Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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11/08/1994 | US5362982 Insulated gate FET with a particular LDD structure |
11/08/1994 | US5362981 Integrated semiconductor device having a buried semiconductor layer and fabrication method thereof |
11/08/1994 | US5362980 Semiconductor component with protective element for limiting current through component |
11/08/1994 | US5362973 Quantum fabricated via photo induced evaporation enhancement during in situ epitaxial growth |
11/08/1994 | US5362972 Semiconductor device using whiskers |
11/08/1994 | US5362969 Processing endpoint detecting technique and detector structure using multiple radiation sources or discrete detectors |
11/08/1994 | US5362955 IC card having severable mini chip card |
11/08/1994 | US5362686 Vapor deposition of dielectric film using pressurized gaseous mixture containing organic silane and nitriding gas yields strong moisture resistant coating |
11/08/1994 | US5362685 Method for achieving a high quality thin oxide in integrated circuit devices |
11/08/1994 | US5362684 Non-monocrystalline silicon carbide semiconductor, process of production thereof, and semiconductor device employing the same |
11/08/1994 | US5362683 Cutting through single crystal semiconductor wafers which have growth layers on both surfaces |
11/08/1994 | US5362682 Method of producing sheets of crystalline material and devices made therefrom |
11/08/1994 | US5362681 Method for separating circuit dies from a wafer |
11/08/1994 | US5362680 Technique for enhancing adhesion capability of heat spreaders in molded packages |
11/08/1994 | US5362678 Method of manufacturing insulated via hole structure for semiconductor device |
11/08/1994 | US5362677 Method for producing a field effect transistor with a gate recess structure |
11/08/1994 | US5362676 Depositing nonconductive film(which can be converted to conductor by heating or applying voltage) on dielectric as part of connector |
11/08/1994 | US5362672 Method of forming a monocrystalline film having a closed loop step portion on the substrate |
11/08/1994 | US5362671 Method of fabricating single crystal silicon arrayed devices for display panels |
11/08/1994 | US5362670 Semiconductor device producing method requiring only two masks for completion of element isolation regions and P- and N-wells |
11/08/1994 | US5362669 Method of making integrated circuits |
11/08/1994 | US5362668 Method of fabricating an BPSG-filled trend and oxidation isolation structure with a gate electrode |
11/08/1994 | US5362667 Joining surfaces of wafer and handle wafer by applying oxidizer solutiion, pressing and heating |
11/08/1994 | US5362665 Method of making vertical DRAM cross point memory cell |
11/08/1994 | US5362664 Method for fabricating a semiconductor memory device |
11/08/1994 | US5362663 Method of forming double well substrate plate trench DRAM cell array |
11/08/1994 | US5362661 Method for fabricating thin film transistor |
11/08/1994 | US5362660 Depositing layer of chromium, then one of molybdenum on silicon surface, etching molybdenum with chromium acting as etch stop, then etching chromium with silicon acting as etch stop |
11/08/1994 | US5362659 Method for fabricating vertical bipolar junction transistors in silicon bonded to an insulator |
11/08/1994 | US5362658 Method for producing semiconductor device |
11/08/1994 | US5362657 Lateral complementary heterojunction bipolar transistor and processing procedure |
11/08/1994 | US5362632 Rapid thermal processing of semiconductor layer yields reaction preventing barrier |
11/08/1994 | US5362608 Microlithographic substrate cleaning and compositions therefor |
11/08/1994 | US5362600 Radiation sensitive compositions comprising polymer having acid labile groups |
11/08/1994 | US5362599 Fast diazoquinone positive resists comprising mixed esters of 4-sulfonate and 5-sulfonate compounds |
11/08/1994 | US5362585 Forming an array of latent images in a resist and analyzing scattered light from edges to provide information on correct exposure, focus and lens characteristics |
11/08/1994 | US5362583 Reticle mask exposure method comprising blank to remove incomplete circuits |
11/08/1994 | US5362575 Free-standing tensile fims supported at its edge by annular, tapered skirt structure; integrated electronic devices |
11/08/1994 | US5362550 Thin film circuit board and its manufacturing process |
11/08/1994 | US5362547 Film carrier |
11/08/1994 | US5362526 Plasma-enhanced CVD process using TEOS for depositing silicon oxide |
11/08/1994 | US5362450 Laser controlled decomposition of chlorofluorocarbons |
11/08/1994 | US5362372 Self cleaning collimator |
11/08/1994 | US5362370 Method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices or similar electronic components |
11/08/1994 | US5362361 Sulfur-containing etchant |
11/08/1994 | US5362358 Dry etching apparatus and method of forming a via hole in an interlayer insulator using same |
11/08/1994 | US5362356 Plasma etching process control |
11/08/1994 | US5362354 Apparatus for manufacturing a semiconductor device |
11/08/1994 | US5362353 Faraday cage for barrel-style plasma etchers |
11/08/1994 | US5362350 Copper wires |
11/08/1994 | US5362274 Blowing port for clean air of an apparatus for washing semiconductor materials |
11/08/1994 | US5362229 Piping connection device |
11/08/1994 | US5361973 Method of soldering |
11/08/1994 | US5361970 Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads |
11/08/1994 | US5361914 Device for component processing |
11/08/1994 | US5361789 Washing/drying method and apparatus |
11/08/1994 | US5361787 Cleaning apparatus |
11/08/1994 | US5361721 Continuous process; from molten polycrystals such as silicon |
11/08/1994 | US5361515 Method of drying a protective polymer coating applied onto a surface of an article from a solution, and device for effecting thereof |
11/08/1994 | US5361492 Method of mounting terminals to substrate |
11/08/1994 | US5361491 Process for producing an IC-mounting flexible circuit board |
11/08/1994 | US5361490 Method for making tape automated bonding (TAB) semiconductor device |
11/08/1994 | US5361449 Cleaning apparatus for cleaning reverse surface of semiconductor wafer |
11/08/1994 | CA2009405C Microwave integrated circuit using a distributed line with a variable effective length |
11/03/1994 | DE4414729A1 Material for a line frame and line frame for semiconductor components |
11/03/1994 | DE4413815A1 Production method for a semiconductor device |
11/02/1994 | EP0622858A2 Gallium nitride-based III-V group compound semiconductor device and method of producing the same |
11/02/1994 | EP0622852A1 A field effect transistor and a production method therefor |
11/02/1994 | EP0622850A1 An electrostatic discharge protect diode for silicon-on-insulator technology |
11/02/1994 | EP0622849A1 A monolithic integrated structure of an electronic device having a predetermined unidirectional conduction threshold |
11/02/1994 | EP0622846A1 Fabrication and laser deletion of microfuses |
11/02/1994 | EP0622845A2 Apparatus and method for tape automated bonding beam lead insulation |
11/02/1994 | EP0622844A1 Method of forming low resistance contacts at the junction between regions having different conductivity types |
11/02/1994 | EP0622843A2 Reach-through isolation etching method for silicon-on-insulator devices |
11/02/1994 | EP0622842A2 A method of forming a frontside contact to the silicon substrate of a SOI wafer |
11/02/1994 | EP0622841A1 Method and apparatus for transportation of highly clean material |
11/02/1994 | EP0622840A2 Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module |
11/02/1994 | EP0622839A2 Process for connecting an integrated circuit to an external circuit |
11/02/1994 | EP0622838A1 Method of making an article comprising solder bump bonding |
11/02/1994 | EP0622837A1 An optical semiconductor device and a method of manufacturing the same |
11/02/1994 | EP0622836A1 Encapsulating process for electronic hybrid components enabled by spheres on a substrat |
11/02/1994 | EP0622835A1 Heterojunction compound semiconductor device and method of manufacturing the same |
11/02/1994 | EP0622834A2 Method to prevent latch-up and improve breakdown voltage in SOI MOSFETS |
11/02/1994 | EP0622833A1 Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same |
11/02/1994 | EP0622832A2 Method of connecting a wiring with a semiconductor region and semiconductor device obtained by this method |
11/02/1994 | EP0622807A2 Semiconductor memory device |
11/02/1994 | EP0622806A2 Nonvolatile semiconductor memory device |
11/02/1994 | EP0622760A1 External storage device and external storage device unit and method of producing external storage device |
11/02/1994 | EP0622735A1 Tie-up and tie-down circuits with a primary input for testability improvement of logic networks |
11/02/1994 | EP0622717A1 Temperature stable circuit for recycling discharge current during the driving of an inductive load |
11/02/1994 | EP0622683A1 Resist structures having through holes with shaped wall profiles and fabrication thereof |
11/02/1994 | EP0622680A2 Frame-supported dustproof pellicle for photolithographic photomask |
11/02/1994 | EP0622627A1 Method and apparatus for detecting particles on a substrate |
11/02/1994 | EP0622608A1 Scanning apparatus for investigating surface structures with a resolution of microns and method of its manufacture |
11/02/1994 | EP0622477A1 Etching aluminum and its alloys using HC1, C1-containing etchant and N2 |
11/02/1994 | EP0622475A1 Method and apparatus for degassing semiconductor processing liquids |
11/02/1994 | EP0622472A1 Method for growing a diamond or c-BN thin film on a diamond or c-BN substrate |
11/02/1994 | EP0622155A1 Polishing pad and a method of polishing a semiconductor substrate |
11/02/1994 | EP0622151A1 An Article comprising a pb-free solder having improved mechanical properties |
11/02/1994 | EP0622149A1 A capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |