Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2012
12/27/2012US20120329249 Methods of processing substrates
12/27/2012US20120329248 Method of cutting semiconductor substrate
12/27/2012US20120329247 Laser processing method
12/27/2012US20120329246 Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
12/27/2012US20120329245 Group III Nitride Crystal and Method for Producing the Same
12/27/2012US20120329244 Capping Coating for 3D Integration Applications
12/27/2012US20120329243 Process for fabricating a semiconductor structure employing a temporary bond
12/27/2012US20120329242 Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing soi substrate
12/27/2012US20120329241 Semiconductor manufacturing apparatus and semiconductor manufacturing method
12/27/2012US20120329240 Manufacturing method of semiconductor device and semiconductor device
12/27/2012US20120329239 Methods of fabricating a semiconductor ic having a hardened shallow trench isolation (sti)
12/27/2012US20120329238 Method For Forming A Transient Voltage Suppressor Having Symmetrical Breakdown Voltages
12/27/2012US20120329237 Memory Device
12/27/2012US20120329236 Method of manufacturing device
12/27/2012US20120329235 WET ETCH AND CLEAN CHEMISTRIES FOR MoOx
12/27/2012US20120329234 Method for forming a semiconductor device having a cobalt silicide
12/27/2012US20120329233 Wafer treatment method and fabricating method of mos transistor
12/27/2012US20120329232 Raised Source/Drain Field Effect Transistor
12/27/2012US20120329231 Semiconductor Processing Methods, And Methods Of Forming Isolation Structures
12/27/2012US20120329230 Fabrication of silicon oxide and oxynitride having sub-nanometer thickness
12/27/2012US20120329229 Semiconductor device and method of manufacturing the same
12/27/2012US20120329228 Method for forming a strained semiconductor channel
12/27/2012US20120329227 Formation of Field Effect Transistor Devices
12/27/2012US20120329226 Low power memory device with jfet device structures
12/27/2012US20120329225 Power mos device fabrication
12/27/2012US20120329224 Method of forming fine pattern and method of manufacturing semiconductor device
12/27/2012US20120329223 Semiconductor storage device and method of manufacturing same
12/27/2012US20120329222 Phase change memory device having an improved word line resistance, and methods of making same
12/27/2012US20120329221 Semiconductor Device Having an Enhanced Well Region
12/27/2012US20120329220 Method of Improving Memory Cell Device by Ion Implantation
12/27/2012US20120329219 Through wafer vias and method of making same
12/27/2012US20120329218 Method for manufacturing semiconductor field effect transistor
12/27/2012US20120329217 Nanowire Field Effect Transistors
12/27/2012US20120329216 Wet chemistry processes for fabricating a semiconductor device with increased channel mobility
12/27/2012US20120329215 Methods of Forming Memory Arrays
12/27/2012US20120329214 Semiconductor die package and method for making the same
12/27/2012US20120329213 Flexible electronic device and method for the fabrication of same
12/27/2012US20120329212 Recovery method for poor yield at integrated circuit die panelization
12/27/2012US20120329211 Fabrication method of semiconductor integrated circuit device
12/27/2012US20120329210 Methods of Forming Diodes
12/27/2012US20120329209 Method for forming pattern of metal oxide and method for manufacturing thin film transistor using the same
12/27/2012US20120329208 Synthesis and use of precursors for ald of group va element containing thin films
12/27/2012US20120329207 Semiconductor device package and method of manufacturing thereof
12/27/2012US20120329203 Method for Forming Silicon Thin Film
12/27/2012US20120329193 Graphene sensor
12/27/2012US20120329192 Methods for manufacturing microwell structures of chemically-sensitive sensor arrays
12/27/2012US20120329188 Deposition mask, deposition apparatus, and deposition method
12/27/2012US20120329186 Method For Manufacturing Semiconductor Device
12/27/2012US20120329182 Semiconductor device mounting method
12/27/2012US20120329181 Method for producing liquid-discharge-head substrate
12/27/2012US20120329180 Mems device and fabrication method
12/27/2012US20120329179 Capacitance modification without affecting die area
12/27/2012US20120329178 Novel thermal processing apparatus
12/27/2012US20120328992 Semiconductor device manufacturing method
12/27/2012US20120328797 Method and device for rapidly heating and cooling a substrate and immediately subsequently coating the same under vacuum
12/27/2012US20120328509 Process for preparing a zinc complex in solution
12/27/2012US20120328303 Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating
12/27/2012US20120328181 Pattern inspection apparatus and method
12/27/2012US20120327966 Photonic crystal surface emitting laser and method of manufacturing the same
12/27/2012US20120327965 Semiconductor laser element, method of manufacturing semiconductor laser element, and optical module
12/27/2012US20120327706 Spin-torque transfer memory cell structures with symmetric switching and single direction programming
12/27/2012US20120327321 Display pixel having oxide thin-film transistor (tft) with reduced loading
12/27/2012US20120326766 Silicon Controlled Rectifier with Stress-Enhanced Adjustable Trigger Voltage
12/27/2012US20120326699 Galvanic isolation device and method
12/27/2012US20120326339 Semiconductor device, and method and apparatus for manufacturing the same
12/27/2012US20120326337 Semiconductor Device and Method of Forming EWLB Package With Standoff Conductive Layer Over Encapsulant Bumps
12/27/2012US20120326332 Semiconductor device with encapsulated electrical connection elements and fabrication process thereof
12/27/2012US20120326331 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
12/27/2012US20120326328 Semiconductor device and manufacturing method therefor
12/27/2012US20120326327 Via structure for integrated circuits
12/27/2012US20120326326 Systems and Methods for Producing Flat Surfaces in Interconnect Structures
12/27/2012US20120326325 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
12/27/2012US20120326324 Integrated circuit packaging system with package stacking and method of manufacture thereof
12/27/2012US20120326323 High voltage high package pressure semiconductor package
12/27/2012US20120326320 Semiconductor device and manufacturing method thereof
12/27/2012US20120326319 Method and structure for through-silicon via (tsv) with diffused isolation well
12/27/2012US20120326318 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof
12/27/2012US20120326317 Semiconductor device and manufacturing method therefor
12/27/2012US20120326316 Metal contacts for molecular device junctions and surface-diffusion-mediated deposition
12/27/2012US20120326314 Large-grain, low-resistivity tungsten on a conductive compound
12/27/2012US20120326313 Single exposure in multi-damascene process
12/27/2012US20120326312 In-Situ Formation of Silicon and Tantalum Containing Barrier
12/27/2012US20120326311 Enhanced diffusion barrier for interconnect structures
12/27/2012US20120326309 Optimized annular copper tsv
12/27/2012US20120326306 Pop package and manufacturing method thereof
12/27/2012US20120326305 Semiconductor package and fabrication method thereof
12/27/2012US20120326304 Externally Wire Bondable Chip Scale Package in a System-in-Package Module
12/27/2012US20120326301 Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device
12/27/2012US20120326300 Low profile package and method
12/27/2012US20120326299 Semiconductor chip with dual polymer film interconnect structures
12/27/2012US20120326298 Bump structure with barrier layer on post-passivation interconnect
12/27/2012US20120326297 Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation
12/27/2012US20120326296 Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
12/27/2012US20120326294 Multichip electronic packages and methods of manufacture
12/27/2012US20120326291 Integrated circuit packaging system with underfill and method of manufacture thereof
12/27/2012US20120326290 Silicon carrier optoelectronic packaging
12/27/2012US20120326288 Method of assembling semiconductor device
12/27/2012US20120326287 Dc/dc convertor power module package incorporating a stacked controller and construction methodology
12/27/2012US20120326286 Integrated circuit packaging system with wafer level reconfigured multichip packaging system and method of manufacture thereof
12/27/2012US20120326285 Integrated circuit packaging system with a lead and method of manufacture thereof
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