Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/1996
09/10/1996US5554938 For evaluating a capability of wiring material
09/10/1996US5554888 Semiconductor device wiring structure
09/10/1996US5554887 Plastic molded semiconductor package
09/10/1996US5554885 Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape
09/10/1996US5554884 Multilevel metallization process for use in fabricating microelectronic devices
09/10/1996US5554883 Semiconductor device and manufacturing method therefor
09/10/1996US5554878 Intergrated high-voltage resistor including field-plate layers
09/10/1996US5554876 For controlling a flow of carriers by a voltage applied to a gate electrode
09/10/1996US5554873 Semiconductor device having polysilicon resistor with low temperature coefficient
09/10/1996US5554872 Semiconductor device and method of increasing device breakdown voltage of semiconductor device
09/10/1996US5554871 Semiconductor device having MOS transistor with nitrogen doping
09/10/1996US5554869 Electrically programmable read-only memory array
09/10/1996US5554867 Nonvolatile semiconductor memory device having a memory cell transistor and a select transistor
09/10/1996US5554866 Pre-oxidizing high-dielectric-constant material electrodes
09/10/1996US5554864 Semiconductor device having improved coverage with increased wiring layers
09/10/1996US5554861 Liquid crystal device
09/10/1996US5554857 Method and apparatus for ion beam formation in an ion implanter
09/10/1996US5554854 In situ removal of contaminants from the interior surfaces of an ion beam implanter
09/10/1996US5554824 IC package and packaging method for the same
09/10/1996US5554823 Packaging device and its manufacturing method
09/10/1996US5554797 Enhance photosensitivity and/or rate of development of photoresists
09/10/1996US5554684 Forming polyimide coating by screen printing
09/10/1996US5554570 Method of forming insulating film
09/10/1996US5554569 Method and apparatus for improving interfacial adhesion between a polymer and a metal
09/10/1996US5554568 Polysilicon trench and buried polysilicon wall device structures
09/10/1996US5554567 Method for improving adhesion to a spin-on-glass
09/10/1996US5554566 Method to eliminate polycide peeling
09/10/1996US5554565 Borophosphosilicate glass, tetraethyl silicate
09/10/1996US5554564 Pre-oxidizing high-dielectric-constant material electrodes
09/10/1996US5554563 In situ hot bake treatment that prevents precipitate formation after a contact layer etch back step
09/10/1996US5554562 Advanced isolation scheme for deep submicron technology
09/10/1996US5554561 Epitaxial overgrowth method
09/10/1996US5554560 Method for forming a planar field oxide (fox) on substrates for integrated circuit
09/10/1996US5554559 Method of manufacturing a semiconductor device having a capacitor with a ferroelectric, dielectric
09/10/1996US5554558 Method of making high precision w-polycide-to-poly capacitors in digital/analog process
09/10/1996US5554557 Method for fabricating a stacked capacitor with a self aligned node contact in a memory cell
09/10/1996US5554556 Method of making a semiconductor memory device having an increased capacitance of memory cell
09/10/1996US5554555 Planarizing by polishing techniques for fabricating semiconductor devices based on CMOS structures
09/10/1996US5554554 Process for fabricating two loads having different resistance levels in a common layer of polysilicon
09/10/1996US5554553 Highly compact EPROM and flash EEPROM devices
09/10/1996US5554552 PN junction floating gate EEPROM, flash EPROM device and method of manufacture thereof
09/10/1996US5554551 Method of manufacture of an EEPROM cell with self-aligned thin dielectric area
09/10/1996US5554550 Method of fabricating electrically eraseable read only memory cell having a trench
09/10/1996US5554549 Lightly doped drains
09/10/1996US5554548 Method of fabricating a one-sided polysilicon thin film transistor
09/10/1996US5554547 Integrated circuits, liquid crystal displays
09/10/1996US5554546 Method of fabricating a high voltage transistor
09/10/1996US5554545 Method of forming neuron mosfet with different interpolysilicon oxide thickness
09/10/1996US5554544 Field edge manufacture of a T-gate LDD pocket device
09/10/1996US5554543 Process for fabricating bipolar junction transistor having reduced parasitic capacitance
09/10/1996US5554489 Method of forming a fine resist pattern using an alkaline film covered photoresist
09/10/1996US5554488 Semiconductor device structure and method of formation thereof
09/10/1996US5554486 Techniques for uniformizing photoresist thickness and critical dimension of underlying features through aerosol application of photoresist
09/10/1996US5554485 Mid and deep-UV antireflection coatings and methods for use thereof
09/10/1996US5554443 Bonding wire with heat and abrasion resistant coating layers
09/10/1996US5554312 Polar solvent, amine, polyethylene glycol or polypropylene glycol
09/10/1996US5554305 Applying and ablating specified material over a substrate
09/10/1996US5554266 Semiconductor device manufacturing apparatus
09/10/1996US5554257 Cleaning or etching semiconductors by reacting gases in vacuum; explosion, combustion, projecting
09/10/1996US5554256 Method of manufacturing a semiconductor device having a semiconductor body with field insulation regions formed by grooves filled with insulating material
09/10/1996US5554254 Post contact layer etch back process which prevents precipitate formation
09/10/1996US5554249 Magnetron plasma processing system
09/10/1996US5553994 Thermal process module for substrate coat/develop system
09/10/1996US5553769 Interconnection of a carrier substrate and a semiconductor device
09/10/1996US5553711 Storage container for integrated circuit semiconductor wafers
09/10/1996US5553700 Treatment method and apparatus for printed circuit boards and the like
09/10/1996US5553566 Method of eliminating dislocations and lowering lattice strain for highly doped N+ substrates
09/10/1996US5553396 Vacuum processing apparatus and operating method therefor
09/10/1996CA2063371C Selective etching of refractory metal nitrides
09/06/1996WO1996027230A1 Protective circuit for series-connected power semiconductors
09/06/1996WO1996027226A1 Bandgap tuning of semiconductor well structure
09/06/1996WO1996027212A1 An improved laser ablateable material
09/06/1996WO1996027210A2 Electronic component comprising a thin-film structure with passive elements
09/06/1996WO1996027209A1 Arrangement of electronic components on a carrier strip
09/06/1996WO1996027208A1 Method for forming a structure using redeposition
09/06/1996WO1996027207A1 Iii-v semiconductor component and method for making same
09/06/1996WO1996027206A2 Polysilicon polish for patterning improvement
09/06/1996WO1996027192A1 Method and apparatus for reduced fatigue in ferroelectric memory elements
09/06/1996WO1996027032A1 Chemical vapor deposition utilizing a precursor
09/06/1996WO1996026910A1 Novel silicon carbide dummy wafer
09/06/1996WO1996026875A1 Method and apparatus for transporting lead frame, and in-line system using them
09/06/1996WO1996026874A1 Standard mechanical interface integrated vacuum loadlock chamber
09/06/1996WO1996026808A1 Metallised under-layer for (soldering) filler materials
09/06/1996WO1996026781A1 Method of controlling crystallization of organic compounds and solid-state component for controlling crystallization in said method
09/06/1996CA2214109A1 An improved laser ablateable material
09/06/1996CA2188290A1 Novel silicon carbide dummy wafer
09/05/1996DE3745015C2 Semiconductor mfr. using source and etching gases
09/05/1996DE19607974A1 Wiring arrangement switching body with associated circuit board and body
09/05/1996DE19507547A1 Assembly of semiconductor chips using double-sided supporting plate
09/05/1996DE19507207A1 Solder metal contact bump on multiple metal contact face formation method
09/05/1996DE19507132A1 Anordnung von elektronischen Bauelementen auf einem Trägerstreifen Arrangement of electronic components on a carrier strip
09/04/1996EP0730332A1 Semiconductor component with electrostatic discharge protection structure
09/04/1996EP0730317A1 Structures for filters and/or resonators
09/04/1996EP0730311A2 Wafer bonding of light emitting diode layers
09/04/1996EP0730310A1 Electrically programmable and erasable non-volatile memory cell and memory devices of FLASH and EEPROM type
09/04/1996EP0730309A1 A high voltage MOSFET structure with field plate electrode and process for its fabrication
09/04/1996EP0730307A2 FET technology with dielectrically isolated sources and drains
09/04/1996EP0730305A1 High voltage N-channel MOSFET in CMOS-type technology and relating manufacturing process
09/04/1996EP0730303A2 Microelectronic integrated circuit including hexagonal CMOS "NAND" gate device
09/04/1996EP0730302A2 Vertical switched-emitter structure with improved lateral isolation
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