Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1991
05/21/1991US5017998 Semiconductor device using SOI substrate
05/21/1991US5017997 Integrated circuit with high output current I2 L transistor
05/21/1991US5017996 Semiconductor device and production method thereof
05/21/1991US5017995 Self-aligned Bi-CMOS device having high operation speed and high integration density
05/21/1991US5017993 Semiconductor integrated circuit device with bus lines
05/21/1991US5017990 Raised base bipolar transistor structure and its method of fabrication
05/21/1991US5017985 Input protection arrangement for VLSI integrated circuit devices
05/21/1991US5017984 Amorphous silicon thin film transistor array
05/21/1991US5017983 Amorphous silicon thin film transistor with a depletion gate
05/21/1991US5017982 Semiconductor Memory Cells
05/21/1991US5017981 Semiconductor memory and method for fabricating the same
05/21/1991US5017979 EEPROM semiconductor memory device
05/21/1991US5017978 EPROM having a reduced number of contacts
05/21/1991US5017975 Organic electronic device with a monomolecular layer or multi-monomolecular layer having electroconductive conjugated bonds
05/21/1991US5017828 Semiconductors; prevent crosstalk current
05/21/1991US5017807 Output buffer having capacitive drive shunt for reduced noise
05/21/1991US5017517 Method of fabricating semiconductor device using an Sb protection layer
05/21/1991US5017516 Method of manufacturing a semiconductor device
05/21/1991US5017515 Process for minimizing lateral distance between elements in an integrated circuit by using sidewall spacers
05/21/1991US5017514 Method of manufacturing a semiconductor device using a main vernier pattern formed at a right angle to a subsidiary vernier pattern
05/21/1991US5017513 Method for manufacturing a semiconductor device
05/21/1991US5017512 Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same
05/21/1991US5017511 Method for dry etching vias in integrated circuit layers
05/21/1991US5017508 Having Improved Short Circuit Safe Operating Area
05/21/1991US5017507 Method of fabricating semiconductor integrated circuit devices including updiffusion to selectively dope a silicon layer
05/21/1991US5017506 Minimization of surface area of memory cell while maintaining adeqate storage capacity
05/21/1991US5017503 Process for making a bipolar transistor including selective oxidation
05/21/1991US5017458 Method for production of graft copolymer, pattern replication method, and base polymer and resist for graft copolymerization
05/21/1991US5017434 Integrated circuits
05/21/1991US5017403 Process for forming planarized films
05/21/1991US5017308 Microcrystalline grains interspersed in amorphous phase dopes
05/21/1991US5017265 Method for removing residual material from a cavity during the manufacture of a semiconductor device by utilizing plasma scattering
05/21/1991US5017264 Method of eliminating carbon material by chemical vapor reaction
05/21/1991US5017236 High frequency sonic substrate processing module
05/21/1991US5017073 Transport system for conveying workpiece between first and second media
05/21/1991US5016803 Wire bonding apparatus
05/21/1991US5016663 Method of determining end of cleaning of semiconductor manufacturing apparatus
05/21/1991US5016562 Semiconductors
05/21/1991US5016332 Plasma reactor and process with wafer temperature control
05/21/1991CA2068991A1 Semi-conductor structures
05/21/1991CA2029074A1 Single and multilayer coatings containing aluminum nitride
05/21/1991CA2019669A1 Anionically polymerizable monomers, polymers thereof, and use of such polymers in photoresists
05/21/1991CA1284394C Bumpless tape automated bonding
05/21/1991CA1284392C Metal-oxide-semiconductor (mos) field effect transistor having extremely shallow source/drain zones and silicide terminal zones, and a process for producing the transistor circuit
05/21/1991CA1284391C2 Semiconductor structure with silicide base tap
05/16/1991WO1991007776A1 A method for housing a tape-bonded electronic device and the package employed
05/16/1991WO1991006982A1 Passivated polycrystalline semiconductors and quantum well/superlattice structures fabricated thereof
05/16/1991WO1991006980A1 Semiconducteur integrated circuit
05/16/1991WO1991006979A1 Method and device for compensating drift in a semiconductor element
05/16/1991WO1991006977A1 Flexible circuit board for mounting ic and method of producing the same
05/16/1991WO1991006976A2 Process for producing an aluminum oxide layer on various substrates
05/16/1991WO1991006975A1 Method for halide etching in the presence of water of semi-conductor substrates
05/16/1991WO1991006974A1 Improvements to devices for adjusting the temperature of an item by blowing a gas at the desired temperature
05/16/1991WO1991006972A1 Method and apparatus relating to ion implantation
05/16/1991WO1991006969A1 Metal-ion source and process for the generation of metal ions
05/16/1991WO1991006688A1 Vapor depostion process for depositing an organo-metallic compound layer on a substrate
05/16/1991WO1991006507A1 Core wire connecting bridge for polycrystalline silicon manufacturing apparatuses
05/16/1991DE4036091A1 Semiconductor DRAM with cell array - has number of groups of memory cells in matrix, each with word lines to energise column and line cells
05/16/1991DE3937723A1 Verfahren und vorrichtung zum herstellen einer silikatschicht in einer integrierten schaltung A method and apparatus for producing a silicate layer in an integrated circuit
05/16/1991DE3937393A1 Modification of background doping level of semiconductor devices - by low temp. annealing to increase density of oxygen-donors in n=type silicon substrate material
05/16/1991CA2066704A1 Method for housing a tape-bonded electronic device and the package employed
05/15/1991EP0427443A2 Process and structure wherein atoms are repositioned on a surface using a scanning tunnelling microscope
05/15/1991EP0427395A1 Hermetic substrate coatings in an inert gas atmosphere
05/15/1991EP0427384A2 Method of connecting TAB tape to semiconductor chip
05/15/1991EP0427328A2 Method of manufacturing integrated circuits as well as integrated circuit
05/15/1991EP0427327A1 Method of providing aluminium or aluminium alloy tracks on a substrate
05/15/1991EP0427319A2 Device for the protection against breakdown of an N+ type diffuse region inserted in a vertical-type semiconductor integrated power structure
05/15/1991EP0427294A1 Silicon carbide member
05/15/1991EP0427285A2 Method of manufacturing radiation resistant semiconductor device
05/15/1991EP0427284A2 Semiconductor memory device
05/15/1991EP0427255A2 Semiconductor integrated circuit device and the method of manufacturing the same
05/15/1991EP0427254A2 Method for forming a contact region
05/15/1991EP0427253A2 Semiconductor integrated circuit device including bipolar transistors, MOS FETs and CCD
05/15/1991EP0427249A2 Aqueous processible photopolymerizable compositions capable of photolytically generating metal ions
05/15/1991EP0427226A2 Wiring pattern of semiconductor integrated circuit device
05/15/1991EP0427200A1 Semiconductor memory cell with improved stacked capacitor and process of fabrication thereof
05/15/1991EP0427187A2 Microwave semiconductor device
05/15/1991EP0427091A1 Input/output circuit in a semiconductor integrated circuit device
05/15/1991EP0426992A1 Fabrication method for an integrated MOS semiconductor device
05/15/1991EP0426877A1 Method of producing compound semiconductor devices
05/15/1991EP0426868A1 Positioning table
05/15/1991EP0426800A1 Heat-sink structures with increased heat dissipation capacity and methods for the production of such structures
05/15/1991EP0426747A1 Avalanche photodiode structure.
05/15/1991EP0426722A1 Electrical device
05/15/1991EP0359743B1 Cmos-ram store on a gate array arrangement
05/15/1991EP0227839B1 Method of forming a thin film
05/15/1991CN1051460A 互连结构 Interconnect structure
05/15/1991CN1051448A Word erasable buried bit line eeprom
05/15/1991CN1051438A Source voltage control circuit
05/14/1991US5016212 IC card having system ROM selection inhibit
05/14/1991US5016149 Illuminating method and illuminating apparatus for carrying out the same, and projection exposure method and projection exposure apparatus for carrying out the same
05/14/1991US5016087 Integrated circuit package
05/14/1991US5016084 Semiconductor device
05/14/1991US5016081 Mobile ion getterer for metal conductors
05/14/1991US5016080 Programmable die size continuous array
05/14/1991US5016079 Integrated injection logic gate with heavily doped diffusion
05/14/1991US5016078 CMOS integrated circuit structure protected against electrostatic discharges
05/14/1991US5016075 Semiconductor memory device
05/14/1991US5016074 Epitaxial intermetallic contact for compound semiconductors
05/14/1991US5016071 Dynamic memory device
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