Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/04/2015CN102138203B 结构化磨料制品、其制备方法、及其在晶片平面化中的用途 Structured abrasive article, methods for their preparation, and their use in the planarization of the wafer
02/04/2015CN102109771B 一种半导体器件的检测方法 Detection method of a semiconductor device
02/04/2015CN102105963B 生长薄膜的方法以及形成结构的方法和器件 The method of film growth and a method and device structures formed
02/04/2015CN102082116B 使用双沟槽工艺在半导体器件中制造侧接触的方法 Using a dual trench process contact side in the semiconductor device manufacturing method
02/04/2015CN102074536B 功率半导体装置及其制造方法 The power semiconductor device and manufacturing method thereof
02/04/2015CN102034780B 集成电路芯片、具有该芯片的倒装芯片封装和其制造方法 IC chip, the chip flip chip package and method for manufacturing
02/04/2015CN102005449B 显示装置及其制造方法 Display device and manufacturing method
02/04/2015CN102005433B 带连接端子的基板 Tape substrate connecting terminal
02/04/2015CN101997003B 半导体装置 Semiconductor device
02/04/2015CN101937837B 具有大纵横比圆柱形电容器的半导体器件及其制造方法 A capacitor having a large aspect ratio of the cylindrical semiconductor device and manufacturing method thereof
02/04/2015CN101909859B 辊型纳米压印装置、辊型纳米压印装置用模具辊、辊型纳米压印装置用固定辊以及纳米压印片的制造方法 Nanoimprinter device nanoimprinter device mold roller, the roller nanoimprint apparatus with a fixed roll and nano imprint method for manufacturing tablets
02/04/2015CN101890578B 半导体晶片的激光加工方法 Semiconductor wafer laser processing method
02/04/2015CN101803014B 形成用于改进微电子封装中的第一级互连和环氧树脂底部填料之间的粘结的纳米涂层的方法以及由此形成的结构 The method of forming a nano coating layer for improving the adhesion of a first stage in microelectronic packaging and interconnection between the epoxy underfill, and the structure thus formed
02/03/2015USRE45361 Semiconductor device manufacturing method having high aspect ratio insulating film
02/03/2015US8948911 Control device and control method for controlling carriers in a machine
02/03/2015US8948908 Automated warehouse and article removal method
02/03/2015US8948905 Apparatus and method for positioning an electronic component and/or a carrier relative to a discharging device
02/03/2015US8948562 Replication of patterned thin-film structures for use in plasmonics and metamaterials
02/03/2015US8948561 Waveguide for efficient light trapping and absorption
02/03/2015US8948224 Semiconductor laser device and method of fabricating the same
02/03/2015US8947927 Gated diode memory cells
02/03/2015US8947912 Memory cell including unidirectional gate conductors and contacts
02/03/2015US8947776 Suction apparatus, semiconductor device observation device, and semiconductor device observation method
02/03/2015US8947665 Measurement method, measurement apparatus, exposure method, and exposure apparatus
02/03/2015US8947640 Positioning device, lithographic apparatus, positioning method and device manufacturing method
02/03/2015US8947637 Lithographic apparatus and device manufacturing method
02/03/2015US8947593 Solid-state image sensing apparatus and electronic apparatus to improve image quality of an image
02/03/2015US8946914 Contact power rail
02/03/2015US8946913 Short and low loop wire bonding
02/03/2015US8946912 Active area bonding compatible high current structures
02/03/2015US8946909 Semiconductor package having gap-filler injection-friendly structure
02/03/2015US8946908 Dual-metal self-aligned wires and vias
02/03/2015US8946907 Self-aligned nano-structures
02/03/2015US8946903 Electrically conductive laminate structure containing graphene region
02/03/2015US8946902 Device and method for manufacturing a device
02/03/2015US8946901 Microelectronic package and method of manufacture thereof
02/03/2015US8946899 Via in substrate with deposited layer
02/03/2015US8946898 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
02/03/2015US8946897 Semiconductor device having metal lines with slits
02/03/2015US8946896 Extended liner for localized thick copper interconnect
02/03/2015US8946895 Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus
02/03/2015US8946894 Package for high-power semiconductor devices
02/03/2015US8946893 Apparatus for dicing interposer assembly
02/03/2015US8946884 Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product
02/03/2015US8946883 Wafer level fan-out package with a fiducial die
02/03/2015US8946880 Packaged semiconductor device having multilevel leadframes configured as modules
02/03/2015US8946872 Method for producing a semiconductor
02/03/2015US8946870 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
02/03/2015US8946869 Integrated circuit for detecting defects of through chip via
02/03/2015US8946864 Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same
02/03/2015US8946863 Epitaxial substrate for electronic device comprising a high resistance single crystal substrate on a low resistance single crystal substrate, and method of manufacturing
02/03/2015US8946862 Methods for forming bipolar transistors
02/03/2015US8946859 Device for detecting an attack in an integrated circuit chip
02/03/2015US8946856 Decoupling capacitors for integrated circuits
02/03/2015US8946855 Semiconductor device and method for manufacturing the same
02/03/2015US8946853 Diffusion sidewall for a semiconductor structure
02/03/2015US8946849 BSI image sensor chips with separated color filters and methods for forming the same
02/03/2015US8946848 Apparatus and method for image sensor with carbon nanotube based transparent conductive coating
02/03/2015US8946844 Integration of a titania layer in an anti-reflective coating
02/03/2015US8946843 Solid-state image sensing device
02/03/2015US8946842 Method for manufacturing optical waveguide receiver and optical waveguide receiver
02/03/2015US8946830 Metal oxide protective layer for a semiconductor device
02/03/2015US8946829 Selective fin-shaping process using plasma doping and etching for 3-dimensional transistor applications
02/03/2015US8946828 Semiconductor device having elevated structure and method of manufacturing the same
02/03/2015US8946826 Semiconductor device
02/03/2015US8946820 Method for manufacturing semiconductor substrate, substrate for forming semiconductor substrate, stacked substrate, semiconductor substrate, and electronic device
02/03/2015US8946816 High frequency switching MOSFETs with low output capacitance using a depletable P-shield
02/03/2015US8946814 Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates
02/03/2015US8946809 Method for manufacturing semiconductor memory device and semiconductor memory device
02/03/2015US8946808 Semiconductor device and method of manufacturing the same
02/03/2015US8946806 Memory cell with decoupled channels
02/03/2015US8946805 Reduced area single poly EEPROM
02/03/2015US8946804 Semiconductor device and method of manufacturing the same
02/03/2015US8946803 Method of forming a floating gate with a wide base and a narrow stem
02/03/2015US8946801 Field effect transistors (FETs) and methods of manufacture
02/03/2015US8946799 Silicon controlled rectifier with stress-enhanced adjustable trigger voltage
02/03/2015US8946791 Finfet with reduced parasitic capacitance
02/03/2015US8946790 Semiconductor device and method of manufacturing the same
02/03/2015US8946788 Method and system for doping control in gallium nitride based devices
02/03/2015US8946786 Semiconductor device and method for manufacturing same
02/03/2015US8946780 Ohmic contact schemes for group III-V devices having a two-dimensional electron gas layer
02/03/2015US8946778 Active area shaping of III-nitride devices utilizing steps of source-side and drain-side field plates
02/03/2015US8946777 Nitride-based transistors having laterally grown active region and methods of fabricating same
02/03/2015US8946775 Nitride semiconductor structure
02/03/2015US8946773 Multi-layer semiconductor buffer structure, semiconductor device and method of manufacturing the semiconductor device using the multi-layer semiconductor buffer structure
02/03/2015US8946772 Substrate for epitaxial growth, process for manufacturing GaN-based semiconductor film, GaN-based semiconductor film, process for manufacturing GaN-based semiconductor light emitting element and GaN-based semiconductor light emitting element
02/03/2015US8946769 Lateral devices containing permanent charge
02/03/2015US8946767 Monolithic semiconductor switches and method for manufacturing
02/03/2015US8946758 Organic light emitting display device and method of manufacturing organic light emitting display device
02/03/2015US8946754 Flexible hermetic thin film with light extraction layer
02/03/2015US8946745 Supporting substrate for manufacturing vertically-structured semiconductor light-emitting device and semiconductor light-emitting device using the supporting substrate
02/03/2015US8946742 Semiconductor package with through silicon vias
02/03/2015US8946730 Thin-film transistor device and method for manufacturing same, organic electroluminescent display element, and organic electroluminescent display device
02/03/2015US8946727 Zinc oxide based compound semiconductor device
02/03/2015US8946725 Vertical gallium nitride JFET with gate and source electrodes on regrown gate
02/03/2015US8946723 Epitaxial substrate and method for manufacturing epitaxial substrate
02/03/2015US8946721 Structure and method for using high-K material as an etch stop layer in dual stress layer process
02/03/2015US8946720 Organic light emitting diode display device and method of manufacturing the same
02/03/2015US8946718 Semiconductor element and display device using the same
02/03/2015US8946717 Semiconductor element and display device using the same
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