| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/13/2013 | CN102934202A Mixture gas supply device |
| 02/13/2013 | CN102934201A Substrate treatment device |
| 02/13/2013 | CN102934200A Window assembly for use in substrate processing systems |
| 02/13/2013 | CN102934199A Ozone plenum as uv shutter or tunable uv filter for cleaning semiconductor substrates |
| 02/13/2013 | CN102934198A Normal-temperature bonding device and normal-temperature bonding method |
| 02/13/2013 | CN102933743A Showerhead support structure for improved gas flow |
| 02/13/2013 | CN102933690A Etching composition and its use in a method of making a photovoltaic cell |
| 02/13/2013 | CN102933673A Sheet product |
| 02/13/2013 | CN102933633A The molded article with tiny unevenness on surface and the manufacturing method of the same |
| 02/13/2013 | CN102933472A Conveyance system and method of communication in conveyance system |
| 02/13/2013 | CN102933374A Method for producing article having fine recessed and projected structure on surface, mold release treatment method for mold, and active energy ray-curable resin composition for mold surface release treatment |
| 02/13/2013 | CN102933373A Method for producing article having fine surface irregularities |
| 02/13/2013 | CN102933363A Method of manufacturing product having micro protrusion and recess face structure on surface thereof and manufacturing device thereof |
| 02/13/2013 | CN102933347A 激光加工方法 The laser processing method |
| 02/13/2013 | CN102933038A Method and apparatus for accurately applying structures to a substrate |
| 02/13/2013 | CN102931282A Preparation method of back polished silicon chip |
| 02/13/2013 | CN102931276A Fixed type template device for solar component lamination table |
| 02/13/2013 | CN102931239A Semiconductor device and manufacturing method thereof |
| 02/13/2013 | CN102931237A Structure of perpendicular asymmetric ring gating metal oxide semiconductor field effect transistor (MOSFET) device and manufacturing method thereof |
| 02/13/2013 | CN102931235A MOS (Metal Oxide Semiconductor) transistor and manufacturing method thereof |
| 02/13/2013 | CN102931234A LDMOS (Laterally Diffused Metal Oxide Semiconductor) device and manufacturing method thereof |
| 02/13/2013 | CN102931233A N-channel metal oxide semiconductor (NMOS) transistor and forming method thereof |
| 02/13/2013 | CN102931232A MOS (Metal Oxide Semiconductor) transistor and forming method thereof |
| 02/13/2013 | CN102931230A Double-heterojunction gallium nitride based HEMT (High Electron Mobility Transistor) taking aluminum-gallium-nitrogen as high-resistance layer and manufacturing method thereof |
| 02/13/2013 | CN102931229A AlGaN/GaN/InGaN double hetero-junction material and production method thereof |
| 02/13/2013 | CN102931228A Reverse conducting IGBT (Insulated Gate Bipolar Translator) device and manufacturing method thereof |
| 02/13/2013 | CN102931227A Power semiconductor device structure and preparation method on passivation semiconductor contact surface |
| 02/13/2013 | CN102931226A Self-aligned germanium-silicon heterojunction bipolar triode and manufacturing method for same |
| 02/13/2013 | CN102931225A Bipolar junction transistor (BJT) and manufacturing method thereof |
| 02/13/2013 | CN102931224A Interface transition layer composite structure used for P-SiC ohmic contact and preparation method thereof |
| 02/13/2013 | CN102931222A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/13/2013 | CN102931221A Semiconductor device and method of manufacturing the same |
| 02/13/2013 | CN102931220A Germanium-silicon heterojunction bipolar triode power device and manufacturing method thereof |
| 02/13/2013 | CN102931219A Semiconductor device and production method thereof |
| 02/13/2013 | CN102931218A Junction terminal structure for super junction device |
| 02/13/2013 | CN102931216A Insulated gate bipolar transistor structure integrated with Schottky diode and preparation method thereof |
| 02/13/2013 | CN102931215A IGBT (Insulated Gate Bipolar Transistor) structure integrated with low leakage-current Schottky diode and preparation method thereof |
| 02/13/2013 | CN102931211A Organic light-emitting display device and method of manufacturing same |
| 02/13/2013 | CN102931210A A display device and a method of making the same |
| 02/13/2013 | CN102931209A Organic light-emitting display apparatus and method of manufacturing same |
| 02/13/2013 | CN102931208A Organic light-emitting display and method of manufacturing the same |
| 02/13/2013 | CN102931205A Memory device and forming method thereof |
| 02/13/2013 | CN102931203A Multiple gate dielectric structures and methods of forming the same |
| 02/13/2013 | CN102931199A Display panel, manufacturing method thereof and display device |
| 02/13/2013 | CN102931198A Thin-film transistor array substrate, organic light emitting display device comprising the same and manufacturing method of the same |
| 02/13/2013 | CN102931197A Array substrate and manufacturing method thereof, and display device |
| 02/13/2013 | CN102931195A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 02/13/2013 | CN102931194A Semiconductor device and method for fabricating the same |
| 02/13/2013 | CN102931191A Semiconductor device and manufacturing method thereof |
| 02/13/2013 | CN102931189A Array substrate and manufacturing and maintaining method thereof and display device |
| 02/13/2013 | CN102931184A 半导体结构及其制法 The semiconductor structure Jiqizhifa |
| 02/13/2013 | CN102931181A Packaging manufacture method of integrating two bidirectional triode thyristor chips in one photoelectric coupler |
| 02/13/2013 | CN102931172A Test device, test device manufacturing method, semiconductor device and semiconductor device manufacturing method |
| 02/13/2013 | CN102931170A Detecting structure, forming method and detecting method |
| 02/13/2013 | CN102931168A Packaging substrate and manufacturing method thereof |
| 02/13/2013 | CN102931166A Semiconductor package structure with low inductance |
| 02/13/2013 | CN102931165A Package substrate and manufacturing method thereof |
| 02/13/2013 | CN102931162A 封装结构及其制作方法 Package structure and production methods |
| 02/13/2013 | CN102931161A Semiconductor packaging member and making method of same |
| 02/13/2013 | CN102931157A Embedded package and method for manufacturing same |
| 02/13/2013 | CN102931156A Structure and manufacturing method of semiconductor chip |
| 02/13/2013 | CN102931147A Optical component and manufacturing method for same |
| 02/13/2013 | CN102931145A Method for forming pad structure |
| 02/13/2013 | CN102931144A Integration method of high-sensitive temperature-controlled thin film hybrid integrated circuit |
| 02/13/2013 | CN102931143A Method for manufacturing NOR flash device |
| 02/13/2013 | CN102931142A Dual-stress thin film preparation method and semiconductor device |
| 02/13/2013 | CN102931141A Dual-stress thin film preparation method and semiconductor device |
| 02/13/2013 | CN102931140A Semiconductor device formed by non-autocollimation technology and method |
| 02/13/2013 | CN102931139A Array substrate and manufacture method and display device thereof |
| 02/13/2013 | CN102931138A Array substrate and manufacturing method thereof and display device |
| 02/13/2013 | CN102931137A LTPS-TFT (Low Temperature Poly Silicon-Thin Film Transistor) array substrate and manufacture method thereof, and display device |
| 02/13/2013 | CN102931136A A method for manufacturing a flexible display module |
| 02/13/2013 | CN102931135A Through hole preferred copper interconnection manufacture method |
| 02/13/2013 | CN102931134A Making method of contact hole |
| 02/13/2013 | CN102931133A Method for improving etching uniformity in silicon piercing process |
| 02/13/2013 | CN102931132A Method for manufacturing cmos image sensor |
| 02/13/2013 | CN102931131A Method for forming first copper metal layer |
| 02/13/2013 | CN102931130A Method for repairing ashed side wall |
| 02/13/2013 | CN102931129A Method for manufacturing semiconductor device |
| 02/13/2013 | CN102931128A Method for rounding edge corner of shallow groove separation |
| 02/13/2013 | CN102931127A Method for forming isolation structure of anti-radiation hardening shallow groove |
| 02/13/2013 | CN102931126A Method for increasing narrow width effect of MOS (Metal Oxide Semiconductor) device |
| 02/13/2013 | CN102931125A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/13/2013 | CN102931124A Integration method for high-density thin film hybrid integrated circuit |
| 02/13/2013 | CN102931123A Fixing semiconductor die in dry and pressure supported assembly processes |
| 02/13/2013 | CN102931122A Calibration method of light emitting diode (LED) wager automatic sorting machine |
| 02/13/2013 | CN102931121A Integrated circuit packaging equipment and traction device thereof |
| 02/13/2013 | CN102931120A Workpiece transmission system |
| 02/13/2013 | CN102931119A Blade module for treating surface of substrate |
| 02/13/2013 | CN102931118A Epitaxy defect analyzing structure and manufacturing method thereof as well as epitaxy defect analyzing method |
| 02/13/2013 | CN102931117A Method for measuring deformation in wafer transmission by using principle of light reflection |
| 02/13/2013 | CN102931116A Synchronous defect detecting method for memorizer |
| 02/13/2013 | CN102931115A Wafer in-situ detection device and water bracket as well as wafer in-site detection method |
| 02/13/2013 | CN102931114A Wafer testing method |
| 02/13/2013 | CN102931113A Method and system for testing safe operating area of semiconductor device |
| 02/13/2013 | CN102931112A Clamp, device and method for guaranteeing thickness of plastic package body of fully-packaged product |
| 02/13/2013 | CN102931111A Method for forming semiconductor packaging structures |
| 02/13/2013 | CN102931110A Method for packaging semiconductor component |
| 02/13/2013 | CN102931109A Method for forming semiconductor devices |
| 02/13/2013 | CN102931108A Encapsulating method for flip chip |