Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/26/2012CN102842500A Method for depositing liner silicon dioxide layer by utilizing high density plasma chemical vapor deposition (HDP-CVD) process
12/26/2012CN102842499A In-situ formation of silicon and tantalum containing barrier
12/26/2012CN102842498A Polishing method for flocking surface of solar battery and polishing device
12/26/2012CN102842497A Method of patterning a substrate
12/26/2012CN102842496A Preparation method for silicon-based nanometer array patterned substrate and silicon-based epitaxial layer
12/26/2012CN102842495A Preparation method for silicon-based nanometer array patterned substrate and silicon-based epitaxial layer
12/26/2012CN102842494A Production method of wafer
12/26/2012CN102842493A Semiconductor structure and manufacturing method thereof
12/26/2012CN102842492A Crystal silicon laser-assisted aluminum-boron co-doping and electrode preparation method
12/26/2012CN102842491A Production method of metal grid electrode
12/26/2012CN102842490A Self-assembling growth method of compound semiconductor film
12/26/2012CN102842489A Preparation method for low excursion flat belt voltage silicon carbide (SiC) metal oxide semiconductor (MOS) capacitance
12/26/2012CN102842488A Method of double-sided manufacturing device of substrate and substrate
12/26/2012CN102842487A Method for forming pn, pin, n-type and p-type silicon thin film
12/26/2012CN102842486A Ultrasonic washing device for single crystal silicon wafer
12/26/2012CN102842485A Silicon wafer processing device and the processing method thereof
12/26/2012CN102839406A Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
12/26/2012CN102839377A Improved polycrystalline texturing composition and method
12/26/2012CN102837259A Detection device and method for chemical-mechanical polishing end point of copper
12/26/2012CN102347247B Adjustable chip package mold
12/26/2012CN102339759B Ball-mounting method of flip substrate
12/26/2012CN102339743B Planarization method for polysilicon
12/26/2012CN102237355B TFT array substrate and LCD panel
12/26/2012CN102237284B Novel method for manufacturing diode
12/26/2012CN102214577B Method for manufacturing nano switch
12/26/2012CN102184874B Chip bonding method
12/26/2012CN102163606B Charge-detecting chip and manufacturing method thereof
12/26/2012CN102142430B Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof
12/26/2012CN102124552B Apparatus and method of correcting planarity between probe card and chuck plate
12/26/2012CN102117815B Solar battery assembly and preparation method thereof
12/26/2012CN102117782B Composite buried element structure and manufacturing method thereof
12/26/2012CN102112922B Positive photosensitive composition and permanent resist
12/26/2012CN102110626B Method for determining minimum measurable length of serpentine metal wires in wafer
12/26/2012CN102097314B Laser heat treatment device and method for accurately controlling cooling process
12/26/2012CN102082063B Electrode plate and reaction chamber for medium and low frequency plasma processing equipment
12/26/2012CN102053575B Process data monitoring method, device and system
12/26/2012CN102044458B Detection method of degree of damage of plasma
12/26/2012CN102033971B Design method of circuit patterns and rapid thermal annealing method of semiconductor device
12/26/2012CN102027581B Optical cavity furnace for semiconductor wafer processing
12/26/2012CN102024735B High speed substrate aligner apparatus
12/26/2012CN102017096B 成膜装置 Film forming apparatus
12/26/2012CN102017095B Vacuum processing apparatus
12/26/2012CN102013398B Method for manufacturing power MOS (Metal Oxide Semiconductor) transistor
12/26/2012CN101997063B Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof
12/26/2012CN101996871B Method for uniformly implanting a wafer with an ion beam
12/26/2012CN101989613B Organic el display apparatus
12/26/2012CN101978472B Nanofilm protective and release matrices
12/26/2012CN101969053B 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/26/2012CN101964315B Method for forming welding lug
12/26/2012CN101962773B Deep silicon etching method
12/26/2012CN101958238B Method for preparing suspended strain material
12/26/2012CN101952949B Apparatus and method for testing image sensor wafers to identify pixel defects
12/26/2012CN101952947B Self-assembled sidewall spacer
12/26/2012CN101946331B Semiconductor device manufacturing method
12/26/2012CN101924017B Substrate heating unit and substrate treating apparatus including the same
12/26/2012CN101904011B 薄膜半导体装置和场效应晶体管 A thin film semiconductor device and a field-effect transistor
12/26/2012CN101894762B Metal heat-conducting substrate and manufacturing method thereof
12/26/2012CN101884981B 晶片清洁装置 Wafer cleaning device
12/26/2012CN101872744B Method for producing a compound semiconductor MMIC (Monolithic Microwave Integrated Circuit) chip on silicon substrate
12/26/2012CN101864147B Underfill with low viscosity and low linear expansion coefficient
12/26/2012CN101846891B Integrated post-exposure bake track
12/26/2012CN101842505B Bonding wire
12/26/2012CN101834118B Cleaning apparatus and cleaning method of mask member, and organic EL display
12/26/2012CN101807584B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
12/26/2012CN101743631B Boron derived materials deposition method
12/26/2012CN101740406B Method for manufacturing square flat pin-free encapsulation
12/26/2012CN101710581B Encapsulating structure of semiconductor chip and manufacturing technology thereof
12/26/2012CN101689600B Magnetoresistive element and magnetic random access memory
12/26/2012CN101685803B Method for manufacturing array substrate of liquid crystal display device
12/26/2012CN101681873B Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
12/26/2012CN101645460B Semiconductor device having a spacer layer doped with slower diffusing atoms than substrate
12/26/2012CN101638556B Polishing composition and polishing method
12/26/2012CN101604617B Method of auto filling of multiple chips
12/26/2012CN101595244B Vapor deposition methods for forming a metal- containing layer on a substrate
12/26/2012CN101593709B Module including a sintered joint
12/26/2012CN101593698B Method for manufacturing semiconductor device
12/26/2012CN101568821B Method and apparatus for evaluating film quality and thin film device manufacturing system
12/26/2012CN101556937B Method of fabricating a non-volatile memory device
12/26/2012CN101529234B 电极催化剂和酶电极 Electrode catalyst and enzyme electrode
12/26/2012CN101521143B Lining mechanism for semiconductor processing equipment and manufacturing method thereof
12/26/2012CN101499322B CCD device and method of driving same
12/26/2012CN101471231B Method of forming a micro pattern of a semiconductor device
12/26/2012CN101442003B Organosilane-containing material for insulation film, method for producing the same, and semiconductor device
12/26/2012CN101437912B Oxidation-stabilized cmp compositions and methods
12/26/2012CN101432862B Substrate for a microelectronic package and method of fabricating thereof
12/26/2012CN101431058B Semiconductor device and a method of manufacturing the same
12/26/2012CN101427360B Wafer scale die handling
12/26/2012CN101393437B Device for controlling processing system, method for controlling processing system
12/26/2012CN101388438B Organic electroluminescent device, fabrication process of organic electroluminescent device, display device, and fabrication process of display device
12/26/2012CN101359633B Manufacturing method of RFID chip
12/26/2012CN101350294B System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
12/26/2012CN101349847B Display substrate and method of manufacturing the same
12/26/2012CN101345187B Novel method for monitoring and calibrating temperature in semiconductor processing chambers
12/26/2012CN101331080B Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
12/26/2012CN101303963B Method and apparatus for eliminating migration of etching pattern
12/26/2012CN101263078B Contact doping and annealing systems and processes for nanowire thin films
12/26/2012CN101241843B 衬底抛光方法 Substrate polishing method
12/26/2012CN101171674B Junction-isolated vias
12/26/2012CN101171551B Compositions for the removal of post-etch and ashed photoresist residues and bulk photoresist
12/26/2012CN101075584B Method of manufacturing LCD apparatus by using halftone exposure method
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