Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/20/2012US20120322248 Ion implantation apparatus and ion implantation method
12/20/2012US20120322247 Method for fabricating high voltage transistor
12/20/2012US20120322246 Fabrication methods of integrated semiconductor structure
12/20/2012US20120322245 Method of manufacturing nitride semiconductor device
12/20/2012US20120322244 Method for controlled removal of a semiconductor device layer from a base substrate
12/20/2012US20120322243 Apparatus and method for electrochemical processing of thin films on resistive substrates
12/20/2012US20120322242 Multi-step and asymmetrically shaped laser beam scribing
12/20/2012US20120322241 Multi-layer mask for substrate dicing by laser and plasma etch
12/20/2012US20120322240 Damage isolation by shaped beam delivery in laser scribing process
12/20/2012US20120322239 Hybrid laser and plasma etch wafer dicing using substrate carrier
12/20/2012US20120322238 Laser and plasma etch wafer dicing using water-soluble die attach film
12/20/2012US20120322237 Laser and plasma etch wafer dicing using physically-removable mask
12/20/2012US20120322236 Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
12/20/2012US20120322235 Wafer dicing using hybrid galvanic laser scribing process with plasma etch
12/20/2012US20120322234 In-situ deposited mask layer for device singulation by laser scribing and plasma etch
12/20/2012US20120322233 Water soluble mask for substrate dicing by laser and plasma etch
12/20/2012US20120322232 Multi-step and asymmetrically shaped laser beam scribing
12/20/2012US20120322231 Semiconductor wafer processing method
12/20/2012US20120322230 Method for forming two device wafers from a single base substrate utilizing a controlled spalling process
12/20/2012US20120322229 Method for bonding two substrates
12/20/2012US20120322228 Method for forming soi substrate and apparatus for forming the same
12/20/2012US20120322227 Method for controlled layer transfer
12/20/2012US20120322226 Semiconductor device production method
12/20/2012US20120322225 Method of Forming Conductive Contacts on a Semiconductor Device with Embedded Memory and the Resulting Device
12/20/2012US20120322224 Method of fabricating semiconductor device
12/20/2012US20120322222 Method for improving capacitance uniformity in a mim device
12/20/2012US20120322221 Molybdenum oxide top electrode for dram capacitors
12/20/2012US20120322220 Method of processing mim capacitors to reduce leakage current
12/20/2012US20120322219 Reduction of Stored Charge in the Base Region of a Bipolar Transistor to Improve Switching Speed
12/20/2012US20120322218 Method for fabricating semiconductor device
12/20/2012US20120322217 Fabrication method of trenched power semiconductor device with source trench
12/20/2012US20120322216 Method for reducing poly-depletion in dual gate cmos fabrication process
12/20/2012US20120322215 Communication
12/20/2012US20120322214 Method and structure for establishing contacts in thin film transistor devices
12/20/2012US20120322213 Substrate for liquid crystal display device including peripheral lines having openings and fabricating method thereof
12/20/2012US20120322212 Wireless chip and manufacturing method thereof
12/20/2012US20120322211 Die backside standoff structures for semiconductor devices
12/20/2012US20120322210 Semiconductor device and manufacturing of the semiconductor device
12/20/2012US20120322209 Semiconductor device with heat spreader
12/20/2012US20120322208 Electronic device and method for manufacturing electronic device
12/20/2012US20120322207 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
12/20/2012US20120322206 Method for wafer level packaging of electronic devices
12/20/2012US20120322205 Method for manufacturing wiring substrate
12/20/2012US20120322204 Semiconductor element and method of manufacturing the same
12/20/2012US20120322203 Method to construct systems
12/20/2012US20120322202 Semiconductor device and manufacturing method of the semiconductor device
12/20/2012US20120322201 Stacked semiconductor package and stacking method thereof
12/20/2012US20120322193 Solid-state imaging device
12/20/2012US20120322175 Methods and Systems For Controlling SiIicon Rod Temperature
12/20/2012US20120322174 Chip fixing apparatus and chip testing method using the same
12/20/2012US20120322173 Method and system for isolated and discretized process sequence integration/us
12/20/2012US20120322172 Method for monitoring the removal of polysilicon pseudo gates
12/20/2012US20120322171 Apparatus and Method for Making an Absorbing layer of a Solar Cell
12/20/2012US20120322170 Pinhole inspection method of insulator layer
12/20/2012US20120322169 Method of manufacturing semiconductor device
12/20/2012US20120322168 Chemical vapor deposition apparatus
12/20/2012US20120322167 Surface treatment method by using the nh3 plasma treatment to modify the sensing thin-film
12/20/2012US20120322015 Apparatus and method for treating substrate
12/20/2012US20120321999 Glass substrate-holding tool and method for producing an euv mask blank by employing the same
12/20/2012US20120321434 Systems, apparatus and methods for making an electrical connection to a robot
12/20/2012US20120321430 Magnetically coupled thin-wafer handling system
12/20/2012US20120321417 Narrow Width Loadport Mechanism for Cleanroom Material Transfer Systems
12/20/2012US20120321246 Asymmetric slotted waveguide and method for fabricating the same
12/20/2012US20120321245 Silica-on-silicon waveguides and related fabrication methods
12/20/2012US20120321244 Optical semiconductor device, and manufacturing method thereof
12/20/2012US20120320642 Compound semiconductor device and method of manufacturing the same
12/20/2012US20120320517 Obsolescence tolerant flash memory architecture and physical building block (pbb) implementation
12/20/2012US20120320491 Electrostatic chuck
12/20/2012US20120320480 Device for protecting an integrated circuit chip against attacks
12/20/2012US20120320477 Device for detecting an attack in an integrated circuit chip
12/20/2012US20120320300 Liquid Crystal Display Device and Process of Manufacture
12/20/2012US20120319792 Piezoelectric device and fabricating method thereof
12/20/2012US20120319741 Reduced crosstalk wiring delay effects through the use of a checkerboard pattern of inverting and noninverting repeaters
12/20/2012US20120319305 Process for producing a sheet of a circuit substrate
12/20/2012US20120319304 Semiconductor device and manufacturing method
12/20/2012US20120319303 Wafer level hermetic bond using metal alloy with keeper layer
12/20/2012US20120319302 Semiconductor Device and Method of Forming RF FEM and RF Transceiver in Semiconductor Package
12/20/2012US20120319301 Monolithic Darlington with Intermediate Base Contact
12/20/2012US20120319300 Integrated circuit packaging system with underfill and method of manufacture thereof
12/20/2012US20120319299 Semiconductor Diode and Method for Producing a Semiconductor Diode
12/20/2012US20120319298 Method for fabricating a semiconductor and semiconductor package
12/20/2012US20120319297 Chip package and method for forming the same
12/20/2012US20120319295 Integrated circuit packaging system with pads and method of manufacture thereof
12/20/2012US20120319294 Integrated circuit packaging system with laser hole and method of manufacture thereof
12/20/2012US20120319293 Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi-channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die package
12/20/2012US20120319291 Semiconductor structures and methods of forming the same
12/20/2012US20120319286 Integrated circuit packaging system with support structure and method of manufacture thereof
12/20/2012US20120319285 Integrated circuits including barrier polish stop layers and methods for the manufacture thereof
12/20/2012US20120319284 Integrated circuit packaging system with package on package support and method of manufacture thereof
12/20/2012US20120319282 Reliable Packaging and Interconnect Structures
12/20/2012US20120319281 Semiconductor device having groove-shaped via-hole
12/20/2012US20120319279 Semiconductor device and method of producing the same
12/20/2012US20120319278 Gap filling method for dual damascene process
12/20/2012US20120319277 Thin film transistor panel and manufacturing method thereof
12/20/2012US20120319274 Method of manufacturing semiconductor device, and semiconductor device
12/20/2012US20120319273 Flip Chip Interconnect Solder Mask
12/20/2012US20120319271 Bump structure and process of manufacturing the same
12/20/2012US20120319269 Enhanced Bump Pitch Scaling
12/20/2012US20120319267 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof
12/20/2012US20120319266 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
1 ... 765 766 767 768 769 770 771 772 773 774 775 776 777 778 779 780 781 782 783 784 785 ... 6590