Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/18/2012US8334588 Circuit component with conductive layer structure
12/18/2012US8334584 Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof
12/18/2012US8334578 Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element
12/18/2012US8334577 Semiconductor device
12/18/2012US8334575 Semiconductor device and electronic device
12/18/2012US8334563 Field-effect semiconductor device and method of producing the same
12/18/2012US8334558 Method to fabricate self-aligned source and drain in split gate flash
12/18/2012US8334544 Nitride semiconductor laser device including growth-inhibiting film at dislocation concentrated region
12/18/2012US8334538 Thin film transistor array panel and method of manufacturing the same
12/18/2012US8334532 IGZO-based oxide material and method of producing IGZO-based oxide material
12/18/2012US8334455 Photovoltaic devices including Mg-doped semiconductor films
12/18/2012US8334222 Semiconductor wafer processing method and apparatus
12/18/2012US8334221 Methods of forming patterned photoresist layers over semiconductor substrates
12/18/2012US8334220 Method of selectively forming a silicon nitride layer
12/18/2012US8334219 Method of forming stress-tuned dielectric film having Si-N bonds by modified PEALD
12/18/2012US8334218 Method of forming non-conformal layers
12/18/2012US8334217 Material deposition over template
12/18/2012US8334216 Method for producing silicon nanostructures
12/18/2012US8334215 Substrate processing method and substrate processing apparatus
12/18/2012US8334214 Susceptor treatment method and a method for treating a semiconductor manufacturing apparatus
12/18/2012US8334213 Bottom electrode etching process in MRAM cell
12/18/2012US8334212 Method of manufacturing a semiconductor device
12/18/2012US8334211 Process for improving critical dimension uniformity of integrated circuit arrays
12/18/2012US8334210 Method and apparatus of manufacturing semiconductor device
12/18/2012US8334209 Method of reducing electron beam damage on post W-CMP wafers
12/18/2012US8334208 Film-forming method and film-forming apparatus
12/18/2012US8334207 Method for fabricating semiconductor device with buried gates
12/18/2012US8334206 Method for producing metallic interconnect lines
12/18/2012US8334205 Method for removing polymer after etching gate stack structure of high-K gate dielectric/metal gate
12/18/2012US8334204 Semiconductor device and manufacturing method therefor
12/18/2012US8334203 Interconnect structure and method of fabricating
12/18/2012US8334200 Semiconductor light-emitting device, method of manufacturing semiconductor light-emitting device, and lamp
12/18/2012US8334199 Method for fabricating nitride-based semiconductor device having electrode on m-plane
12/18/2012US8334198 Method of fabricating a plurality of gate structures
12/18/2012US8334197 Method of fabricating high-k/metal gate device
12/18/2012US8334196 Methods of forming conductive contacts in the fabrication of integrated circuitry
12/18/2012US8334195 Pixel sensors of multiple pixel size and methods of implant dose control
12/18/2012US8334194 Methods and apparatus for manufacturing semiconductor wafers
12/18/2012US8334193 Method of manufacturing semiconductor device
12/18/2012US8334192 Method of fabricating gallium nitride substrate
12/18/2012US8334191 Two-chamber system and method for serial bonding and exfoliation of multiple workpieces
12/18/2012US8334190 Single step CMP for polishing three or more layer film stacks
12/18/2012US8334189 Method for forming trenches and trench isolation on a substrate
12/18/2012US8334188 Process for manufacturing a wafer by annealing of buried channels
12/18/2012US8334187 Hard mask for thin film resistor manufacture
12/18/2012US8334185 Early embedded silicon germanium with insitu boron doping and oxide/nitride proximity spacer
12/18/2012US8334184 Polish to remove topography in sacrificial gate layer prior to gate patterning
12/18/2012US8334183 Semiconductor device containing a buried threshold voltage adjustment layer and method of forming
12/18/2012US8334182 Method for manufacturing non-volatile memory
12/18/2012US8334180 Flash memory cell arrays having dual control gates per memory cell charge storage element
12/18/2012US8334179 Semiconductor device and method for its production
12/18/2012US8334178 High breakdown voltage double-gate semiconductor device
12/18/2012US8334177 Methods for forming isolated fin structures on bulk semiconductor material
12/18/2012US8334176 Method of manufacturing semiconductor device
12/18/2012US8334175 Manufacturing method of LED package structure
12/18/2012US8334174 Chip scale package and fabrication method thereof
12/18/2012US8334173 Method for manufacturing semiconductor apparatus
12/18/2012US8334172 Manufacturing method of semiconductor device
12/18/2012US8334171 Package system with a shielded inverted internal stacking module and method of manufacture thereof
12/18/2012US8334170 Method for stacking devices
12/18/2012US8334169 Integrated circuit packaging system and method of manufacture thereof
12/18/2012US8334167 Method of manufacturing photoelectric conversion device
12/18/2012US8334165 Programmable metallization memory cells via selective channel forming
12/18/2012US8334164 Image sensor and fabrication method thereof
12/18/2012US8334163 Method of forming solar cell
12/18/2012US8334160 Semiconductor photovoltaic devices and methods of manufacturing the same
12/18/2012US8334159 MEMS pressure sensor using capacitive technique
12/18/2012US8334158 Sensor device and manufacturing method thereof
12/18/2012US8334157 Semiconductor device and a method of manufacture thereof
12/18/2012US8334156 Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same
12/18/2012US8334155 Substrate for growing a III-V light emitting device
12/18/2012US8334154 Method for the production of quantum dots embedded in a matrix, and quantum dots embedded in a matrix produced using the method
12/18/2012US8334153 Semiconductor light emitting device and method of fabricating semiconductor light emitting device
12/18/2012US8334151 Method for fabricating a direct wafer bonded optoelectronic device
12/18/2012US8334150 Wafer level laser marking system for ultra-thin wafers using support tape
12/18/2012US8334149 Mechanical coupling in a multi-chip module using magnetic components
12/18/2012US8334148 Methods of forming pattern structures
12/18/2012US8334091 Resist pattern swelling material, and method for patterning using same
12/18/2012US8334016 Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide
12/18/2012US8333882 Polishing apparatus and method of polishing work
12/18/2012US8333842 Apparatus for etching semiconductor wafers
12/18/2012US8333840 Metal organic chemical vapor deposition apparatus and method
12/18/2012US8333820 Forming conductive features of electronic devices
12/18/2012US8333815 Cerium oxide powder for abrasive and CMP slurry comprising the same
12/18/2012US8333166 Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes
12/18/2012CA2754724C Methods of filling vias in a substrate
12/18/2012CA2665036C Content addressable memory
12/18/2012CA2648539C Stabilized metal nanoparticles and methods for depositing conductive features using stabilized metal nanoparticles
12/18/2012CA2442211C Device for and method of processing integrated circuits
12/18/2012CA2437433C Optoelectronic device with wavelength filtering by cavity coupling
12/18/2012CA2406642C Charge carrier extracting transistor
12/18/2012CA2401619C Thermal management system
12/13/2012WO2012171037A1 Component protective overmolding
12/13/2012WO2012170630A2 Nanoscale wires, nanoscale wire fet devices, and nanotube-electronic hybrid devices for sensing and other applications
12/13/2012WO2012170625A1 Low-stress tsv design using conductive particles
12/13/2012WO2012170567A2 Pulse circulator
12/13/2012WO2012170511A2 Methods for cleaning a surface of a substrate using a hot wire chemical vapor deposition (hwcvd) chamber
12/13/2012WO2012170409A2 Techniques for providing a semiconductor memory device
12/13/2012WO2012170339A2 Signal routing using through-substrate vias
12/13/2012WO2012170302A2 Method for providing high etch rate