| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/22/1988 | US4732858 Adhesion promoting product and process for treating an integrated circuit substrate |
| 03/22/1988 | US4732842 Exposure method of semiconductor wafer by rare gas-mercury discharge lamp |
| 03/22/1988 | US4732841 Resin cured in nonoxidizing plasma |
| 03/22/1988 | US4732838 Method of forming a patterned glass layer over the surface of a substrate |
| 03/22/1988 | US4732837 Novel mixed ester O-quinone photosensitizers |
| 03/22/1988 | US4732836 Novel mixed ester O-quinone photosensitizers |
| 03/22/1988 | US4732808 Acrylic graft polymer; adhesion without residues |
| 03/22/1988 | US4732801 Bonding layer with inclusions between refractory and substrate |
| 03/22/1988 | US4732798 Multilayer ceramic substrate and method of making the same |
| 03/22/1988 | US4732793 Method and apparatus for laser-induced CVD |
| 03/22/1988 | US4732785 Edge bead removal process for spin on films |
| 03/22/1988 | US4732761 Applying high frequency bias voltage to gas mixture-perpendicular impingement onto substrate |
| 03/22/1988 | US4732659 Sputtering method for making thin film field effect transistor utilizing a polypnictide semiconductor |
| 03/22/1988 | US4732658 Planarization of silicon semiconductor devices |
| 03/22/1988 | US4732648 Method of preparing semiconductor substrates |
| 03/22/1988 | US4732647 Batch method of making miniature capacitive force transducers assembled in wafer form |
| 03/22/1988 | US4732646 Method of forming identically positioned alignment marks on opposite sides of a semiconductor wafer |
| 03/22/1988 | US4732642 Apparatus for peeling protective film off a thin article |
| 03/22/1988 | US4732473 Apparatus for, and methods of, determining the characteristics of semi-conductor wafers |
| 03/22/1988 | US4732313 Copper wire or alloy thereof |
| 03/22/1988 | EP0204767A4 Method for fabricating modules comprising stacked circuit-carrying layers. |
| 03/22/1988 | EP0131586A4 Process and apparatus for obtaining silicon from fluosilicic acid. |
| 03/22/1988 | CA1234429A1 Infrared panel emitter and method of producing the same |
| 03/17/1988 | DE3727386A1 CCD register with minimum grid spacing |
| 03/17/1988 | DE3714955A1 Method of fabricating a semiconductor device and semiconductor device fabricated by the method |
| 03/17/1988 | DE3631371A1 Three-dimensional semiconductor memory cell and method of fabricating said memory cell |
| 03/17/1988 | DE3630827A1 Method for making contact with electrical components during manufacture |
| 03/17/1988 | DE3630284A1 Method of producing a field-effect transistor |
| 03/16/1988 | EP0260232A2 Process for making metal-semiconductor ohmic contacts |
| 03/16/1988 | EP0260201A2 Plasma etching using a bilayer mask |
| 03/16/1988 | EP0260150A2 Vacuum processing apparatus wherein temperature can be controlled |
| 03/16/1988 | EP0260125A2 Electrostatic discharge protection circuit |
| 03/16/1988 | EP0260097A1 CVD method and apparatus |
| 03/16/1988 | EP0260096A1 Integrated circuit probe station |
| 03/16/1988 | EP0260060A1 Self-aligned bipolar fabrication process |
| 03/16/1988 | EP0260059A1 Self-aligned bipolar fabrication process |
| 03/16/1988 | EP0260058A1 Self-aligned bipolar fabrication process |
| 03/16/1988 | EP0260052A2 Semiconductor device including ordered layers |
| 03/16/1988 | EP0260033A2 Semiconductor integrated circuits |
| 03/16/1988 | EP0260024A2 Integrated circuit probe parallelism establishing method and apparatus |
| 03/16/1988 | EP0259985A2 Integrated circuit manufacturing process |
| 03/16/1988 | EP0259942A2 Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
| 03/16/1988 | EP0259907A1 Electron detection with energy discrimination |
| 03/16/1988 | EP0259826A1 Semiconductor device having silicon oxynitride film with improved moisture resistance |
| 03/16/1988 | EP0259816A2 Method for bonding semiconductor laser element and apparatus therefor |
| 03/16/1988 | EP0259812A2 Photopolymerizable compositions containing inorganic fillers |
| 03/16/1988 | EP0259777A2 Method for growing single crystal thin films of element semiconductor |
| 03/16/1988 | EP0259759A2 Method for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers |
| 03/16/1988 | EP0259667A2 Testing station for integrated circuits |
| 03/16/1988 | EP0259631A2 Semiconductor device having power supply lines |
| 03/16/1988 | EP0259629A1 Method of producing a well-defined doping in the vertical sidewalls and bottoms of trenches engraved in semiconducting substrates |
| 03/16/1988 | EP0259616A1 Silicon semiconductor device structure and process for forming same |
| 03/16/1988 | EP0259614A1 Memory for digital electronical signals |
| 03/16/1988 | EP0259605A1 Method of producing a well-defined doping into sidewalls and bottoms of trenches etched into semiconductor substrates |
| 03/16/1988 | EP0259572A2 High rate laser etching technique |
| 03/16/1988 | EP0259490A1 A method of producing a semiconductor device |
| 03/16/1988 | EP0259446A1 Lead frame having non-conductive tie-bar for use in integrated circuit packages |
| 03/16/1988 | EP0259418A1 Methods for applying simultaneously on a plurality of integrated circuit boards a film having a uniform thickness and consisting of arsenic or germanium selenide glass sensitized by a silver salt |
| 03/16/1988 | EP0259414A1 Apparatus for thermal treatments of thin parts such as silicon wafers. |
| 03/16/1988 | EP0259375A1 Pallet-loading system |
| 03/16/1988 | EP0259370A1 Method for producing integrated circuit interconnects |
| 03/16/1988 | EP0145749B1 Universal flat orienter for semiconductor wafers |
| 03/16/1988 | EP0113763B1 Lead frame and method |
| 03/16/1988 | CN87209436U Steam aging device for lead wire of electronic elements and devices |
| 03/16/1988 | CN87106288A Transistor logic coupling circuit in reverse operation |
| 03/15/1988 | US4731855 Pattern defect inspection apparatus |
| 03/15/1988 | US4731645 Connection of a semiconductor to elements of a support, especially of a portable card |
| 03/15/1988 | US4731643 Logic-circuit layout for large-scale integrated circuits |
| 03/15/1988 | US4731642 Semiconductor memory device with means to prevent word line breakage |
| 03/15/1988 | US4731516 Laser polishing semiconductor wafer |
| 03/15/1988 | US4731346 Chemical vapor deposition, semiconductors |
| 03/15/1988 | US4731344 Method of making a single heterostructure laser chip having sawn cavities and secondary saw cuts |
| 03/15/1988 | US4731343 Method for manufacturing insulation separating the active regions of a VLSI CMOS circuit |
| 03/15/1988 | US4731342 Microminiature |
| 03/15/1988 | US4731341 Method of fabricating bipolar semiconductor integrated circuit device |
| 03/15/1988 | US4731340 Dual lift-off self aligning process for making heterojunction bipolar transistors |
| 03/15/1988 | US4731339 Uniform threshold voltage |
| 03/15/1988 | US4731338 Method for selective intermixing of layered structures composed of thin solid films |
| 03/15/1988 | US4731319 Positive-working naphthoquinone diazide photoresist composition with two cresol novolac resins |
| 03/15/1988 | US4731318 Integrated circuit comprising MOS transistors having electrodes of metallic silicide and a method of fabrication of said circuit |
| 03/15/1988 | US4731293 Fabrication of devices using phosphorus glasses |
| 03/15/1988 | US4731172 Method for sputtering multi-component thin-film |
| 03/15/1988 | US4731158 High rate laser etching technique |
| 03/15/1988 | US4730976 Articulated arm transfer device |
| 03/15/1988 | US4730900 Projection optical apparatus |
| 03/15/1988 | US4730749 For singulating integrated circuit devices; conveying to electronic testing |
| 03/15/1988 | CA1234228A1 Semiconductor device |
| 03/15/1988 | CA1234226A1 Integrated circuit chip processing techniques and integrated circuit chip produced thereby |
| 03/15/1988 | CA1234225A1 Low capacitance transistor cell element and transistor array |
| 03/15/1988 | CA1234036A1 Lpe growth on group iii-v compound semiconductor substrates containing phosphorus |
| 03/10/1988 | WO1988001793A1 Thermally insulative and electrically conductive interconnect and process for making same |
| 03/10/1988 | DE3728524A1 Hochgeschwindigkeits-halbleiterbauteil und verfahren zu seiner herstellung High-speed semiconductor device and process for its preparation |
| 03/09/1988 | EP0259282A2 A method for producing thin conductive and semi-conductive layers in monocrystal silicon |
| 03/09/1988 | EP0259222A2 Outer lead tape automated bonding system |
| 03/09/1988 | EP0259207A1 Current source with an active load and method for its realization |
| 03/09/1988 | EP0259162A2 Integrated circuit probe system |
| 03/09/1988 | EP0259161A2 Multiple lead probe for integrated circuits in wafer form |
| 03/09/1988 | EP0259158A2 Semiconductor non-volatile random access memory |
| 03/09/1988 | EP0259098A2 Integrated circuits having stepped dielectric regions |
| 03/09/1988 | EP0259035A2 Solder joint between an electrical component and a substrate |