Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1996
10/02/1996EP0735593A1 MESFET with recessed gate and method for producing same
10/02/1996EP0735592A2 MOS thin film transistor and method of fabricating the same
10/02/1996EP0735590A2 Silicon bipolar transistor
10/02/1996EP0735587A2 BiMOS integrated circuit
10/02/1996EP0735586A2 Semi-conductor structures
10/02/1996EP0735585A2 Integrated circuit interconnection employing tungsten/aluminum layers
10/02/1996EP0735583A2 Semi-conductor integrated circuits
10/02/1996EP0735581A1 DRAM trench capacitor with insulating collar
10/02/1996EP0735580A1 Process for realizing trench isolation structures
10/02/1996EP0735579A1 Structure and method of coupling substrates
10/02/1996EP0735578A1 Ablation patterning of multi-layered structures
10/02/1996EP0735577A2 Deposition process and apparatus therefor
10/02/1996EP0735576A2 Integrated circuit fabrication
10/02/1996EP0735575A1 Vertical furnace
10/02/1996EP0735574A1 Improved slit valve door
10/02/1996EP0735573A1 Loading and unloading station for semiconductor treatment installations
10/02/1996EP0735572A1 Genesis pods
10/02/1996EP0735565A1 Method and apparatus for monitoring the dry etching of a dielectric film to a given thickness
10/02/1996EP0735428A2 Fine pattern forming method and fine pattern device
10/02/1996EP0735424A2 Photoresist with photoactive compound mixtures
10/02/1996EP0735422A1 Radiation-sensitive composition containing plasticizer
10/02/1996EP0735378A2 Method and arrangement for the analysis of the response of optically excited semiconductor materials
10/02/1996EP0735351A1 Circuit arrangement for detecting temperature in a semiconductor power device
10/02/1996EP0735159A1 Sputtering target
10/02/1996EP0735152A1 Molybdenum-tungsten material for wiring, molybdenum-tungsten target for wiring, process for producing the same, and molybdenum-tungsten wiring thin film
10/02/1996EP0735006A1 Method for producing silica glass used for photolithography, and silica glass and optical members produced by the method
10/02/1996EP0734824A2 Method and apparatus for dicing semiconductor wafers
10/02/1996EP0734617A1 Transmission system utilizing different coding principles
10/02/1996EP0734593A1 Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
10/02/1996EP0734587A1 Thin cavity down ball grid array package based on wirebond technology
10/02/1996EP0734586A1 Method for fabricating self-assembling microstructures
10/02/1996EP0734576A1 Anisotropic, electrically conductive adhesive film
10/02/1996EP0734463A1 Gas diffuser plate assembly and rf electrode
10/02/1996EP0712447A4 Welded susceptor assembly
10/02/1996EP0708694A4 Static megasonic cleaning system for cleaning objects
10/02/1996EP0424530B1 Resin-sealed semiconductor device
10/02/1996DE19612163A1 Verfahren zum Analysieren von Defekten in einer Halbleitervorrichtung A method of analyzing defects in a semiconductor device
10/02/1996DE19611043A1 Silicon wafer with stepped inclined surface
10/02/1996DE19611028A1 Belichtungsvorrichtung zur Herstellung von Halbleitervorrichtungen An exposure apparatus for producing semiconductor devices
10/02/1996DE19610302A1 Semiconductor encapsulation with numerous, external, intermediate connectors
10/02/1996DE19602767A1 Silicon@ wafer with restricted potassium concn.
10/02/1996DE19600946A1 Verfahren zur Verbesserung der Qualität einer Titannitridschicht, die Kohlenstoff und Sauerstoff enthält Includes methods for improving the quality of a titanium nitride layer, the carbon and oxygen
10/02/1996DE19547017A1 Selective face growth of cpd. semiconductor layer
10/02/1996DE19511898A1 Verfahren zur Flächenkontaktierung elektronischer Bauelemente A method for surface contact of electronic components
10/02/1996DE19511236A1 Silicon wafer cleaning soln. to remove metallic impurities
10/02/1996CN1132570A Patterned array of uniform metal microbeads
10/02/1996CN1132554A A method and device for testing of an integrated circuit
10/02/1996CN1132463A Method of laminating and circuitizing substrates having opening therein
10/02/1996CN1132462A Multi-strand substrate for ball-grid array assemblies and method
10/02/1996CN1132414A Semiconductor device and method of manufacturing the same
10/02/1996CN1132412A 半导体器件 Semiconductor devices
10/02/1996CN1132411A Method for providing isolation between semiconductor devices
10/02/1996CN1132409A Method for producing semiconductor devices, and crystal growth promoters
10/02/1996CN1132408A Thin silicon chip material on diamond film and its prepn.
10/02/1996CN1132407A Surface treatment method and system
10/02/1996CN1132317A Silicon microheating actuating pump and its mfg. tech
10/02/1996CN1032944C Method and appts. for use in forming prepositioned solder bumps on a pad arrangement
10/01/1996US5561735 Rapid thermal processing apparatus and method
10/01/1996US5561682 Semiconductor optical device and method for fabricating the same
10/01/1996US5561626 Semiconductor memory with hierarchical bit lines
10/01/1996US5561623 Semiconductor storage device
10/01/1996US5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
10/01/1996US5561585 Electrostatic chuck with reference electrode
10/01/1996US5561577 ESD protection for IC's
10/01/1996US5561495 Focusing method in photolithography
10/01/1996US5561385 Internal voltage generator for semiconductor device
10/01/1996US5561381 Method for testing a partially constructed electronic circuit
10/01/1996US5561377 System for evaluating probing networks
10/01/1996US5561373 Method and device for detecting electrostatic stress applied to a product semiconductor device during each production process
10/01/1996US5561367 Structure and method for testing wiring segments in an integrated circuit device
10/01/1996US5561328 Photo-definable template for semiconductor chip alignment
10/01/1996US5561326 Large scale integrated circuit device
10/01/1996US5561324 Semiconductor chip mounting sector
10/01/1996US5561323 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
10/01/1996US5561318 Porous composites as a low dielectric constant material for electronics applications
10/01/1996US5561317 Method of manufacturing semiconductor devices
10/01/1996US5561316 Epitaxial silicon starting material
10/01/1996US5561314 Manufacture of semiconductor device with field oxide
10/01/1996US5561312 Protection device for a CMOS integrated circuit apparatus
10/01/1996US5561310 Storage electrode of DRAM cell
10/01/1996US5561309 Structure of a charge storage electrode
10/01/1996US5561308 Semiconductor device including thin film transistor
10/01/1996US5561307 Ferroelectric integrated circuit
10/01/1996US5561306 Hetero-bipolar transistor having a plurality of emitters
10/01/1996US5561304 Electroluminescent silicon device
10/01/1996US5561302 Enhanced mobility MOSFET device and method
10/01/1996US5561299 X-Y stage and charged particle beam exposure apparatus
10/01/1996US5561293 Method of analyzing a failure of a sample
10/01/1996US5561248 Acceleration sensor
10/01/1996US5561088 Heating method and manufacturing method for semiconductor device
10/01/1996US5561087 Variations in temperature between central and edges portions
10/01/1996US5561086 Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
10/01/1996US5561085 Structure for protecting air bridges on semiconductor chips from damage
10/01/1996US5561084 Forming aluminum multilayer interconnections consisting of aluminum or aluminum alloy films having small specific resistance
10/01/1996US5561083 Method of making multilayered Al-alloy structure for metal conductors
10/01/1996US5561082 Heat treatment
10/01/1996US5561081 Method of forming a semiconductor device by activating regions with a laser light
10/01/1996US5561079 Stalagraphy
10/01/1996US5561078 Method of fabrication of semiconductor device
10/01/1996US5561077 Dielectric element isolated semiconductor device and a method of manufacturing the same
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