Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1996
08/14/1996EP0726593A1 A high power, plasma-based, reactive species generator
08/14/1996EP0726575A2 Semiconductor integrated circuit device
08/14/1996EP0726567A2 Semiconductor layer structure as a recording medium
08/14/1996EP0726538A2 Topology-based computer-aided design system for digital circuits and method thereof
08/14/1996EP0726500A1 Chemically amplified, radiation-sensitive resin composition
08/14/1996EP0726470A2 Electro-optic voltage measurement apparatus
08/14/1996EP0726099A2 Method of removing surface contamination
08/14/1996EP0725980A1 Method of fabrication of an integrated circuit chip containing eeprom and capacitor
08/14/1996EP0725979A1 Method of controlling oxide thinning in an eprom or flash memory array
08/14/1996EP0725978A1 Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same
08/14/1996EP0725975A1 Detection system for measuring high aspect ratio
08/14/1996EP0725939A1 Head-mounted display system
08/14/1996EP0711455A4 Shadow clamp
08/14/1996EP0654173A4 High density power device structure and fabrication process.
08/14/1996EP0465515B1 Process and device for monitoring ion assisted machining processes on wafers
08/14/1996DE19605254A1 Multi-stage CVD process for semiconductor device mfr.
08/14/1996DE19504684A1 Semiconductor device with silicone ladder resin film
08/14/1996DE19504543A1 Verfahren zur Formung von Anschlußhöckern auf elektrisch leitenden mikroelektronischen Verbindungselementen zum lothöcker-freien Tab-Bonden A method for forming bumps on connection electrically conductive microelectronic connection elements for free solder bump TAB bonding
08/14/1996DE19504351A1 Verfahren zur Substratfixierung von elektronischen Bauelementen A method for substrate fixation of electronic components
08/14/1996DE19504350A1 Verfahren zum Umschmelzen einer Kontaktflächenmetallisierung Process of refining a Kontaktflächenmetallisierung
08/14/1996CN1128934A Tool for surface mounting device head and automatic changing apparatus thereof
08/14/1996CN1128902A Device for semiconductor integrated circuit
08/14/1996CN1128901A Method for mfg. encapsulated substrate type semiconductor device
08/14/1996CN1128900A Semiconductor device mfg. method
08/14/1996CN1128899A Method for mfg. semiconductor integrated circuit device
08/14/1996CN1128898A Semiconductor device and method for mfg. same
08/14/1996CN1128897A Phase shift mask and method for fabricating same
08/14/1996CN1128869A Driving circuit for active matrix indicator element and mfg. method thereof
08/13/1996US5546417 Semiconductor architecture and application thereof
08/13/1996US5546402 Flash-erase-type nonvolatile semiconductor storage device
08/13/1996US5546349 Exchangeable hierarchical data line structure
08/13/1996US5546345 Semiconductor memory device having bipolar transistor
08/13/1996US5546341 Nonvolatile semiconductor memory
08/13/1996US5546326 Dynamic dispatching rule that uses long term due date and short term queue time to improve delivery performance
08/13/1996US5546322 Method and system for analyzing plasma data
08/13/1996US5546279 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board
08/13/1996US5546068 Sense amplifier
08/13/1996US5546044 Voltage generator circuit providing potentials of opposite polarity
08/13/1996US5546012 Probe card assembly having a ceramic probe card
08/13/1996US5545962 Positioning system
08/13/1996US5545925 Semiconductor device having a metallic silicide layer for improved operational rates
08/13/1996US5545922 Dual sided integrated circuit chip package with offset wire bonds and support block cavities
08/13/1996US5545919 Semiconductor device and method of fabricating the same
08/13/1996US5545918 Integrated circuit
08/13/1996US5545916 High Q integrated inductor
08/13/1996US5545914 Semiconductor device having zener diodes with temperature stability between base and collector regions
08/13/1996US5545911 Semiconductor device having mosfets formed in inherent and well regions of a semiconductor substrate
08/13/1996US5545909 Electrostatic discharge protection device for integrated circuit
08/13/1996US5545908 Vertical type insulated-gate semiconductor device
08/13/1996US5545907 Semiconductor device and method of forming the same
08/13/1996US5545906 Non-volatile semiconductor memory device with contamination protection layers
08/13/1996US5545902 Electron beam lithography system
08/13/1996US5545868 Superhigh purity fluid supply pipe system and method of installing the same
08/13/1996US5545592 Forming metal silicide layer, converting portion of silicide layer to nitride, depositing second nitride layer, depositing metal layer
08/13/1996US5545591 First covering the surface of contact hole or via-hole with a film of refractory metal or refractory metal compound; step coverage is good; no voids
08/13/1996US5545590 Intermetallic collar of aluminum copper is formed by single or multiple step
08/13/1996US5545589 Forming bumps, grinding against flat sheet, conducting ultrasonic vibration to form irregularities on bumps
08/13/1996US5545588 Controlling width of polysilicon; depositing semiconductor layer over surface of planarization layer which is opaque to actinic light
08/13/1996US5545586 Method of making a transistor having easily controllable impurity profile
08/13/1996US5545585 Global planarization to form array of stacked capacitors
08/13/1996US5545584 Unified contact plug process for static random access memory (SRAM) having thin film transistors
08/13/1996US5545583 Method of making semiconductor trench capacitor cell having a buried strap
08/13/1996US5545582 Method for manufacturing semiconductor device capacitor
08/13/1996US5545581 Plug strap process utilizing selective nitride and oxide etches
08/13/1996US5545579 Method of fabricating a sub-quarter micrometer channel field effect transistor having elevated source/drain areas and lightly doped drains
08/13/1996US5545578 Method of maufacturing a semiconductor device having a low resistance gate electrode
08/13/1996US5545577 Method of producing a semiconductor device having two MIS transistor circuits
08/13/1996US5545576 Method for manufacturing a thin film transistor panel
08/13/1996US5545575 Method for manufacturing an insulated gate semiconductor device
08/13/1996US5545574 Process for forming a semiconductor device having a metal-semiconductor compound
08/13/1996US5545573 Method of fabricating insulated gate semiconductor device
08/13/1996US5545572 Method for fabricating electrostatic discharge protecting transistor
08/13/1996US5545571 Field effect transistor barriers, multilayer insulating films and conductive films of aluminum, chromium, titanium, tantalum and silicon or alloys with oxide films for voltage
08/13/1996US5545570 Method of inspecting first layer overlay shift in global alignment process
08/13/1996US5545512 Forming silicon reactive region in surface region of photoresist, softbaking in silicon environment, forming silicon rich region, applying second photoresist layer, patterning, etching with oxygen and forming silicon
08/13/1996US5545509 Photoresist composition with photosensitive base generator
08/13/1996US5545465 Using a permanent mask with cavity openings around conductive pads on a carrier
08/13/1996US5545452 Using gold, silver, platinum or palladium metal thionate containing atleast one functional group capable of salt formation with alkyamines or hydroxyethylamines
08/13/1996US5545440 Method and apparatus for polymer coating of substrates
08/13/1996US5545436 CVD method and apparatus for making silicon oxide films
08/13/1996US5545432 Synthesis of metal oxide thin films
08/13/1996US5545291 Transferring shaped block with fluid
08/13/1996US5545290 Masking the silicon substrate with silicon dioxide layer, introducing etchant and passivation material, adductively bonding passivation material and silicon dangling bond
08/13/1996US5545289 Corrosion resistance
08/13/1996US5545283 Apparatus for bonding wafer pairs
08/13/1996US5545281 Forming metal bumps on surface; covering with radiation curable resin; patterning; thermocompression
08/13/1996US5545076 Apparatus for gringing a semiconductor wafer while removing dust therefrom
08/13/1996US5545050 IC socket
08/13/1996US5545045 IC contactor
08/13/1996US5544804 Capillary designs and process for fine pitch ball bonding
08/13/1996US5544776 Using 4-methoxy-1-butanol, 3-methoxy-1-butanol and propylene carbonate; rinsing
08/13/1996US5544771 Method for manufacturing a collimator
08/13/1996US5544616 Crystallization from high temperature solutions of Si in Cu/Al solvent
08/13/1996US5544421 Semiconductor wafer processing system
08/13/1996US5544412 Method for coupling a power lead to a bond pad in an electronic module
08/08/1996WO1996024164A1 Integrated circuits with borderless vias
08/08/1996WO1996024163A1 Process for producing a glass-coated article and article produced thereby
08/08/1996WO1996024161A1 Electronic device and process for making same
08/08/1996WO1996024160A2 Method of manufacturing a semiconductor device with a semiconductor body with field insulation regions provided with recessed connection conductors
08/08/1996WO1996024159A1 Semiconductor device
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