Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/13/2012US20120315743 Compound semiconductor device and method of manufacturing the same
12/13/2012US20120315742 Method for forming nitride semiconductor device
12/13/2012US20120315741 Enhanced magnesium incorporation into gallium nitride films through high pressure or ald-type processing
12/13/2012US20120315740 Selective deposition of polymer films on bare silicon instead of oxide surface
12/13/2012US20120315739 Manufacturing method for semiconductor wafer
12/13/2012US20120315738 Method of manufacturing semiconductor device
12/13/2012US20120315736 Semiconductor device and method of manufacturing the semiconductor device
12/13/2012US20120315735 Manufacturing method of semiconductor device
12/13/2012US20120315734 Method for fabricating semiconductor device
12/13/2012US20120315733 Method of fabricating gate elctrode using a treated hard mask
12/13/2012US20120315732 Method for fabricating semiconductor device and device using same
12/13/2012US20120315731 Thin film transistor array panel and manufacturing method thereof
12/13/2012US20120315730 Manufacturing method of semiconductor device
12/13/2012US20120315729 Method of manufacturing transparent transistor with multi-layered structures
12/13/2012US20120315728 Saw Type Package without Exposed Pad
12/13/2012US20120315727 Thin Power Package
12/13/2012US20120315726 Method of manufacturing a semiconductor chip package
12/13/2012US20120315725 Surface treatment to improve resistive-switching characteristics
12/13/2012US20120315724 Method and apparatus for deposition of selenium thin-film and plasma head thereof
12/13/2012US20120315717 Methods of manufacturing wire, TFT, and flat panel display device
12/13/2012US20120315716 Taper-etching method and method of manufacturing near-field light generator
12/13/2012US20120315712 Method for Detecting Embedded Voids in a Semiconductor Substrate
12/13/2012US20120315711 Adjusting Capacitance of Capacitors without Affecting Die Area
12/13/2012US20120315710 Method for producing reconstituted wafers and method for producing semiconductor devices
12/13/2012US20120315708 Method for manufacturing semiconductor device
12/13/2012US20120315582 Patterned substrate and method for producing same
12/13/2012US20120315395 Thin-film manufacturing equipment, method for manufacturing thin film, and method for maintaining thin-film manufacturing equipment
12/13/2012US20120315114 Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus
12/13/2012US20120315113 Substrate holder, substrate transfer apparatus, and substrate processing apparatus
12/13/2012US20120314994 Process for Enhanced 3D Integration and Structures Generated Using the Same
12/13/2012US20120314727 Ridge semiconductor laser and method for manufacturing a ridge semiconductor laser
12/13/2012US20120314497 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield
12/13/2012US20120314493 Phase change memory and method for fabricating phase change memory
12/13/2012US20120314485 Complementary soi lateral bipolar for sram in a low-voltage cmos platform
12/13/2012US20120314476 Organic ferroelectric material based random access memory
12/13/2012US20120314409 Optical semiconductor-based tube type lighting apparatus
12/13/2012US20120314384 Low-stress tsv design using conductive particles
12/13/2012US20120314371 Group iii nitride based flip-chip integrated circuit and method for fabricating
12/13/2012US20120314367 Methods and Systems for On-Chip Osmotic Airflow Cooling
12/13/2012US20120314151 Semiconductor device and method of fabricating the same
12/13/2012US20120313736 On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure
12/13/2012US20120313664 Semiconductor Device Having Features to Prevent Reverse Engineering
12/13/2012US20120313389 Pick and place handler with a floating lock device
12/13/2012US20120313388 Transfer device, and workpiece mounting device
12/13/2012US20120313332 Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
12/13/2012US20120313264 Chip with sintered connections to package
12/13/2012US20120313261 Chip package structure and manufacturing method thereof
12/13/2012US20120313260 Layered chip package and method of manufacturing same
12/13/2012US20120313259 Layered chip package and method of manufacturing same
12/13/2012US20120313257 Semiconductor device and method for manufacturing the semiconductor device
12/13/2012US20120313256 Non-Hierarchical Metal Layers for Integrated Circuits
12/13/2012US20120313255 3D Integration Microelectronic Assembly For Integrated Circuit Devices And Method Of Making Same
12/13/2012US20120313254 Compact metal connect and/or disconnect structures
12/13/2012US20120313253 Fan-out wlp with package
12/13/2012US20120313251 Interconnect structure with improved alignment for semiconductor devices
12/13/2012US20120313250 Forming Features on a Substrate Having Varying Feature Densities
12/13/2012US20120313249 Semiconductor device structures and the separating methods thereof
12/13/2012US20120313247 Through Silicon Via Structure and Method
12/13/2012US20120313246 Semiconductor apparatus
12/13/2012US20120313242 Substrate and assembly thereof with dielectric removal for increased post height
12/13/2012US20120313241 Methods for surface attachment of flipped active components
12/13/2012US20120313240 Semiconductor package and fabrication method thereof
12/13/2012US20120313239 Flip chip assembly and process with sintering material on metal bumps
12/13/2012US20120313238 Semiconductor chip package assembly and method for making same
12/13/2012US20120313237 Bonded semiconductor structures and methods of forming same
12/13/2012US20120313236 Semiconductor device and manufacturing method for semiconductor device
12/13/2012US20120313235 Semiconductor Devices With Moving Members and Methods for Making the Same
12/13/2012US20120313234 Qfn package and manufacturing process thereof
12/13/2012US20120313233 Semiconductor Package, Stacking Semiconductor Package, And Method Of Fabricating The Same
12/13/2012US20120313232 Power Package Including Multiple Semiconductor Devices
12/13/2012US20120313231 Method and apparatus for dicing die attach film on a semiconductor wafer
12/13/2012US20120313229 Package structure and manufacturing method thereof
12/13/2012US20120313228 Impedence controlled packages with metal sheet or 2-layer rdl
12/13/2012US20120313226 Wiring substrate, semiconductor device and manufacturing method thereof
12/13/2012US20120313225 Integrated circuit having doped semiconductor body and method
12/13/2012US20120313224 Semiconductor device and semiconductor device manufacturing method
12/13/2012US20120313223 Method of fabricating an integrated circuit without ground contact pad
12/13/2012US20120313222 Chip package structure and manufacturing method thereof
12/13/2012US20120313221 Semiconductor device and manufacturing method thereof
12/13/2012US20120313220 High-nitrogen content metal resistor and method of forming same
12/13/2012US20120313219 Chip package structure and method of making the same
12/13/2012US20120313216 Complementary bipolar inverter
12/13/2012US20120313214 Polysilicon structure and method of manufacturing the same
12/13/2012US20120313199 Material for forming passivation film for semiconductor substrate, passivation film for semiconductor substrate and method of producing the same, and photovoltaic cell element and method of producing the same
12/13/2012US20120313198 Conductive paste composition containing lithium, and articles made therefrom
12/13/2012US20120313194 Semiconductor switching device and method of making the same
12/13/2012US20120313193 Systems and methods for three dimensional sensors
12/13/2012US20120313191 Spin-torque magnetoresistive memory element and method of fabricating same
12/13/2012US20120313190 Packaged device including interposer for increased adhesive thickness and method of attaching die to substrate
12/13/2012US20120313189 Method of preventing stiction of mems devices
12/13/2012US20120313187 Method of Removing Gate Cap Materials While Protecting Active Area
12/13/2012US20120313186 Polysilicon gate with nitrogen doped high-k dielectric and silicon dioxide
12/13/2012US20120313182 Electronic component comprising a number of mosfet transistors and manufacturing method
12/13/2012US20120313181 Stress film forming method and stress film structure
12/13/2012US20120313180 Non-volatile anti-fuse with consistent rupture
12/13/2012US20120313178 Semiconductor device having metal gate and manufacturing method thereof
12/13/2012US20120313177 Multiple Finger Structure
12/13/2012US20120313176 Buried Sublevel Metallizations for Improved Transistor Density
12/13/2012US20120313172 Semiconductor device, semiconductor wafer, and methods of manufacturing the same
12/13/2012US20120313171 Semiconductor device and manufacturing method thereof
1 ... 772 773 774 775 776 777 778 779 780 781 782 783 784 785 786 787 788 789 790 791 792 ... 6590