Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1991
05/30/1991WO1991007446A1 Anionically polymerizable monomers, polymers thereof, and use of such polymers in photoresists
05/30/1991WO1991007358A1 Silver phosphate glass die-attach composition
05/30/1991CA2030763A1 Method for forming through holes in a polyimide substrate
05/29/1991EP0429404A2 A process for forming a field isolation structure and gate structure in integrated MISFET devices
05/29/1991EP0429272A2 Single and multilayer coatings containing aluminum nitride
05/29/1991EP0429270A2 Continuous etching method and apparatus therefor
05/29/1991EP0429251A2 Reactive ion etching
05/29/1991EP0429198A2 Bandgap reference voltage circuit
05/29/1991EP0429131A2 Monolithic vertical-type semiconductor power device with a protection against parasitic currents
05/29/1991EP0429081A2 Silicon wafer temperature measurement by optical transmission monitoring
05/29/1991EP0429043A2 Semiconductor wafer evaluation apparatus
05/29/1991EP0429041A2 Semiconductor integrated circuit apparatus having programmable logic device
05/29/1991EP0428983A2 Particle removal from surfaces by pressure change
05/29/1991EP0428916A1 Compression contacted semiconductor device and method for making of the same
05/29/1991EP0428880A1 Ceramic compositions and their use
05/29/1991EP0428857A2 Eeprom with trench-isolated bitlines
05/29/1991EP0428839A1 Method for depositing high quality silicon dioxide by plasma-enhanced chemical vapour deposition (PECVD)
05/29/1991EP0428838A1 A method and apparatus for reel to reel manufacturing of high performance multilayer circuit interconnect units
05/29/1991EP0428792A2 Single strip molding apparatus
05/29/1991EP0428784A1 Process for drying surfaces
05/29/1991EP0428738A1 Method of making complementary semiconductor integrated circuit devices
05/29/1991EP0428733A1 Device for forming tungsten film
05/29/1991EP0428696A1 Charge-coupled imager with dual gate anti-blooming structure
05/29/1991EP0428681A1 Improved electrical connectors and ic chip tester embodying same
05/29/1991EP0428673A1 Process for manufacturing doped semiconductor layers.
05/29/1991EP0125318B1 Method of forming amorphous silicon film
05/29/1991DE4017614A1 Topography simulation e.g. for etching semiconductor - uses modified diffusion model having lattice of virtual points in space occupied by workpiece
05/29/1991DE4013626C1 Semiconductor component - with weakly-doped N(-) and more highly-doped N partial zones
05/28/1991US5020031 Dynamic semiconductor memory device having improved voltage read-out
05/28/1991US5020006 Method for finding a reference point
05/28/1991US5019970 IC card
05/28/1991US5019891 Semiconductor device and method of fabricating the same
05/28/1991US5019890 Heterojunction bipolar transistor
05/28/1991US5019884 Charge transfer device
05/28/1991US5019883 Input protective apparatus of semiconductor device
05/28/1991US5019882 Germanium channel silicon MOSFET
05/28/1991US5019881 Nonvolatile semiconductor memory component
05/28/1991US5019879 Electrically-flash-erasable and electrically-programmable memory storage devices with self aligned tunnel dielectric area
05/28/1991US5019878 Programmable interconnect or cell using silicided MOS transistors
05/28/1991US5019877 Field effect transistor
05/28/1991US5019874 Semiconductor device having an epitaxial layer grown heteroepitaxially on an underlying substrate
05/28/1991US5019772 Test selection techniques
05/28/1991US5019675 Ink jet printer
05/28/1991US5019673 Flip-chip package for integrated circuits
05/28/1991US5019554 Structure of superconductive wiring having SiAlON buffer layer thereunder
05/28/1991US5019535 Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
05/28/1991US5019534 Process of making self-aligned contact using differential oxidation
05/28/1991US5019533 Thermal treatment of silicon integrated circuit chips to prevent and heal voids in aluminum metallization
05/28/1991US5019532 Multilayer oxide; reducing capacitance between polysilicon and diffusion segments
05/28/1991US5019531 Process for selectively growing thin metallic film of copper or gold
05/28/1991US5019529 Multilayer; amorphous and crystalline group 3,4, or 5 compounds on silicon wafers
05/28/1991US5019527 Method of manufacturing non-volatile semiconductor memories, in which selective removal of field oxidation film for forming source region and self-adjusted treatment for forming contact portion are simultaneously performed
05/28/1991US5019526 Method of manufacturing a semiconductor device having a plurality of elements
05/28/1991US5019525 Method for forming a horizontal self-aligned transistor
05/28/1991US5019524 High resistance semiconductor covering
05/28/1991US5019523 Bipolar transistor
05/28/1991US5019522 Method of making topographic pattern delineated power MOSFET with profile tailored recessed source
05/28/1991US5019520 Short channel between source and drain
05/28/1991US5019519 Method for the manufacture of optical semiconductor device
05/28/1991US5019481 Aqueous base developable negative resist compositions
05/28/1991US5019461 Resistive overlayer for thin film devices
05/28/1991US5019419 Polysiloxane
05/28/1991US5019234 System and method for depositing tungsten/titanium films
05/28/1991US5019233 Sputtering system
05/28/1991US5019209 Method of manufacturing and using a carrier tape for bonding IC devices
05/28/1991US5019205 Apparatus for wet etching of thin films
05/28/1991US5019187 Brazing paste for bonding metal and ceramic
05/28/1991US5019001 Method for manufacturing liquid crystal display device
05/28/1991US5018938 Method and apparatus for separating chips
05/28/1991US5018848 Laser beam transmitting apparatus
05/28/1991US5018256 Architecture and process for integrating DMD with control circuit substrates
05/28/1991CA1284523C Uniaxially electrically conductive articles with porous insulating substrate
05/25/1991CA2029521A1 Junction field effect transistor and method of fabricating
05/23/1991DE4037198A1 Cpd. semiconductor substrate for improved light emitting diodes - has epitaxial gallium-arsenide-phosphide layer on top or layer with improved lattice matching combining gradual and stepped compsn. changes
05/23/1991DE4036958A1 Field concentration suppressing semiconductor structure - has insulating film on first semiconductor zone end section between it and conductive layer
05/23/1991DE4018801A1 Semiconductor device prodn. - involving two-stage tungsten CVD in contact hole
05/23/1991CA2030572A1 Silicon wafer temperature measurement by optical transmission monitoring
05/22/1991EP0428398A2 Radiation-sensitive resin composition
05/22/1991EP0428319A2 Elliptical ion beam distribution method and apparatus
05/22/1991EP0428283A2 Method for local oxidation of silicon
05/22/1991EP0428281A1 Dopant-independent polysilicon plasma etch
05/22/1991EP0428247A2 Semiconductor memory device with improved contact layout
05/22/1991EP0428086A2 Method of manufacturing a ceramic circuit board
05/22/1991EP0428067A2 Semiconductor integrated circuit and method of manufacturing the same
05/22/1991EP0427930A2 Monolithic silicon membrane device and fabrication process therefor
05/22/1991EP0427923A2 Method for the reduction of pinholes in resist films
05/22/1991EP0427910A1 A boron source for silicon molecular beam epitaxy
05/22/1991EP0427905A2 Grid-inserted quantum structure
05/22/1991EP0427853A1 Metal oxidation apparatus and method
05/22/1991CN1051637A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
05/21/1991WO1991007688A1 Semi-conductor structures
05/21/1991US5018164 Excimer laser ablation method and apparatus for microcircuit fabrication
05/21/1991US5018104 Redundant circuit incorporated in semiconductor memory device
05/21/1991US5018102 Memory having selected state on power-up
05/21/1991US5018100 Semiconductor memory device
05/21/1991US5018005 Thin, molded, surface mount electronic device
05/21/1991US5018003 Lead frame and semiconductor device
05/21/1991US5018001 Aluminum line with crystal grains
05/21/1991US5018000 For preventing malfunction due to alpha-radiation from radioactive material contained in packaging material
05/21/1991US5017999 Method for forming variable width isolation structures
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