Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/21/2013US20130069041 Method for manufacturing graphene nano-ribbon, mosfet and method for manufacturing the same
03/21/2013US20130069039 Ge QUANTUM DOTS FOR DISLOCATION ENGINEERING OF III-N ON SILICON
03/21/2013US20130069030 Resistive memory cell including integrated select device and storage element
03/21/2013US20130069029 Non-volatile memory device and manufacturing method of the same
03/21/2013US20130069028 Select devices for memory cell applications
03/21/2013US20130068970 UV Irradiation Apparatus Having UV Lamp-Shared Multiple Process Stations
03/21/2013US20130068592 Multi-generational carrier platform
03/21/2013US20130068514 Flip-chip carrier and fabricating method of mps-c2 package utilized from the same
03/21/2013US20130068390 Method and apparatus for cleaning a substrate surface
03/21/2013US20130068248 Semiconductor device cleaning method
03/21/2013US20130068159 Manufacturing Method of Semiconductor Device and Substrate Processing Apparatus
03/21/2013US20130068013 Sensor element with engineered silicide
03/21/2013DE112011102071T5 Verfahren, Vorrichtung und Entwurfsstruktur für eine Silicium-auf-Isolator-Schaltung mit hoher Bandbreite und verringerter Ladungsschicht A method, apparatus and structure design for a silicon-on-insulator circuit including a high bandwidth and reduced charge layer
03/21/2013DE112011101899T5 Verarbeitung von Substraten unter Verwendung eines temporären Trägers Processing of substrates, using a temporary support
03/21/2013DE112011101897T5 Organische elektronische Vorrichtungen Organic electronic devices
03/21/2013DE112011101895T5 Laserablation mit Extraktion des abgetrennten Materials Laser ablation with extraction of the separated material
03/21/2013DE112009002717T5 Elektrodenschaltung, Schichterzeugungsvorrichtung, Elektrodeneinheit und Schichterzeugungsverfahren Electrode circuit layer forming apparatus electrode unit and layer forming method
03/21/2013DE112007001436B4 CMOS-Schaltungen mit geringem Kontaktwiderstand CMOS circuits with low contact resistance
03/21/2013DE102012216091A1 Mehrgenerationen-Trägerplattform Multi-generational support platform
03/21/2013DE102012215365A1 Grabenisolationsstruktur Grave isolation structure
03/21/2013DE102012206277A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
03/21/2013DE102012108610A1 Chipmodul und Verfahren zum Herstellen eines Chipmoduls Chip module and method of producing a chip module,
03/21/2013DE102012108478A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation
03/21/2013DE102012107252A1 Großformatiger Wafer-FOUP Large-sized wafer FOUP
03/21/2013DE102012106131A1 Organische lichtemittierende anzeigevorrichtung und verfahren zum herstellen derselben An organic light emitting display device and method of manufacturing the same
03/21/2013DE102011113824A1 Manufacturing photonic component in a surface layer of a semiconductor wafer, comprises e.g. focusing the laser beam on the material at a predetermined depth, and altering a characteristic of the material in the focus-region
03/21/2013DE102011113775A1 Verfahren zur Herstellung eines optoelektronischen Bauelements A process for producing an optoelectronic component
03/21/2013DE102011113642A1 Verfahren zur Herstellung eines Halbleiterbauelementes unter Verwendung eines Hilfsträgers A process for producing a semiconductor device using an auxiliary carrier
03/21/2013DE102011113549A1 Semiconductor component e.g. diode, has dopant region formed with oxygen/vacancy complex for specified distance from upper side of semiconductor body to lower side of body and comprising oxygen concentration within specified range
03/21/2013DE102011090164A1 Reparatur geschädigter Oberflächenbereiche von empfindlichen Dielektrika mit kleinem ε von Mikrostrukturbauelementen nach einer Plasmabehandlung durch in-situ-Behandlung Repair of damaged surface areas of sensitive dielectrics with small ε microstructure devices according to a plasma treatment by in situ treatment
03/21/2013DE102011088584A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
03/21/2013DE102011083139A1 Substrate processing system such as vacuum coating equipment, has substrate carriers that mesh with each other in substrate transfer position such that they are pivoted back and forth between two tilt positions, in inclined manner
03/21/2013DE102011080589B4 Herstellung einer Kanalhalbleiterlegierung durch Erzeugen einer nitridbasierten Hartmaskenschicht Preparing a semiconductor alloy channel by generating a nitride-based hardmask layer
03/21/2013DE102011053641A1 SiC-MOSFET mit hoher Kanalbeweglichkeit SiC MOSFET with high channel mobility
03/21/2013DE102011002769B4 Halbleiterbauelement und Verfahren zur Herstellung einer Hybridkontaktstruktur mit Kontakten mit kleinem Aspektverhältnis in einem Halbleiterbauelement A semiconductor device and method for manufacturing a hybrid contact structure contacts with a small aspect ratio in a semiconductor device
03/21/2013DE102009038941B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
03/21/2013DE102008064728B4 Verfahren zum Herstellen eines siliziumbasierten Metalloxidhalbleiterbauelements A method of manufacturing a silicon-based Metalloxidhalbleiterbauelements
03/21/2013DE102008006962B4 Verfahren zur Herstellung von Halbleiterbauelementen mit einem Kondensator im Metallisierungssystem A process for producing semiconductor devices having a capacitor in metallization
03/21/2013DE102008001531B4 Schaltung, Herstellungsverfahren und Verwendung eines Bauelements mit Doppelgate-FinFET Circuit manufacturing process and use of a device having double-gate FinFET
03/21/2013DE102007015503B4 Verfahren und System zum Steuern des chemisch-mechanischen Polierens durch Berücksichtigung zonenspezifischer Substratdaten A method and system for controlling the chemical mechanical polishing zone by taking into account specific data substrate
03/21/2013DE102007004060B4 Verwendung einer Ätzlösung aufweisend Wasser, Salpetersäure und Schwefelsäure und Ätzverfahren Using an etching solution comprising water, nitric acid and sulfuric acid and etching
03/21/2013DE102006027841B4 Verfahren zur Herstellung eines III-Nitrid-Halbleiter-Bauteils A process for producing a III-nitride semiconductor device
03/21/2013DE102005002526B4 Wärmeunterstützte Magnetspeichervorrichtung mit gesteuerter Temperatur Heat-assisted magnetic memory device with controlled temperature
03/21/2013CA2846163A1 Integrated building based air handler for server farm cooling system
03/20/2013EP2571065A1 Group iii nitride semiconductor device and method for producing same
03/20/2013EP2571059A1 Semiconductor device, active matrix substrate, and display device
03/20/2013EP2571058A1 Circuit board and display device
03/20/2013EP2571057A2 Normally-off semiconductor devices and methods of fabricating the same
03/20/2013EP2571053A1 Power semiconductor arrangement and method of forming thereof
03/20/2013EP2571049A1 Electronic component and method for producing same
03/20/2013EP2571046A1 Transfer device
03/20/2013EP2571045A2 Flip-chip hybridisation method for forming sealed cavities and systems obtained by such a method
03/20/2013EP2571044A1 Organic semiconductor film and method for manufacturing the same, and stamp for contact printing
03/20/2013EP2571043A1 Flexible semiconductor device, manufacturing method for same, and image display device
03/20/2013EP2571042A1 Method for vapor-phase epitaxial growth of semiconductor film
03/20/2013EP2570790A2 Shear test method
03/20/2013EP2570523A1 Method for producing gallium trichloride gas and method for producing nitride semiconductor crystal
03/20/2013EP2570522A1 Epitaxial silicon carbide single-crystal substrate and method for producing the same
03/20/2013EP2569802A2 Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices
03/20/2013EP2569801A1 Process for producing a conducting electrode
03/20/2013EP2569646A2 Resilient probes for electrical testing
03/20/2013EP2503029B1 Process for etching a recessed structure filled with tin or a tin alloy
03/20/2013EP2487708A9 Method for obtaining a network of nanometric terminals
03/20/2013EP2372755B1 Method for permanently connecting two metal surfaces
03/20/2013EP2239766B1 Bonding wire for semiconductor device
03/20/2013EP1267402B1 Semiconductor device and method of production of same
03/20/2013CN202817009U Silicon chip transmission device without directive wheel
03/20/2013CN202816959U Memory device
03/20/2013CN202816900U Pressure tool for assisting welding of lead frame
03/20/2013CN202816899U Semiconductor wire bonding pressure plate capable of improving wire bonding yield rate
03/20/2013CN202816898U Semi-automatic battery string sucker
03/20/2013CN202816897U Vacuum suction nozzle for transferring semiconductor electronic elements
03/20/2013CN202816896U Bare chip pick device
03/20/2013CN202816895U Transfer part
03/20/2013CN202816894U Automatic tube arranging mechanism for integrated circuit receiving tubes
03/20/2013CN202816893U Material guide rail system for semiconductor lead frame
03/20/2013CN202816892U Device for conveying semiconductor packaging equipment
03/20/2013CN202816891U Magazine for containing semiconductor lead frames
03/20/2013CN202816890U Rail for conveying semiconductor devices
03/20/2013CN202816889U Basket guiding device
03/20/2013CN202816888U Vacuum cavity provided with temperature measuring devices
03/20/2013CN202816887U Transistor magnet ring sleeving and dispensing machine
03/20/2013CN202816886U Lower die of semiconductor lead cutting machine
03/20/2013CN202816885U Automatic cleaner for solar panel
03/20/2013CN202816884U Bonding head device for full-automatic lead bonding equipment
03/20/2013CN202816883U Pressure plate for packaging semiconductor chips
03/20/2013CN202816882U Die holder structure for semiconductor packaging
03/20/2013CN202816881U Device for packaging chip by using adhesive
03/20/2013CN202816880U A high vacuum press seal machine
03/20/2013CN202816879U Cutting forming die with cutter for cutting residual gum of semiconductor lead frame
03/20/2013CN202816878U SMD-0.5 electrical aging fixture with heating panel
03/20/2013CN202816877U Source bottle used for loading diffusion liquid state sources
03/20/2013CN202816864U A bottom electrode device in an etching electrode machine
03/20/2013CN202805485U Accurate cavity positioning block structure of semiconductor packaging mould
03/20/2013CN202805205U 机器人手以及机器人 Robot hand and robot
03/20/2013CN202804536U Conducting wire bracket pressing plate for encapsulation of semiconductor device
03/20/2013CN202803802U Improved press mold head for semiconductor component packaging
03/20/2013CN202803537U Die bonder adhesive dispensing seat for semiconductor package
03/20/2013CN1954265B Antireflective film-forming composition containing vinyl ether compound
03/20/2013CN102986033A Conductivity modulation in a silicon carbide bipolar junction transistor
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