Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1991
06/18/1991US5024972 Deposition of a conductive layer for contacts
06/18/1991US5024971 Method for patterning submicron openings using an image reversal layer of material
06/18/1991US5024970 Method of obtaining semiconductor chips
06/18/1991US5024969 Hybrid circuit structure fabrication methods using high energy electron beam curing
06/18/1991US5024968 Removal of surface contaminants by irradiation from a high-energy source
06/18/1991US5024967 Doping procedures for semiconductor devices
06/18/1991US5024965 Manufacturing high speed low leakage radiation hardened CMOS/SOI devices
06/18/1991US5024963 Method of fabricating a BCCD channel with stair-case doping by self-alignment
06/18/1991US5024962 Rapid thermal oxidation to form sealing oxide
06/18/1991US5024961 Blanket punchthrough and field-isolation implant for sub-micron N-channel CMOS devices
06/18/1991US5024960 Dual LDD submicron CMOS process for making low and high voltage transistors with common gate
06/18/1991US5024959 CMOS process using doped glass layer
06/18/1991US5024958 Reduced capacitance between base and collector layers and reduced base layer resistance
06/18/1991US5024957 Improved switching times
06/18/1991US5024956 Method of manufacturing a semiconductor device including mesa bipolar transistor with edge contacts
06/18/1991US5024954 Method of improving high temperature stability of PTSI/SI structure
06/18/1991US5024953 Method for producing opto-electric transducing element
06/18/1991US5024922 Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
06/18/1991US5024919 Process for forming fine pattern in semiconductor device
06/18/1991US5024896 Dual overhand, lift-off structure; etchable layers preventing undesired footing
06/18/1991US5024873 Composite films with Langmuir-Blodgett component
06/18/1991US5024867 Dopant film and methods of diffusing impurity into and manufacturing a semiconductor wafer
06/18/1991US5024748 Microwave plasma processing apparatus
06/18/1991US5024747 Wafer coating system
06/18/1991US5024746 Fixture and a method for plating contact bumps for integrated circuits
06/18/1991US5024734 Solder pad/circuit trace interface and a method for generating the same
06/18/1991US5024724 Dry-etching method
06/18/1991US5024723 Carbon doped silicon layer annealed at low temperature no silicon carbide formed
06/18/1991US5024722 Process for fabricating conductors used for integrated circuit connections and the like
06/18/1991US5024706 Pin heterojunction photovoltaic elements with polycrystal AlP(H,F) semiconductor film
06/18/1991US5024570 Continuous semiconductor substrate processing system
06/18/1991US5024423 Silicon carbide, with alumina, silica, zirconia, or zircon insulating layer
06/18/1991US5024372 Method of making high density solder bumps and a substrate socket for high density solder bumps
06/18/1991US5024367 Wire bonding method
06/18/1991US5024329 Lockable container for transporting and for storing semiconductor wafers
06/18/1991US5024182 Thin film forming apparatus having a gas flow settling device
06/18/1991US5023994 Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
06/18/1991CA2005791A1 Method of manufacturing a solid-state device and solid-state device, particularly semiconductor device
06/18/1991CA1285079C Apparatus for die-bonding semiconductor chip
06/18/1991CA1284938C Process of laminating
06/13/1991WO1991008592A1 Improving cleaving of diode arrays
06/13/1991WO1991008591A1 Separation of diode array chips during fabrication thereof
06/13/1991WO1991008588A1 High power, high density interconnect method and apparatus for integrated circuits
06/13/1991WO1991008586A1 Methods of plating into holes and products produced thereby
06/13/1991WO1991008585A1 Method and device for semiconductor fabrication fault analasys
06/13/1991WO1991008583A1 Washing system
06/13/1991WO1991008582A1 Ohmic electrode of n-type cubic boron nitride and method of forming the same
06/13/1991WO1991008575A1 Conductive adhesive useful for bonding a semiconductor die to a conductive support base
06/13/1991WO1991008095A2 Single-strip moulding apparatus
06/13/1991WO1991006978A3 Multi-layer lead frames for integrated circuit packages
06/13/1991DE4038115A1 Semiconductor dynamic random access memory - uses etched channel within MOSFET to accommodate capacitor allowing reduction in size
06/13/1991DE3940820A1 Reactive ion etching - of aluminium alloy and titanium-tungsten layers using gas contg. chlorine and silicon tetra:chloride
06/13/1991DE3940083A1 Anisotropic dry etching of aluminium (alloy) circuits - using plasma of chlorine, nitrogen and argon
06/13/1991DE3939661A1 Controlling copper incorporation into silicon wafers - during polishing by adding complexing ligands
06/12/1991EP0432058A1 Dynamic isolation circuit for integrated circuits
06/12/1991EP0432057A1 Integrated circuit comprising memories and method for its fabrication
06/12/1991EP0432047A1 Wideband microwave window with miniaturized dimensions for electron tubes
06/12/1991EP0432044A1 III-V-Compound power transistor in silicon substrate and method of fabrication
06/12/1991EP0432035A1 Quantum well optical device and production process
06/12/1991EP0431999A1 Process for depositing a thin film of a ceramic composition and product produced by this process
06/12/1991EP0431971A2 Photosensitive composition and resin-encapsulated semiconductor device
06/12/1991EP0431911A2 Memory cell having floating gate and semiconductor memory using the same
06/12/1991EP0431893A2 Novel BICMOS logic gate circuit and structures
06/12/1991EP0431887A2 Variable capacitance capacitor array
06/12/1991EP0431878A2 Process for forming high purity thin films
06/12/1991EP0431836A1 Semiconductor device and electronic device by use of the semiconductor
06/12/1991EP0431835A1 Bipolar semiconductor device
06/12/1991EP0431814A1 Wafer alignment fixture
06/12/1991EP0431757A2 Ion implanter scanning mechanism
06/12/1991EP0431725A2 Direct bonded metal-substrate structures
06/12/1991EP0431721A2 Reaction barrier for a multilayer structure in an integrated circuit
06/12/1991EP0431685A1 Method of forming thin defect-free strips of monocrystalline silicon on insulators
06/12/1991EP0431637A1 Pickup method and the pickup apparatus for a chip-type part
06/12/1991EP0431616A2 Method of producing CMOS transistor
06/12/1991EP0431606A2 Surface structure of ceramics substrate and method of manufacturing the same
06/12/1991EP0431592A2 A sputtering apparatus
06/12/1991EP0431524A1 A ceramic substrate material coated with an amorphous fluorine resin
06/12/1991EP0431522A2 Method for manufacturing semiconductor device
06/12/1991EP0431490A1 Semiconductor integrated circuit device having pads at periphery of semiconductor chip
06/12/1991EP0431444A2 Method of producing MIS transistor having gate electrode of matched conductivity type
06/12/1991EP0431415A2 Method and apparatus for epitaxially growing chemical-compound crystal
06/12/1991EP0431290A2 MOS switching circuit having gate enhanced lateral bipolar transistor
06/12/1991EP0431261A1 Integrated circuit package with cap and device of the same material
06/12/1991EP0431106A1 Packaged electronic circuit with a chip on a gridded area of conductive pads.
06/12/1991EP0431021A1 Process and device for vapour deposition of a coating on a substrate in vacuo
06/12/1991EP0430965A1 Vlsi bipolar process and keyhole transistor
06/12/1991EP0385979A4 High-density electronic modules, process and product
06/12/1991EP0324826A4 Method of fabricating solar cells with silicon nitride coating
06/12/1991EP0258311B1 Process for forming isolation trenches in a semiconductor substrate
06/12/1991CN1052220A Method for cleaning surface of semiconductor silicon
06/11/1991US5023836 Semiconductor memory device
06/11/1991US5023835 Semiconductor memory system for use in logic LSI's
06/11/1991US5023751 Method of producing a tape for providing electronic modules, and tape obtained by this method
06/11/1991US5023750 Electronic component having improved low resistance contact and manufacturing method therefor
06/11/1991US5023702 Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method
06/11/1991US5023701 Gate array structure and process to allow optioning at second metal mask only
06/11/1991US5023699 Resin molded type semiconductor device having a conductor film
06/11/1991US5023698 Semiconductor device
06/11/1991US5023697 Noncracking of glass coating
06/11/1991US5023696 Semiconductor device having composite substrate formed by fixing two semiconductor substrates in close contact with each other