| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/29/2015 | US20150031146 Tool for annealing of magnetic stacks |
| 01/29/2015 | US20150030766 Pedestal bottom clean for improved fluorine utilization and integrated symmetric foreline |
| 01/29/2015 | US20150030533 Compositions and methods for the detection diagnosis and therapy of hematological malignancies |
| 01/29/2015 | US20150030418 Processing station for two-dimensional substrates and method for processing two-dimensional substrates |
| 01/29/2015 | US20150030416 Storage container, shutter opening/closing unit of storage container, and wafer stocker using storage container and shutter opening/closing unit |
| 01/29/2015 | US20150029638 Polyimides as dielectrics |
| 01/29/2015 | US20150029483 Exposure Device, Exposure Method and Method of Manufacturing Semiconductor Device |
| 01/29/2015 | US20150028500 Forming alignment mark and resulting mark |
| 01/29/2015 | US20150028497 Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus |
| 01/29/2015 | US20150028496 Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure |
| 01/29/2015 | US20150028491 Improved SiCOH Hardmask with Graded Transition Layers |
| 01/29/2015 | US20150028490 Integrated circuits having device contacts and methods for fabricating the same |
| 01/29/2015 | US20150028489 Method for off-grid routing structures utilizing self aligned double patterning (sadp) technology |
| 01/29/2015 | US20150028488 Method for manufacturing a conducting contact on a conducting element |
| 01/29/2015 | US20150028486 Interconnect structures for embedded bridge |
| 01/29/2015 | US20150028483 Novel method for electromigration and adhesion using two selective deposition |
| 01/29/2015 | US20150028482 Device layout for reducing through-silicon-via stress |
| 01/29/2015 | US20150028479 Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
| 01/29/2015 | US20150028475 Technique for wafer-level processing of qfn packages |
| 01/29/2015 | US20150028471 Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control |
| 01/29/2015 | US20150028469 Semiconductor assembly and method of manufacture |
| 01/29/2015 | US20150028468 Non-leaded type semiconductor package and method of assembling same |
| 01/29/2015 | US20150028465 Semiconductor device and method of manufacturing the same |
| 01/29/2015 | US20150028463 Integrated Passives Package, Semiconductor Module and Method of Manufacturing |
| 01/29/2015 | US20150028460 Semiconductor component and method of manufacture |
| 01/29/2015 | US20150028459 Method for semiconductor self-aligned patterning |
| 01/29/2015 | US20150028458 Semiconductor device and method of fabricating the same |
| 01/29/2015 | US20150028457 Epitaxial substrate, semiconductor device, and method for manufacturing semiconductor device |
| 01/29/2015 | US20150028456 Semiconductor Device, a Semiconductor Wafer Structure, and a Method for Forming a Semiconductor Wafer Structure |
| 01/29/2015 | US20150028454 Finfet structures having silicon germanium and silicon channels |
| 01/29/2015 | US20150028449 Nanoparticles for making supercapacitor and diode structures |
| 01/29/2015 | US20150028447 Methods of forming an e-fuse for an integrated circuit product and the resulting e-fuse structure |
| 01/29/2015 | US20150028446 Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach |
| 01/29/2015 | US20150028431 Mol insitu pt rework sequence |
| 01/29/2015 | US20150028428 III-V Semiconductor Device with Interfacial Layer |
| 01/29/2015 | US20150028422 Analog circuit with improved layout for mismatch optimization |
| 01/29/2015 | US20150028415 Semiconductor component having a transition region |
| 01/29/2015 | US20150028410 Non-volatile memory device and method for manufacturing same |
| 01/29/2015 | US20150028409 Nonvolatile semiconductor memory device and method for manufacturing same |
| 01/29/2015 | US20150028391 Compound semiconductor device and method of manufacturing the same |
| 01/29/2015 | US20150028350 Controlled Ion Implantation Into Silicon Carbide Using Channeling And Devices Fabricated Using Controlled Ion Implantation Into Silicon Carbide Using Channeling |
| 01/29/2015 | US20150028343 Display panel, method for fabricating the same and display device |
| 01/29/2015 | US20150028342 Array substrate, manufacturing method thereof and display device |
| 01/29/2015 | US20150028338 Method for manufacturing x-ray flat panel detector and x-ray flat panel detector tft array substrate |
| 01/29/2015 | US20150028332 Semiconductor device, display device, and semiconductor device manufacturing method |
| 01/29/2015 | US20150028330 Semiconductor device and method for manufacturing semiconductor device |
| 01/29/2015 | US20150028288 Synthesis of CdSe/ZnS Core/Shell Semiconductor Nanowires |
| 01/29/2015 | US20150028285 Semiconductor nano layer structure and manufacturing method thereof |
| 01/29/2015 | US20150027981 Cmp method for forming smooth diamond surfaces |
| 01/29/2015 | US20150027971 Accommodation cassette |
| 01/29/2015 | US20150027767 System and method for lead frame package degating |
| 01/29/2015 | US20150027638 Substrate processing apparatus, substrate processing method and storage medium |
| 01/29/2015 | US20150027637 Plasma processing apparatus |
| 01/29/2015 | US20150027636 Scanner overlay correction system and method |
| 01/29/2015 | US20150027616 Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding |
| 01/29/2015 | US20150027552 Fluid supply system, wafer processing system, and method of supplying fluid to wafer processing equipment |
| 01/29/2015 | US20150027523 Nanostructures and Methods for Manufacturing the Same |
| 01/29/2015 | US20150027503 Liquid processing apparatus |
| 01/29/2015 | US20150027501 Substrate cleaning method and substrate cleaning apparatus |
| 01/29/2015 | US20150027492 Substrate cleaning apparatus, substrate cleaning method, and storage medium |
| 01/29/2015 | US20150027491 Double sided buff module for post cmp cleaning |
| 01/29/2015 | US20150027489 Mechanisms for cleaning wafer and scrubber |
| 01/29/2015 | US20150027366 Susceptor for securing semiconductor wafer |
| 01/29/2015 | US20150027290 Semiconductor die singulation methods |
| 01/29/2015 | US20150026953 Mechanical Alignment Of Substrates To A Mask |
| 01/29/2015 | DE112013002348T5 Herstellungsverfahren für ein Halbleitersubstrat Manufacturing method of a semiconductor substrate |
| 01/29/2015 | DE112013001612T5 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/29/2015 | DE112013001036T5 SiC-Halbleitervorrichtung und Verfahren zur Herstellung derselben SiC semiconductor device and method of manufacturing the same |
| 01/29/2015 | DE102014213439A1 Leiterrahmen, Stromumwandlungsvorrichtung, Halbleitergerät und Verfahren zur Herstellung eines Halbleitergeräts Lead frame, power conversion device, the semiconductor device and process for producing a semiconductor device |
| 01/29/2015 | DE102014208307A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 01/29/2015 | DE102014206355A1 Fluiddüservorrichtung und verfahren zur reinigung eines substrats damit Fluiddüservorrichtung and process of cleaning a substrate so that |
| 01/29/2015 | DE102014110552A1 Integriertes passivbauteilpackage, halbleitermodul und herstellungsverfahren Integrated passive component package, semiconductor module and the manufacturing processes |
| 01/29/2015 | DE102014110450A1 Integrierte Schaltung und Verfahren zum Herstellen einer integrierten Schaltung Integrated circuit and method for fabricating an integrated circuit |
| 01/29/2015 | DE102014110362A1 Leitende Kontaktinseln und Verfahren zu ihrer Herstellung Conductive contact pads and methods for their preparation |
| 01/29/2015 | DE102014110358A1 Verfahren zum bearbeiten eines werkstücks A method for processing a workpiece |
| 01/29/2015 | DE102014110316A1 Halbleitervorrichtung, Halbleiterwaferstruktur und Verfahren zur Bildung einer Halbleiterwaferstruktur A semiconductor device, semiconductor wafer structure and method of forming a semiconductor wafer structure |
| 01/29/2015 | DE102014109981A1 Chip-Package mit passiven Komponenten Chip package with passive components |
| 01/29/2015 | DE102014109940A1 Verfahren für MEMS-Kappen-Arbeitsablauf für vielgestaltige Topographie Method for MEMS caps workflow for diverse topography |
| 01/29/2015 | DE102014109909A1 Chipbaugruppe mit eingebetteter passiver Komponente Chip module with embedded passive component |
| 01/29/2015 | DE102013214486A1 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Optoelectronic component and process for its preparation |
| 01/29/2015 | DE102013107971A1 Optoelektronischer Halbleiterchip, Halbleiterbauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip, semiconductor device and process for the production of optoelectronic semiconductor chips |
| 01/29/2015 | DE102013107910A1 Verfahren zur Herstellung einer Solarzelle, insbesondere einer Silizium-Dünnschicht-Solarzelle A process for producing a solar cell, especially a thin-film silicon solar cell |
| 01/29/2015 | DE102013107862A1 Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines oberflächenmontierbaren optoelektronischen Halbleiterbauteils Surface-mountable optoelectronic semiconductor device and process for the preparation of at least one surface-mountable optoelectronic semiconductor component |
| 01/29/2015 | DE102006019936B4 Halbleiterbauelement mit unterschiedlich verspannten Ätzstoppschichten in Verbindung mit PN-Übergängen unterschiedlicher Gestaltung in unterschiedlichen Bauteilgebieten und Verfahren zur Herstellung des Halbleiterbauelements A semiconductor device with strained different etch stop layers in conjunction with PN junctions of various design in different device regions and method of manufacturing the semiconductor device |
| 01/29/2015 | DE102004043258B4 Halbleiteranordnung mit einem Paar von Wärmesenken und Verfahren zu deren Herstellung A semiconductor device comprising a pair of heat sinks and methods for their preparation |
| 01/29/2015 | DE10059511B4 Behälter zum Aufbewahren einer Schleifscheibe A container for storing a grinding wheel |
| 01/28/2015 | EP2830279A1 Interference avoidance technique for wireless networks used in critical applications |
| 01/28/2015 | EP2830097A1 Bipolar transistor having self-adjusted emitter contact |
| 01/28/2015 | EP2830096A1 III-V semiconductor device with interfacial layer |
| 01/28/2015 | EP2830087A1 Method for interconnection of electrical components on a substrate |
| 01/28/2015 | EP2830086A1 Method for manufacturing a spacer for a double-gate electronic memory cell and related electronic memory cell |
| 01/28/2015 | EP2830085A1 Semiconductor device and method for manufacturing same |
| 01/28/2015 | EP2830084A1 Method for producing silicon carbide semiconductor device |
| 01/28/2015 | EP2829579A1 Curable composition, cured product, and method for using curable composition |
| 01/28/2015 | EP2829383A1 Method of molding a thermoplastic resin article and apparatus for molding same |
| 01/28/2015 | EP2828892A1 Electroconductive thin film, coating liquid for forming electroconductive thin film, field-effect transistor, and method for producing field-effect transistor |
| 01/28/2015 | EP2828888A1 Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone |
| 01/28/2015 | EP2828887A1 Method for reducing damage to low-k gate spacer during etching |
| 01/28/2015 | EP2828886A1 Keyed wafer carrier |
| 01/28/2015 | EP2828885A1 Pressure transfer plate for pressure transfer of a bonding pressure |