Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/21/2013WO2012144872A3 Apparatus and method for fabricating ingot
03/21/2013WO2012144851A3 Apparatus for fabricating ingot
03/21/2013WO2012125275A3 Apparatus for monitoring and controlling substrate temperature
03/21/2013WO2010085949A3 Substrate carrier for mounting substrates
03/21/2013US20130072411 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
03/21/2013US20130072091 Method for the double-side polishing of a semiconductor wafer
03/21/2013US20130072035 Thermal plate with planar thermal zones for semiconductor processing
03/21/2013US20130072034 Substrate processing apparatus and method for manufacturing semiconductor device
03/21/2013US20130072033 Plasma cvd method, method for forming silicon nitride film and method for manufacturing semiconductor device
03/21/2013US20130072032 Method for depositing a silicon oxide layer of same thickness on silicon and on silicon-germanium
03/21/2013US20130072031 Apparatus and Methods for Low K Dielectric Layers
03/21/2013US20130072030 Method for processing high-k dielectric layer
03/21/2013US20130072029 Surface treating method and film depositing method
03/21/2013US20130072028 Process for fabricating semiconductor device and method of fabricating metal oxide semiconductor device
03/21/2013US20130072027 Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer readable recording medium
03/21/2013US20130072026 Formation of a Masking Layer on a Dielectric Region to Facilitate Formation of a Capping Layer on Electrically Conductive Regions Separated by the Dielectric Region
03/21/2013US20130072025 Component of a substrate support assembly producing localized magnetic fields
03/21/2013US20130072024 Apparatus for spatial and temporal control of temperature on a substrate
03/21/2013US20130072023 Method of controlled lateral etching
03/21/2013US20130072022 Method of forming patterns for semiconductor device
03/21/2013US20130072021 Composition and method for polishing aluminum semiconductor substrates
03/21/2013US20130072020 Method For Ensuring DPT Compliance for Auto-Routed Via Layers
03/21/2013US20130072019 Methods for forming semiconductor devices
03/21/2013US20130072018 Repair of Damaged Surface Areas of Sensitive Low-K Dielectrics of Microstructure Devices After Plasma Processing by In Situ Treatment
03/21/2013US20130072017 Lithographic Method for Making Networks of Conductors Connected by Vias
03/21/2013US20130072016 Methods of forming conductive contacts with reduced dimensions
03/21/2013US20130072015 Inexpensive Electrode Materials to Facilitate Rutile Phase Titanium Oxide
03/21/2013US20130072014 Method for Forming Contact in an Integrated Circuit
03/21/2013US20130072013 Etching Method and Apparatus
03/21/2013US20130072012 Method For Forming Package Substrate With Ultra-Thin Seed Layer
03/21/2013US20130072011 Method of repairing probe pads
03/21/2013US20130072010 Nitride semiconductor device
03/21/2013US20130072009 Method for preparing a substrate by implantation and irradiation
03/21/2013US20130072008 Technique for ion implanting a target
03/21/2013US20130072007 Method for Fabricating Black Silicon by Using Plasma Immersion Ion Implantation
03/21/2013US20130072006 Methods of Forming Doped Regions in Semiconductor Substrates
03/21/2013US20130072005 Method for manufacturing nitride semiconductor substrate
03/21/2013US20130072004 Method of integrating high voltage devices
03/21/2013US20130072002 Batch-Type Remote Plasma Processing Apparatus
03/21/2013US20130072001 Nitride Nanowires and Method of Producing Such
03/21/2013US20130072000 Thin film processing equipment and the processing method thereof
03/21/2013US20130071999 High throughput epitaxial lift off for flexible electronics
03/21/2013US20130071998 Electrical Fuse With Metal Line Migration
03/21/2013US20130071997 Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
03/21/2013US20130071996 Joint method, joint apparatus and joint system
03/21/2013US20130071995 Method of Manufacturing a Semiconductor Device
03/21/2013US20130071994 Method of integrating high voltage devices
03/21/2013US20130071993 Preparation Method for Full-Isolated SOI with Hybrid Crystal Orientations
03/21/2013US20130071992 Semiconductor process
03/21/2013US20130071991 Electrode Treatments for Enhanced DRAM Performance
03/21/2013US20130071990 Yttrium and Titanium High-K Dielectric Films
03/21/2013US20130071989 Single-sided non-noble metal electrode hybrid mim stack for dram devices
03/21/2013US20130071988 Interfacial layer for dram capacitor
03/21/2013US20130071987 Band Gap Improvement In DRAM Capacitors
03/21/2013US20130071986 Partial etch of dram electrode
03/21/2013US20130071981 Fabricating method of semiconductor elements
03/21/2013US20130071980 Method for fabricating a finfet device
03/21/2013US20130071979 Field Effect Transistor Device with Raised Active Regions
03/21/2013US20130071978 Fabricating method of transistor
03/21/2013US20130071977 Methods for fabricating integrated circuits having gate to active and gate to gate interconnects
03/21/2013US20130071976 Nonvolatile memory devices and methods of forming the same
03/21/2013US20130071975 Method and apparatus for manufacturing semiconductor device
03/21/2013US20130071974 Single-Shot Semiconductor Processing System and Method Having Various Irradiation Patterns
03/21/2013US20130071973 Method for fabricating thin film transistor array substrate
03/21/2013US20130071971 Semiconductor device and method of manufacturing the same
03/21/2013US20130071970 Manufacturing method of semiconductor device
03/21/2013US20130071969 Electronic assembly apparatus and associated methods
03/21/2013US20130071967 Method for Making a Nickel Film for Use as an Electrode of an N-P Diode or Solar Cell
03/21/2013US20130071964 Method of manufacturing an electromechanical transducer
03/21/2013US20130071963 Method of fabricating a thin film transistor and method of fabricating an organic light-emitting display device
03/21/2013US20130071958 Manufacturing method of semiconductor integrated circuit device
03/21/2013US20130071957 System and Methods for Semiconductor Device Performance Prediction During Processing
03/21/2013US20130071956 Die Bonder and Bonding Method
03/21/2013US20130071955 Plasma etching method
03/21/2013US20130071954 Magnetic random access memory (mram) with enhanced magnetic stiffness and method of making same
03/21/2013US20130071779 Reflective mask blank and method of manufacturing a reflective mask
03/21/2013US20130071776 Generalization Of Shot Definitions For Mask And Wafer Writing Tools
03/21/2013US20130071671 Silicon nitride film for semiconductor element, and method and apparatus for manufacturing silicon nitride film
03/21/2013US20130071658 Adhesive composition, adhesive tape, method for processing semiconductor wafer and method for producing tsv wafer
03/21/2013US20130071618 Thin Film, Pattern Layer, And Manufacturing Method Thereof
03/21/2013US20130071615 Substrates and Method of Preparing the Same
03/21/2013US20130071505 Molding device for semiconductor chip package
03/21/2013US20130071220 Semiconductor chip pick-up method and semiconductor chip pick-up apparatus
03/21/2013US20130071218 Low Variability Robot
03/21/2013US20130071208 Wafer transport system
03/21/2013US20130070800 Semiconductor laser diodes
03/21/2013US20130070747 Modified Preamble Structure for IEEE 802.11A Extensions to Allow for Coexistence and Interoperability Between 802.11A Devices and Higher Data Rate, MIMO or Otherwise Extended Devices
03/21/2013US20130070514 Integrated circuit with on-die distributed programmable passive variable resistance fuse array and method of making same
03/21/2013US20130070511 Select devices for memory cell applications
03/21/2013US20130070508 Semiconductor device and method for manufacturing same
03/21/2013US20130070438 Integrated circuit packaging system with interposer and method of manufacture thereof
03/21/2013US20130069964 Method and apparatus for providing complimentary state retention
03/21/2013US20130069712 Power semiconductor devices and fabrication methods
03/21/2013US20130069622 Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation
03/21/2013US20130069252 Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
03/21/2013US20130069251 Wiring substrate, method of manufacturing the same, and semiconductor device
03/21/2013US20130069250 Die substrate with reinforcement structure
03/21/2013US20130069248 Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
03/21/2013US20130069247 Apparatus for stacked electronic circuitry and associated methods
03/21/2013US20130069245 Semiconductor package and method for manufacturing the semiconductor package
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