| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/17/2013 | CN103050483A Vertically oriented semiconductor device and shielding structure thereof |
| 04/17/2013 | CN103050482A Packaging structure and method of fabricating the same |
| 04/17/2013 | CN103050480A Technical method for imaging rear side of silicon wafer |
| 04/17/2013 | CN103050479A Method and apparatus for de-embedding |
| 04/17/2013 | CN103050478A Probe pad design for 3dic package yield analysis |
| 04/17/2013 | CN103050477A Electronic device and method for producing same |
| 04/17/2013 | CN103050476A Semiconductor device and method of forming protection and support structure for conductive interconnect structure |
| 04/17/2013 | CN103050472A Lead frame bar for semiconductor packaging, and mold and adhesive sealing method thereof |
| 04/17/2013 | CN103050471A Single-chip package manufactured by using tin-silver-copper alloy immersion method and manufacturing process of single-chip package |
| 04/17/2013 | CN103050470A 智能功率模块及其制作方法 Intelligent Power Module and its production method |
| 04/17/2013 | CN103050467A Package structure and the method to fabricate thereof |
| 04/17/2013 | CN103050466A Semiconductor package and method of fabricating the same |
| 04/17/2013 | CN103050465A Wafer-thinning single-chip encapsulation piece with copper pillars and manufacturing technology thereof |
| 04/17/2013 | CN103050464A Electronic packaging connector and methods for its production |
| 04/17/2013 | CN103050462A Semiconductor device package and method |
| 04/17/2013 | CN103050460A Semiconductor device and method for manufacturing the same |
| 04/17/2013 | CN103050458A Silicon through-hole structure with patterning surface, patterning sidewall and local isolation |
| 04/17/2013 | CN103050457A Spacer for semiconductor structure contact |
| 04/17/2013 | CN103050453A Surface mount microwave device and packaging process thereof |
| 04/17/2013 | CN103050452A Rewiring high-density AAQFN (Area Array Quad Flat No-lead) packaging device and manufacture method thereof |
| 04/17/2013 | CN103050451A Double-row pin quad flat no lead packaging piece and insulating treatment method thereof |
| 04/17/2013 | CN103050450A Chip packaging structure and manufacturing method thereof |
| 04/17/2013 | CN103050449A Package member and manufacture method thereof |
| 04/17/2013 | CN103050447A Methods of packaging semiconductor devices and structures thereof |
| 04/17/2013 | CN103050446A Split-gate flash memory and forming method thereof |
| 04/17/2013 | CN103050445A Memory body and manufacturing method thereof |
| 04/17/2013 | CN103050444A 非挥发性记忆体及其制造方法 Non-volatile memory and manufacturing method |
| 04/17/2013 | CN103050443A Improving performance and reducing variation of narrow channel devices |
| 04/17/2013 | CN103050442A Power semiconductor device with antistatic discharge capacity and manufacturing method |
| 04/17/2013 | CN103050441A Oxide thin film transistor preparation method |
| 04/17/2013 | CN103050440A Method for producing electronic device and method for producing carrier substrate with resin layer |
| 04/17/2013 | CN103050439A Interconnection line structure and forming method thereof |
| 04/17/2013 | CN103050438A Etching method of contact hole |
| 04/17/2013 | CN103050437A Plated pillar package formation |
| 04/17/2013 | CN103050436A Semiconductor device and method of forming conductive pillar having an expanded base |
| 04/17/2013 | CN103050435A Method and system for manufacturing semiconductor wafer with side protection |
| 04/17/2013 | CN103050434A Through silicon via etching method |
| 04/17/2013 | CN103050433A Semiconductor contact hole structure and manufacturing method thereof |
| 04/17/2013 | CN103050432A Preparation method of GaAsOI (GaAs On Insulator) structure and III-VOI (III-V On Insulator) structure |
| 04/17/2013 | CN103050431A Method for forming shallow trench isolation structure |
| 04/17/2013 | CN103050430A Semiconductor device and manufacturing method thereof |
| 04/17/2013 | CN103050429A Electrostatic sucker and manufacturing method thereof |
| 04/17/2013 | CN103050428A Fabrication method of semiconductor devices and fabrication system of semiconductor devices |
| 04/17/2013 | CN103050427A Wafer pre-alignment method |
| 04/17/2013 | CN103050426A Continuous drying module for use in semiconductor integrated manufacturing production line |
| 04/17/2013 | CN103050425A Slice stretching mechanism used for semiconductor encapsulation |
| 04/17/2013 | CN103050424A Protecting ring for semiconductor device |
| 04/17/2013 | CN103050423A Wafer temperature detection method |
| 04/17/2013 | CN103050422A Wafer rip detecting method |
| 04/17/2013 | CN103050421A Etching control method |
| 04/17/2013 | CN103050420A Constraint to components with high migration rate in electric connection |
| 04/17/2013 | CN103050419A Method for manufacturing QFN (quad flat non-lead package) with multiple rings of pin configuration |
| 04/17/2013 | CN103050418A Pad manufacturing method and pad |
| 04/17/2013 | CN103050417A Dynamic sealing module for use in semiconductor integrated manufacturing production line |
| 04/17/2013 | CN103050416A Bottom filling method and device for megapixel tellurium-cadmium-mercury hybrid chip |
| 04/17/2013 | CN103050415A Sequential browning and green paint brushing-based flat package manufacturing process |
| 04/17/2013 | CN103050414A Three-dimensional high-density integration method for thick and thin film multi-chip module |
| 04/17/2013 | CN103050413A Growing process of thin film transistor |
| 04/17/2013 | CN103050412A Manufacturing method of oxide thin film transistor |
| 04/17/2013 | CN103050411A Manufacturing method of semiconductor transistor |
| 04/17/2013 | CN103050410A Manufacture method of low-temperature polycrystalline silicon thin film transistor and low-temperature polycrystalline silicon thin film transistor |
| 04/17/2013 | CN103050409A Manufacturing method for groove MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device |
| 04/17/2013 | CN103050408A Manufacture method of super junction |
| 04/17/2013 | CN103050407A Embedded transistor |
| 04/17/2013 | CN103050406A Method for manufacturing semi-conductor transistor structure |
| 04/17/2013 | CN103050405A DMOS (double-diffused metal oxide semiconductor) device and manufacturing method thereof |
| 04/17/2013 | CN103050404A Method of manufacturing grooves and protective rings of MOSFET (Metal Oxide Semiconductor Field Effect Transistor) device |
| 04/17/2013 | CN103050403A Semiconductor structure and manufacturing method thereof |
| 04/17/2013 | CN103050402A Secondary increasing method for h<fe> of triode with transmitting area being already promoted |
| 04/17/2013 | CN103050401A Back process method of IGBT (insulated gate bipolar transistor) device |
| 04/17/2013 | CN103050400A Bipolar transistor manufacturing method, bipolar transistor and integrated circuit |
| 04/17/2013 | CN103050399A Diode with three-medium-layer passivation structure and manufacturing method thereof |
| 04/17/2013 | CN103050398A Method for manufacturing thick semiconductor metal structure |
| 04/17/2013 | CN103050397A Process implementation method of epitaxial field barrier layer at back of IGBT (Insulated Gate Bipolar Translator) device |
| 04/17/2013 | CN103050396A Multilayered medium etching method |
| 04/17/2013 | CN103050395A Etching method for field oxide layer of semiconductor device |
| 04/17/2013 | CN103050394A Etching method of extra-thick photoresist |
| 04/17/2013 | CN103050393A Plasma etching method of atomic layer level |
| 04/17/2013 | CN103050392A Grinding polishing method for wafer |
| 04/17/2013 | CN103050391A Semiconductor substrate breaking method |
| 04/17/2013 | CN103050390A Process for adjusting contact resistance value |
| 04/17/2013 | CN103050389A Growing method of low-stress IGBT (Insulated Gate Bipolar Transistor) groove type grid electrode |
| 04/17/2013 | CN103050388A Manufacture method of IGBT (insulated gate bipolar translator) groove type grid electrode |
| 04/17/2013 | CN103050387A Ion implantation method for silicon back surface |
| 04/17/2013 | CN103050386A Ion implantation apparatus and ion implantation method |
| 04/17/2013 | CN103050385A Micro PVD (Physical Vapor Deposition) module for use in semiconductor integrated manufacturing production line |
| 04/17/2013 | CN103050384A Deep trench filling process method for super junction preparation |
| 04/17/2013 | CN103050383A Method for eliminating side lobe pattern |
| 04/17/2013 | CN103050382A Manufacturing method of semiconductor device |
| 04/17/2013 | CN103050381A Airflow flushing method of wafer |
| 04/17/2013 | CN103050380A Semiconductor device forming method |
| 04/17/2013 | CN103050379A Method for forming narrow-pitch lines |
| 04/17/2013 | CN103050378A Preparation method of silicon nanowire arrays easy in realizing large-area separation |
| 04/17/2013 | CN103050377A Junction leakage reduction through implantation |
| 04/17/2013 | CN103050376A Deposited material and method of formation |
| 04/17/2013 | CN103050375A Method for manufacturing shielding |
| 04/17/2013 | CN103050374A Processing method after etching |
| 04/17/2013 | CN103050373A Sealing container for producing electronic components |
| 04/17/2013 | CN103050359A Beam irradiation system and energy transfer mechanism of work |
| 04/17/2013 | CN103048878A Imprint method, imprint apparatus, and article manufacturing method |