Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1991
04/16/1991US5008210 Process of making a bipolar transistor with a trench-isolated emitter
04/16/1991US5008209 Anisotropic etching
04/16/1991US5008208 Method of making planarized, self-aligned bipolar integrated circuits
04/16/1991US5008207 Method of fabricating a narrow base transistor
04/16/1991US5007992 Method and apparatus for removing oxygen from a semiconductor processing reactor
04/16/1991US5007984 Coating with a metal film, forming patterned resist over film, etching to produce tapered shape
04/16/1991US5007983 Etching method for photoresists or polymers
04/16/1991US5007982 Reactive ion etching of silicon with hydrogen bromide
04/16/1991US5007981 Method of removing residual corrosive compounds by plasma etching followed by washing
04/16/1991US5007979 Melting, dissolving, solidifying, seeding
04/16/1991US5007971 Power source which generate photoelectricity by the junction of p-type, i-type, n-type multilayer; efficiency
04/16/1991US5007788 Pitch changing device for changing pitches of plate-like objects and method of changing pitches
04/16/1991US5007741 Methods and apparatus for detecting impurities in semiconductors
04/16/1991US5007577 Multiple-core complex material and method of manufacturing the same
04/16/1991US5007576 Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication
04/16/1991US5007374 Apparatus for forming thin films in quantity
04/16/1991US5007163 Non-destructure method of performing electrical burn-in testing of semiconductor chips
04/16/1991CA1283227C Method for mounting an integrated circuit on a support, device using said method and its application to an electronic microcircuit card
04/16/1991CA1283174C Quad processor
04/16/1991CA1283006C Method of making a device comprising a patterned aluminum layer
04/14/1991CA2027509A1 Application specific tape automated bonding
04/14/1991CA2027368A1 Radiation-sensitive positive resist composition
04/13/1991CA2027285A1 Method of forming a thin copper film by low temperature cvd
04/11/1991DE4030551A1 Silicon single crystal prodn. - by czochralski method with oxygen concn. controlled by varying crucible partition immersion depth
04/11/1991DE3933423A1 Hot gas-type hot plate - useful for heat treating semiconductor wafers and LCD substrates
04/10/1991EP0421857A1 Masterslice peripheral electronic circuit
04/10/1991EP0421735A2 Method of Manufacturing a Semiconductor Device
04/10/1991EP0421728A2 Apparatus and method relating to ion implantation and heat transfer
04/10/1991EP0421703A2 Encapsulation method for localized oxidation of silicon
04/10/1991EP0421695A2 Electron beam exposuring device and exposuring method using the same
04/10/1991EP0421694A1 Electronic package including hermetic feedthrough and method and apparatus for production thereof
04/10/1991EP0421686A2 Electrode plate for plasma etching
04/10/1991EP0421667A1 Positive resist composition
04/10/1991EP0421645A2 Apparatus for and method of optical inspection in a total internal reflection holographic imaging system
04/10/1991EP0421608A2 Method of forming a vertical type superlattice layer of compound semiconductor
04/10/1991EP0421605A1 Process for forming semiconductor thin film
04/10/1991EP0421599A2 Integral protective enclosure for TAB device mounted on a flexible printed circuit board
04/10/1991EP0421579A2 Plastic encapsulated integrated circuit die packages and method of making same
04/10/1991EP0421527A1 Two-step positioning device
04/10/1991EP0421507A2 Method of manufacturing a bipolar transistor
04/10/1991EP0421498A2 Device for the rapid loading of substrates or other articles into vacuum plants
04/10/1991EP0421476A2 Method of manufacturing a semiconductor device
04/10/1991EP0421448A2 Signal output circuit having bipolar transistors at output, for use in a MOS semiconductor integrated circuit
04/10/1991EP0421446A2 Semiconductor device wherein n-channel MOSFET, p-channel MOSFET and nonvolatile memory cell are formed in one chip
04/10/1991EP0421430A2 A plasma process, method and apparatus
04/10/1991EP0421397A1 Diamond semiconductor device and method of manufacture
04/10/1991EP0421348A1 Film forming apparatus
04/10/1991EP0421315A2 Method for selectively removing an insulating film
04/10/1991EP0421205A2 A method of fabricating highly lattice mismatched quantum well structures
04/10/1991EP0421203A1 An integrated circuit structure with a boron phosphorus silicate glass composite layer on semiconductor wafer and improved method for forming same
04/10/1991EP0421195A2 Photoreactive resin compositions developable in a semi-aqueous solution
04/10/1991EP0421179A1 Process for making conductor tracks for hybrid circuits, particularly for power hybrid circuits
04/10/1991EP0421168A2 Semiconductor memory with metallic interconnection layer of the same potential as the word line and connected thereto outside of the memory cell region
04/10/1991EP0421093A1 Improved method of anisotropically etching silicon wafers and wafer etching solution
04/10/1991EP0421075A1 Low pressure, low-temperature process for depositing silicondioxide
04/10/1991EP0421053A2 High temperature lift-off process
04/10/1991EP0421005A2 Process of assembling an electronic package
04/10/1991EP0215069B1 Polysiloxane resist for ion beam and electron beam lithography
04/10/1991EP0198842B1 Reactor apparatus for semiconductor wafer processing
04/10/1991EP0193543B1 Process for forming a layer of patterned photoresist
04/09/1991US5007071 Method of inspecting bonded wafers
04/09/1991US5007025 Power and signal line bussing method for memory devices
04/09/1991US5006974 On-chip high voltage generator and regulator in an integrated circuit
04/09/1991US5006918 Integrated circuit
04/09/1991US5006917 Thermocompression bonding in integrated circuit packaging
04/09/1991US5006916 Vertical-walled contacts for VLSI semiconductor devices
04/09/1991US5006914 Single crystal semiconductor substrate articles and semiconductor devices comprising same
04/09/1991US5006913 Stacked type semiconductor device
04/09/1991US5006912 Heterojunction bipolar transistor with SiGe
04/09/1991US5006911 Transistor device with high density contacts
04/09/1991US5006910 Semiconductor memory device and method for producing the same
04/09/1991US5006908 Epitaxial Wurtzite growth structure for semiconductor light-emitting device
04/09/1991US5006820 Low reflection input configuration for integrated circuit packages
04/09/1991US5006816 Semiconductor integrated circuit including differential transistor circuit having a pair of FETs
04/09/1991US5006792 Flip-chip test socket adaptor and method
04/09/1991US5006760 Capacitive feed for plasma reactor
04/09/1991US5006732 Semiconductor circuit having buffer function
04/09/1991US5006673 Fabrication of pad array carriers from a universal interconnect structure
04/09/1991US5006488 Using polyimide
04/09/1991US5006485 Method of manufacturing an intergrated circuit including steps for forming interconnections between patterns formed at different levels
04/09/1991US5006484 Heat treatment; filling contact holes with metal
04/09/1991US5006481 Method of making a stacked capacitor DRAM cell
04/09/1991US5006480 Metal gate capacitor fabricated with a silicon gate MOS process
04/09/1991US5006479 Boron doping of edges
04/09/1991US5006478 Method for manufacture of semiconductor device
04/09/1991US5006477 Integrated circuits
04/09/1991US5006476 Transistor manufacturing process using three-step base doping
04/09/1991US5006475 Method for backside damage of silicon wafers
04/09/1991US5006436 UV curable compositions for making tentable solder mask coating
04/09/1991US5006220 Electrode for use in the treatment of an object in a plasma
04/09/1991US5006218 Sputtering apparatus
04/09/1991US5006203 Nucleating diamond film on polysilicon substrate by ion beam deposition or hydrocarbon pyrolysis, etching to remove graphitically bonded materials
04/09/1991US5006202 Fabricating method for silicon devices using a two step silicon etching process
04/09/1991US5006192 Apparatus for producing semiconductor devices
04/09/1991US5006190 Film removal method
04/09/1991US5006180 Gallium phosphide containing hydrogen and dope, silicon matrix containing hydrogen and fluorine
04/09/1991US5006167 Gold powder, copper oxide powder, glass-based, lead-free inorganic powder, and resin
04/09/1991US5006143 Method of producing a joined article through bonding with low melting point glass
04/09/1991US5005969 Optical projection apparatus with the function of controlling laser coherency
04/09/1991US5005298 Displacement controller for fine positioning device