| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/11/1991 | US5023694 Side wall contact in a nonvolatile electrically alterable memory cell |
| 06/11/1991 | US5023692 Power MOSFET transistor circuit |
| 06/11/1991 | US5023688 Transfer gate with the improved cut-off characteristic |
| 06/11/1991 | US5023687 Semiconductor device |
| 06/11/1991 | US5023683 Semiconductor memory device with pillar-shaped insulating film |
| 06/11/1991 | US5023682 Semiconductor memory device |
| 06/11/1991 | US5023679 Semiconductor device |
| 06/11/1991 | US5023678 High power MOSFET and integrated control circuit therefor for high-side switch application |
| 06/11/1991 | US5023677 Low parasitic FET topology for power and low noise GaAs FETs |
| 06/11/1991 | US5023676 Compound semiconductor MESFET device with passivation film |
| 06/11/1991 | US5023675 High electron mobility transistor |
| 06/11/1991 | US5023673 Semiconductor mesa structured optical processing devices, with added side-surface recombination centers to improve the speed of operation |
| 06/11/1991 | US5023671 Microstructures which provide superlattice effects and one-dimensional carrier gas channels |
| 06/11/1991 | US5023488 Drivers and receivers for interfacing VLSI CMOS circuits to transmission lines |
| 06/11/1991 | US5023476 Semiconductor device with power supply mode-change controller for reliability testing |
| 06/11/1991 | US5023458 Ion beam control system |
| 06/11/1991 | US5023453 Apparatus for preparation and observation of a topographic section |
| 06/11/1991 | US5023424 Shock wave particle removal method and apparatus |
| 06/11/1991 | US5023407 Printed circuit board with a uniform conductive layer formed by equalization of metals therein |
| 06/11/1991 | US5023206 In situ etching to prevent oxidaton or remove oxides |
| 06/11/1991 | US5023205 Method of fabricating hybrid circuit structures |
| 06/11/1991 | US5023204 Method of manufacturing semiconductor device using silicone protective layer |
| 06/11/1991 | US5023203 Multilayer mask including intermediate spacer |
| 06/11/1991 | US5023202 Rigid strip carrier for integrated circuits |
| 06/11/1991 | US5023201 Selective deposition of tungsten on TiSi2 |
| 06/11/1991 | US5023200 Formation of multiple levels of porous silicon for buried insulators and conductors in silicon device technologies |
| 06/11/1991 | US5023199 Method of diffusing Zn into compound semiconductor |
| 06/11/1991 | US5023198 Embedding surfaces containing groove patterns by controlled heating to cause transfer of materials from epitaxial layers |
| 06/11/1991 | US5023197 Masking thin silicon on insulator layer, depositing second silicon layer, anisotropically etching; forming metal oxide semiconductor |
| 06/11/1991 | US5023196 Method for forming a MOSFET with substrate source contact |
| 06/11/1991 | US5023195 Method for manufacturing a semiconductor integrated circuit including a bipolar transistor |
| 06/11/1991 | US5023194 Method of making a multicollector vertical pnp transistor |
| 06/11/1991 | US5023193 Method for simultaneously fabricating bipolar and complementary field effect transistors using a minimal number of masks |
| 06/11/1991 | US5023192 Method of manufacturing a bipolar transistor |
| 06/11/1991 | US5023191 Method of producing a semiconductor device using a single mask method for providing multiple masking patterns |
| 06/11/1991 | US5023190 CMOS processes |
| 06/11/1991 | US5023188 Method of determining the depth of trenches formed in a semiconductor wafer |
| 06/11/1991 | US5023164 Highly sensitive dry developable deep UV photoresist |
| 06/11/1991 | US5023156 Mask for X-ray lityhography and method of manufacturing the same |
| 06/11/1991 | US5022979 Noncontamination, durability |
| 06/11/1991 | US5022976 Semiconductor circuits; corrosion resistance |
| 06/11/1991 | US5022969 Process for encasing an electronic component |
| 06/11/1991 | US5022961 Method for removing a film on a silicon layer surface |
| 06/11/1991 | US5022960 Integrating substrate and metal layers, exposing predetermined part of metal layer by laser machining |
| 06/11/1991 | US5022959 Method of wet etching by use of plasma etched carbonaceous masks |
| 06/11/1991 | US5022958 Forming bilevel-dielectric; raised topographic feature |
| 06/11/1991 | US5022829 Vacuum apparatus |
| 06/11/1991 | US5022695 Semiconductor slice holder |
| 06/11/1991 | US5022619 Positioning device of table for semiconductor wafers |
| 06/11/1991 | US5022580 Vernier structure for flip chip bonded devices |
| 06/11/1991 | US5022419 Rinser dryer system |
| 06/11/1991 | CA1284749C Si-n containing coatings for electronic devices |
| 06/11/1991 | CA1284748C Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides |
| 06/09/1991 | CA2031776A1 Pickup method and the pickup apparatus for chip-type part |
| 06/08/1991 | WO1991009420A1 Method of making silicon quantum wires |
| 06/07/1991 | CA2031636A1 Method of producing cmos transistor |
| 06/07/1991 | CA2031418A1 Impurity doping apparatus |
| 06/07/1991 | CA2031417A1 Method of producing mis transistor having gate electrode of matched conductivity type |
| 06/06/1991 | DE4033683A1 Edge modification of semiconductor wafers before epitaxial deposition - by grinding edges with profiled tool to form rounded edge with tapering planes merging with surfaces, an epi-crown being deposited |
| 06/06/1991 | DE3939628A1 Adhesive compsn. which can be cured by UV light - used to fix components to hybrid substrates before solder reflow process and can be exposed by radiation through substrate |
| 06/06/1991 | DE3939627A1 Layer circuits with substrate of aluminium oxide or nitride ceramic - are bonded to base of metal, ceramic or plastic using UV-hardenable adhesive |
| 06/05/1991 | EP0430864A2 Method of making electrical interconnections on a universal substrate and device therefor |
| 06/05/1991 | EP0430844A2 Chip identification method for use with scan design systems and scan testing techniques |
| 06/05/1991 | EP0430829A1 Process for manufacturing EPROM memories integrated circuits |
| 06/05/1991 | EP0430697A2 Improved thin film varactors |
| 06/05/1991 | EP0430691A2 Semiconductor heterostructures |
| 06/05/1991 | EP0430623A2 Non-cyanide electrode cleaning process |
| 06/05/1991 | EP0430607A1 Integrated injection logic gate |
| 06/05/1991 | EP0430593A2 Method of cutting a silicon wafer by orientation dependent etching |
| 06/05/1991 | EP0430592A2 An active matrix display device |
| 06/05/1991 | EP0430562A1 Semiconductor heterostructure and method of producing the same |
| 06/05/1991 | EP0430514A2 Substantially facet free selective epitaxial growth process |
| 06/05/1991 | EP0430477A1 Positive resist composition |
| 06/05/1991 | EP0430476A1 Improved silicone-polyimide material for electronic devices |
| 06/05/1991 | EP0430429A2 A process for fabricating a semiconductor device |
| 06/05/1991 | EP0430426A2 Semiconductor memory device |
| 06/05/1991 | EP0430404A1 Method of manufacturing a capacitor for a DRAM cell |
| 06/05/1991 | EP0430403A2 Method for fabricating interlevel contacts |
| 06/05/1991 | EP0430372A1 Test system integrated on a substrate and a method for using such a test system |
| 06/05/1991 | EP0430363A2 A thin-film transistor circuit |
| 06/05/1991 | EP0430303A2 Improved process for selective deposition of tungsten on semiconductor wafer |
| 06/05/1991 | EP0430289A2 Fabrication of self-aligned, T-gate hemt |
| 06/05/1991 | EP0430280A2 Selective and non-selective deposition of Si1-x Gex on a Si substrate that is partially masked with Si O2 |
| 06/05/1991 | EP0430279A2 Si/SiGe heterojunction bipolar transistor utilizing advanced epitaxial deposition techniques and method of manufacture |
| 06/05/1991 | EP0430275A2 Doping method of barrier region in semiconductor device |
| 06/05/1991 | EP0430274A2 Method of producing bipolar transistor |
| 06/05/1991 | EP0430273A2 Radiation curable organosiloxane gel compositions |
| 06/05/1991 | EP0430255A2 Conductive adhesive and article made therewith |
| 06/05/1991 | EP0430237A1 Bipolar device in which carrier lifetime is controlled |
| 06/05/1991 | EP0430236A2 Power amplifier |
| 06/05/1991 | EP0430229A2 Process and apparatus for forming stoichiometric layer of metal compound by closed loop voltage controlled reactive sputtering |
| 06/05/1991 | EP0430204A1 Plastic mould type semiconductor device |
| 06/05/1991 | EP0430191A2 Semiconductor memory |
| 06/05/1991 | EP0430168A2 Doping method of impurity into semiconductor trench wall |
| 06/05/1991 | EP0430167A2 Method or producing PN junction device |
| 06/05/1991 | EP0430166A2 Method of doping impurity into semiconductor films and patterned semiconductor strip |
| 06/05/1991 | EP0430157A2 Composite circuit board and manufacturing method of the same |
| 06/05/1991 | EP0430147A2 Semiconductor gate array device compatible with ECL signals and/or TTL signals |
| 06/05/1991 | EP0430128A2 Circuit for testability |
| 06/05/1991 | EP0430116A2 Method for forming through holes in a polyimide substrate |