Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/05/2012CN202585374U Loading disc of solar silicon wafer
12/05/2012CN202585373U Linear slide block
12/05/2012CN202585372U Sheet feeding mechanism for solar energy cell diffusion equipment
12/05/2012CN202585371U Chip winding conveying apparatus
12/05/2012CN202585370U Novel system for automatically loading and unloading silicon wafers
12/05/2012CN202585369U Silicon plate boat
12/05/2012CN202585368U Fixing column for graphite boat
12/05/2012CN202585367U Container for storing semi-conductor element
12/05/2012CN202585366U Container for storing semi-conductor element
12/05/2012CN202585365U Silicon chip box
12/05/2012CN202585364U Commutator blanking device
12/05/2012CN202585363U Chip branching device
12/05/2012CN202585362U Gas diffusion device of vacuum equipment
12/05/2012CN202585361U Die bonder with multiple heads rotating
12/05/2012CN202585360U Pull through mechanism for diode anti-clamping straight-leading apparatus
12/05/2012CN202585359U Rapid quality test board of patch diode
12/05/2012CN202585358U Gas bath apparatus, vacuum discharging apparatus and semiconductor semi-conductor equipment
12/05/2012CN202585357U A vacuum flat adsorbing device against recess on a substrate
12/05/2012CN202585356U Cut and ground silicon chip surface cleaning device
12/05/2012CN202585355U Protection device for tensile test of battery piece
12/05/2012CN202585354U Fixing device for detecting adhesion of solar cell piece metal electrode
12/05/2012CN202585353U Die bonding executive device
12/05/2012CN202585352U High-precision high-power bared chip integrated circuit package die
12/05/2012CN202585351U High precision integrated circuit package module with flat pins at both side thereof
12/05/2012CN202585350U Bonding-based novel wafer
12/05/2012CN202585324U Plasma processing device, gathering device and electrostatic chuck thereof
12/05/2012CN202582222U Cooling device for solar silicon wafer
12/05/2012CN202575407U Positioning transmission apparatus
12/05/2012CN202574282U Transfer device for loading amorphous silicon solar cells
12/05/2012CN202573217U Laminating device for composite sheet material
12/05/2012CN1963675B Infiltrating type micro-image apparatus and process thereof
12/05/2012CN1945441B System and method for compensating for radiation induced thermal distortions
12/05/2012CN1802606B Resist pattern swelling material, and method for patterning using same
12/05/2012CN1525485B Laminated integrated circuit memory
12/05/2012CN102812566A Semiconductor light-emitting element manufacturing method
12/05/2012CN102812555A Semiconductor device and method for manufacturing the same
12/05/2012CN102812550A System-in-package using embedded-die coreless substrates, and processes of forming same
12/05/2012CN102812548A 多芯片集成电路 Multi-Chip Integrated Circuits
12/05/2012CN102812547A Semiconductor device
12/05/2012CN102812546A Method for producing a wafer equipped with chips on two sides
12/05/2012CN102812545A Porous Barrier For Evenly Distributed Purge Gas In A Microenvironment
12/05/2012CN102812544A Method And Apparatus For Improved Sorting Of Diced Substrates
12/05/2012CN102812543A Conductive connecting member and manufacturing method of same
12/05/2012CN102812542A Surface preparation of die for improved bonding strength
12/05/2012CN102812541A Flexible semiconductor device and method for producing same, image display device using the flexible semiconductor device and manufacturing method thereof
12/05/2012CN102812540A Flexible semiconductor device and method for producing same, image display device using the flexible semiconductor device and manufacturing method thereof
12/05/2012CN102812539A Deposition Method
12/05/2012CN102812538A Process for reconditioning semiconductor surface to facilitate bonding
12/05/2012CN102812537A Semiconductor device and method for producing same
12/05/2012CN102812536A Pinning And Affixing Nano-active Material
12/05/2012CN102812520A Electrically conductive paste, and electrically conductive connection member produced using the paste
12/05/2012CN102812400A Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the same
12/05/2012CN102812373A Semiconductor device, detection method, and program
12/05/2012CN102812372A System And Method For Improved Testing Of Electronic Devices
12/05/2012CN102812164A Method of manufacturing an x-ray diffraction grating microstructure for imaging apparatus
12/05/2012CN102812099A Liquid adhesive for electronic parts and adhesive tape
12/05/2012CN102811838A Laminate polishing pad
12/05/2012CN102811837A Film for holding glass substrate and method for polishing glass substrate
12/05/2012CN102811504A Novel design method of heating bands
12/05/2012CN102810921A Cooling device and cooling method for wire clamp driving motor of bonding machine, and bonding machine
12/05/2012CN102810632A Parallel resistance memory and preparation method thereof
12/05/2012CN102810631A Method for manufacturing phase change memory
12/05/2012CN102810603A Screen printing overprinting alignment detection method for solar cell electrodes
12/05/2012CN102810599A Phosphorous diffusion method of polycrystalline silicon solar cell
12/05/2012CN102810571A Substrate, display device and substrate preparation method
12/05/2012CN102810569A Polycrystalline silicon thin film transistor capable of driving in nickel and adjusting threshold voltage simultaneously
12/05/2012CN102810568A Stress silicon (Si) vertical-channel P-channel metal-oxide semiconductor (PMOS) device and preparation method
12/05/2012CN102810564A Radio frequency device and manufacturing method thereof
12/05/2012CN102810562A Semiconductor device and manufacturing method thereof
12/05/2012CN102810561A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/05/2012CN102810560A Split gate storage and manufacturing method thereof
12/05/2012CN102810559A Heterostructure field transistor with reverse conducting function and manufacturing method of heterostructure field transistor
12/05/2012CN102810558A Thin film transistor, array substrate and preparation methods of thin film transistor and array substrate, and liquid crystal display
12/05/2012CN102810557A Method for manufacturing semiconductor device
12/05/2012CN102810556A New and improved edge termination configuration for high voltage semiconductor power device
12/05/2012CN102810555A Germanium tin tunneling field effect transistor and preparation method thereof
12/05/2012CN102810544A Dual-strain bipolar complementary metal-oxide semiconductor (BiCMOS) integration device based on silicon on insulator (SOI) substrate and preparation method thereof
12/05/2012CN102810543A Semiconductor device and manufacturing method thereof, display apparatus and electronic apparatus
12/05/2012CN102810542A Semiconductor device and manufacturing method thereof
12/05/2012CN102810541A Memory and manufacturing method thereof
12/05/2012CN102810538A 半导体集成电路及其制造方法 A semiconductor integrated circuit and its manufacturing method
12/05/2012CN102810531A Semiconductor module system,semiconductor module and method for manufacturing semiconductor module
12/05/2012CN102810527A Semiconductor package and fabrication method of the same
12/05/2012CN102810526A Power converter, semiconductor device and method for manufacturing power converter
12/05/2012CN102810524A Power module and production method of power module
12/05/2012CN102810521A Temperature-equalizing plate and manufacturing method thereof
12/05/2012CN102810520A Thermally enhanced integrated circuit package
12/05/2012CN102810519A Gas barrier film and method for manufacturing the same
12/05/2012CN102810518A Wafer loading board structure and wafer bonding method
12/05/2012CN102810517A Semiconductor wafer and method of producing the same
12/05/2012CN102810516A ROM (read only memory) device and manufacturing method thereof
12/05/2012CN102810515A Method of forming titanium oxide film having rutile crystalline structure
12/05/2012CN102810514A Method and system for manufacturing complementary metal oxide semiconductors of high-voltage metal gates
12/05/2012CN102810513A Method for forming transistor
12/05/2012CN102810512A Manufacturing method of flexible display device
12/05/2012CN102810511A Manufacturing method for copper interconnection lines
12/05/2012CN102810510A Method for manufacturing copper interconnection
12/05/2012CN102810509A Preparation process of dual-damascene shallow-redundancy metal
12/05/2012CN102810508A Preparation method of copper interconnecting layer for improving etching appearance and reliability
12/05/2012CN102810507A Semiconductor device and method of using leadframe bodies to form openings
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