/2012 | CN102810456A Cavity preheating method |
12/05/2012 | CN102810455A Product implantation real-time monitoring system |
12/05/2012 | CN102809900A Semiconductor element overlap system and semiconductor element overlap method |
12/05/2012 | CN102809895A Photoetching layout, photoresist graph and method for measuring exposure error of photoresist graph |
12/05/2012 | CN102809860A Array substrate, display device and array substrate manufacturing method |
12/05/2012 | CN102809859A Liquid crystal display device, array substrate and manufacture method thereof |
12/05/2012 | CN102809855A Thin film transistor substrate and method for fabricating the same |
12/05/2012 | CN102809839A Graphic repair device and method for array substrate |
12/05/2012 | CN102808995A Locking device |
12/05/2012 | CN102806525A Polishing device and method for removing polishing by-products |
12/05/2012 | CN102361023B Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
12/05/2012 | CN102226997B Light emitting element |
12/05/2012 | CN102194796B Wafer detection structure, manufacturing method thereof and wafer detection method |
12/05/2012 | CN102157434B Method for manufacturing SOI (silicon on insulator) LIGBT (lateral insulated gate bipolar transistor) device unit with p buried layer and longitudinal channel |
12/05/2012 | CN102157359B Method for manufacturing 6-inch POWERMOS transistor epitaxial layer |
12/05/2012 | CN102136409B Method for manufacturing locating marker on wafer |
12/05/2012 | CN102130061B Method for making integrated silicon on insulator (SOI) laterally diffused metal oxide semiconductor (LDMOS) device with double vertical channels |
12/05/2012 | CN102130009B Manufacturing method of transistor |
12/05/2012 | CN102129995B Method for forming metal silicide contact layer and field effect transistor |
12/05/2012 | CN102117759B Shadow frame and manufacturing method thereof |
12/05/2012 | CN102097439B Semiconductor device |
12/05/2012 | CN102097413B Structure and method for testing integrity of grid oxide layer and dielectric layer |
12/05/2012 | CN102097304B Forming method of nitrogen-doped silicon carbide thin film |
12/05/2012 | CN102087962B Method for diffusing ions and method for forming semiconductor device |
12/05/2012 | CN102085636B Chemically mechanical polishing method |
12/05/2012 | CN102082173B Raceway-shaped N-type laterally diffused metal oxide semiconductor (NLDMOS) transistor and manufacturing method thereof |
12/05/2012 | CN102082086B Semiconductor manufacturing method |
12/05/2012 | CN102074453B 晶圆清洗方法 Wafer cleaning method |
12/05/2012 | CN102064183B Integrated circuit including vertical diode |
12/05/2012 | CN102064156B Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
12/05/2012 | CN102054781B Vertical flash memory structure and manufacturing method thereof |
12/05/2012 | CN102054762B Semiconductor structure and method for forming dual-damascene structure |
12/05/2012 | CN102054705B Method of forming an integrated circuit structure |
12/05/2012 | CN102054676B Forming methods of offset side wall and metal oxide semiconductor (MOS) transistor |
12/05/2012 | CN102044544B Non-volatile memory with floating gates and formation method thereof |
12/05/2012 | CN102044450B Electronic component mounting apparatus and electronic component mounting method |
12/05/2012 | CN102044437B Method for manufacturing semiconductor device |
12/05/2012 | CN102044432B Method for preventing uneven surface of wafer and preventing defocus in exposure |
12/05/2012 | CN102013406B Wire-bonding machine and cover-gas supply device applicable for the same |
12/05/2012 | CN102013405B Welding needle heating structure and method of chip wire bonding device |
12/05/2012 | CN102005396B Bump making method and bump structure |
12/05/2012 | CN101998930B Method of sealing a cavity |
12/05/2012 | CN101997010B Digital X-ray detection panel and manufacturing method thereof |
12/05/2012 | CN101996261B Method for optimizing domain of CMOS (Complementary Metal-Oxide-Semiconductor) image sensor as well as etching method |
12/05/2012 | CN101989589B Power device package and method of fabricating the same |
12/05/2012 | CN101976646B Substrate processing method, program, computer-readable recording medium, and substrate processing system |
12/05/2012 | CN101969070B Active element array substrate and manufacturing method thereof |
12/05/2012 | CN101966525B Apparatus for cleaning substrate |
12/05/2012 | CN101965638B Nonvolatile random access memory |
12/05/2012 | CN101965631B Control and readout of electron or hole spin |