| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/19/1988 | US4720419 Steel coated with glaze |
| 01/19/1988 | US4720407 Double-walled quartz-glass tube for semiconductor-technology processes |
| 01/19/1988 | US4720401 Enhanced adhesion between metals and polymers |
| 01/19/1988 | US4720396 Solder finishing integrated circuit package leads |
| 01/19/1988 | US4720323 Method for manufacturing a semiconductor device |
| 01/19/1988 | US4720317 Method for dicing a semiconductor wafer |
| 01/19/1988 | US4720308 Method for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced thereby |
| 01/19/1988 | US4720191 Method and apparatus for light span microscopic dark-field display of objects |
| 01/19/1988 | US4720130 Industrial robot hand with position sensor |
| 01/19/1988 | US4719705 Reticle transporter |
| 01/19/1988 | CA1231599A1 Method for controlling lateral diffusion of silicon in a self-aligned tisi.sub.2 process |
| 01/14/1988 | WO1988000413A1 Transistor arrangement with an output transistor |
| 01/14/1988 | WO1988000392A1 Method for fabricating devices in iii-v semiconductor substrates and devices formed thereby |
| 01/14/1988 | WO1988000391A1 Method for providing a metal-semiconductor contact |
| 01/14/1988 | WO1988000362A1 Improved registration method in photolithography and equipment for carrying out this method |
| 01/14/1988 | DE3722438A1 Device for drying electrical resistors and other electronic components fitted with axial terminals |
| 01/14/1988 | DE3719597A1 Metal oxide semiconductor devices having threshold stability and fewer short-circuits between gate electrodes and source electrodes |
| 01/13/1988 | EP0252888A2 Photopolymer multilayer structure for the production of a GaAs self aligning double recess |
| 01/13/1988 | EP0252814A1 Process for the programmable laser linking of two superposed conductors of an integrated-circuit interconnection network, and resulting integrated circuit |
| 01/13/1988 | EP0252757A2 Photoelectric conversion device |
| 01/13/1988 | EP0252739A2 Adhesive sheets for sticking wafers thereto |
| 01/13/1988 | EP0252714A2 Semiconducteur integrated circuit device having a tester circuit |
| 01/13/1988 | EP0252697A2 Semiconductor wafer temperature measuring device and method |
| 01/13/1988 | EP0252679A2 Semiconductor device having two electrodes with an insulating film between them |
| 01/13/1988 | EP0252673A2 Removable pellicle and method |
| 01/13/1988 | EP0252667A2 Chemical vapour deposition methods |
| 01/13/1988 | EP0252574A2 Method and apparatus for reducing particulates on photomasks |
| 01/13/1988 | EP0252451A2 Substrate of hybrid ic, method of forming a circuit pattern and apparatus of forming the same |
| 01/13/1988 | EP0252450A2 Integrated circuit isolation process |
| 01/13/1988 | EP0252439A2 Method and apparatus for surface treating of substrates |
| 01/13/1988 | EP0252300A1 Metal to semiconductor ohmic contacts |
| 01/13/1988 | EP0252279A2 Process and apparatus for seperating silicon wafers, to be used for solar cells, from according to the horizontal ribbon pulling growth method prepared silicon ribbon |
| 01/13/1988 | EP0252262A2 Post dry-etch cleaning method for restoring wafer properties |
| 01/13/1988 | EP0252236A2 Vertical MOS type semiconductor device |
| 01/13/1988 | EP0252206A2 Method of fabricating semiconductor structure |
| 01/13/1988 | EP0252179A1 Process for producing undercut mask profiles |
| 01/13/1988 | EP0252115A1 Compressive pedestal for microminiature connections. |
| 01/13/1988 | EP0161256B1 Graft polymerized sio 2? lithographic masks |
| 01/13/1988 | EP0140965B1 Method of making a nonvolatile semiconductor memory device |
| 01/13/1988 | CN87202679U Quartz cavity for semi conductor speeded heat-processing system |
| 01/13/1988 | CN87103690A Separation of silicon belt produced by horizontal draw process |
| 01/13/1988 | CN87103643A Article transfer apparatus |
| 01/12/1988 | US4719501 Semiconductor device having junction formed from two different hydrogenated polycrystalline silicon layers |
| 01/12/1988 | US4719500 Semiconductor device and a process of producing same |
| 01/12/1988 | US4719498 Optoelectronic integrated circuit |
| 01/12/1988 | US4719410 Redundancy-secured semiconductor device |
| 01/12/1988 | US4719185 Method of making shallow junction complementary vertical bipolar transistor pair |
| 01/12/1988 | US4719184 Process for the fabrication of integrated structures including nonvolatile memory cells with layers of self-aligned silicon and associated transistors |
| 01/12/1988 | US4719183 Semiconductors; three-dimensional integrated circuits |
| 01/12/1988 | US4719167 Positive photoresist composition with 1,2 naphthoquinone diazide and novolak resin condensed from mixture of m-cresol, p-cresol, and 2,5-xylenol with formaldehyde |
| 01/12/1988 | US4719166 Positive-working photoresist elements containing anti-reflective butadienyl dyes which are thermally stable at temperatures of at least 200° C. |
| 01/12/1988 | US4719161 Peroxopolytungsten compound as absorber for x-rays |
| 01/12/1988 | US4719155 Epitaxial layer structure grown on graded substrate and method of growing the same |
| 01/12/1988 | US4719125 Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology |
| 01/12/1988 | US4719124 Low temperature deposition utilizing organometallic compounds |
| 01/12/1988 | US4719123 Method for fabricating periodically multilayered film |
| 01/12/1988 | US4719122 Chemical vapor deposition, flat and scattered light |
| 01/12/1988 | US4718977 Integrated circuits, aluminum and titanium |
| 01/12/1988 | US4718975 Particle shield |
| 01/12/1988 | US4718973 Process for plasma etching polysilicon to produce rounded profile islands |
| 01/12/1988 | US4718967 Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| 01/12/1988 | US4718681 Sample chucking apparatus |
| 01/12/1988 | US4718591 Wire bonder with open center of motion |
| 01/12/1988 | US4718549 Container for the storage and shipment of silicon disks or wafers |
| 01/12/1988 | US4718539 Conveyor means |
| 01/12/1988 | CA1231464A1 Method and apparatus of forming thick film circuits |
| 01/12/1988 | CA1231357A1 Articulated arm transfer device |
| 01/07/1988 | EP0252027A2 Electrically alterable, nonvolatile, floating gate type memory device with reduced tunnelling area and fabrication thereof |
| 01/07/1988 | EP0251927A2 Bipolar transistor with polysilicon stringer base contact |
| 01/07/1988 | EP0251910A2 CMOS output buffer circuit |
| 01/07/1988 | EP0251879A2 Solder finishing integrated circuit package leads |
| 01/07/1988 | EP0251828A1 Insulating resin composition and semiconductor device using the same |
| 01/07/1988 | EP0251825A1 Gas treatment apparatus and method |
| 01/07/1988 | EP0251767A2 Insulated gate type semiconductor device and method of producing the same |
| 01/07/1988 | EP0251682A2 Integrated bipolar-MOS device |
| 01/07/1988 | EP0251681A2 Improvements in the manufacturing of integrated circuits using holographic techniques |
| 01/07/1988 | EP0251650A1 Process for the formation of phosphosilicate glass coating |
| 01/07/1988 | EP0251578A2 Semiconductor structures including quantum well wires and boxes |
| 01/07/1988 | EP0251566A1 Process for fabricating integrated-circuit devices utilizing multilevel resist structure |
| 01/07/1988 | EP0251523A1 A method of producing a semiconductor device showing a good ohmic contact between a plurality of wiring layers |
| 01/07/1988 | EP0251506A1 Process for producing a double diffused MOS transistor structure |
| 01/07/1988 | EP0251500A1 Apparatus and methods for inspection of electrical materials and components |
| 01/07/1988 | EP0251458A2 Process for manufacturing indium-phosphide devices |
| 01/07/1988 | EP0251447A2 Process for manufacturing a semiconductor device using a mask, and resist material therefor |
| 01/07/1988 | EP0251347A1 Method of covering a device with a first layer of silicon nitride and with a second layer of a polyimide, and device covered by means of the method |
| 01/07/1988 | EP0251280A2 Method of gettering semiconductor wafers with a laser beam |
| 01/07/1988 | EP0251241A2 Top imaged resists |
| 01/07/1988 | EP0251212A2 Series resistive network |
| 01/07/1988 | EP0250990A1 Wafer transfer apparatus |
| 01/07/1988 | EP0250964A2 Reticle transporter |
| 01/07/1988 | EP0250934A2 Device for contacting micro-electronic modules being tested |
| 01/07/1988 | EP0250886A2 Semiconductor heterostructure adapted for low temperature operation |
| 01/07/1988 | EP0250869A1 Semiconductor integrated circuit containing analogous and digital components |
| 01/07/1988 | EP0250762A2 Formation of permeable polymeric films or layers via leaching techniques |
| 01/07/1988 | EP0250736A2 Assembly for handling flexible film substrates |
| 01/07/1988 | EP0250722A2 Method of producing adjacent tubs implanted with different conductivity-type ions for highly integrated CMOS devices |
| 01/07/1988 | EP0250721A2 Integrated circuit comprising bipolar and complementary MOS transistors on a common substrate, and production method |
| 01/07/1988 | EP0250611A1 Process for eliminating a patterned masking layer |
| 01/07/1988 | EP0250603A1 Process for forming thin film of compound semiconductor |
| 01/07/1988 | EP0250541A1 Chip interface mesa |