Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/08/2005US6852648 Semiconductor device having a low dielectric constant dielectric material and process for its manufacture
02/08/2005US6852647 Removable amorphous carbon CMP stop
02/08/2005US6852645 High temperature interface layer growth for high-k gate dielectric
02/08/2005US6852644 Atmospheric robot handling equipment
02/08/2005US6852643 Method for using ammonium fluoride solution in a photoelectrochemical etching process of a silicon wafer
02/08/2005US6852642 Gas assisted method for applying resist stripper and gas-resist stripper combinations
02/08/2005US6852641 Method of spiking mixed acid liquid in reactor
02/08/2005US6852640 Method for fabricating a hard mask
02/08/2005US6852639 Etching processing method for a material layer
02/08/2005US6852638 Selective base etching
02/08/2005US6852637 Method of etching a mask layer and a protecting layer for metal contact windows
02/08/2005US6852636 Insitu post etch process to remove remaining photoresist and residual sidewall passivation
02/08/2005US6852635 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
02/08/2005US6852634 Low cost method of providing a semiconductor device having a high channel density
02/08/2005US6852633 Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices
02/08/2005US6852632 Method of polishing a multi-layer substrate
02/08/2005US6852631 Copper polish slurry for reduced interlayer dielectric erosion and method of using same
02/08/2005US6852630 Electroetching process and system
02/08/2005US6852628 Method of insulating interconnects, and memory cell array with insulated interconnects
02/08/2005US6852627 Conductive through wafer vias
02/08/2005US6852626 Film deposition method and apparatus
02/08/2005US6852625 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
02/08/2005US6852624 Electroless plating process, and embedded wire and forming process thereof
02/08/2005US6852623 Method for manufacturing zinc oxide semiconductors
02/08/2005US6852622 Device and method for protecting against oxidation of a conductive layer in said device
02/08/2005US6852621 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment
02/08/2005US6852620 Semiconductor device with self-aligned junction contact hole and method of fabricating the same
02/08/2005US6852619 Dual damascene semiconductor devices
02/08/2005US6852618 Combined barrier layer and seed layer
02/08/2005US6852617 Semiconductor device fabrication method
02/08/2005US6852616 Semiconductor device and method for producing the same
02/08/2005US6852615 Ohmic contacts for high electron mobility transistors and a method of making the same
02/08/2005US6852614 Method of manufacturing semiconductor having group II-group VI compounds doped with nitrogen
02/08/2005US6852613 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
02/08/2005US6852612 Semiconductor device and method for fabricating the same
02/08/2005US6852611 ROM embedded DRAM with dielectric removal/short
02/08/2005US6852610 Semiconductor device and method for manufacturing the same
02/08/2005US6852609 Method of forming a polycrystalline silicon layer
02/08/2005US6852608 Production method for semiconductor chip
02/08/2005US6852607 Wafer level package having a side package
02/08/2005US6852606 Method for forming isolation layer of semiconductor device and semiconductor device
02/08/2005US6852605 Method of forming an inductor with continuous metal deposition
02/08/2005US6852604 Manufacturing method of semiconductor substrate
02/08/2005US6852603 Fabrication of abrupt ultra-shallow junctions
02/08/2005US6852602 Semiconductor crystal film and method for preparation thereof
02/08/2005US6852601 Heat treatment method that includes a low negative pressure
02/08/2005US6852600 Strained silicon MOSFET having silicon source/drain regions and method for its fabrication
02/08/2005US6852599 Method for fabricating MOS transistors
02/08/2005US6852598 Method for the fabrication of a DMOS transistor
02/08/2005US6852597 Method for fabricating power semiconductor device having trench gate structure
02/08/2005US6852596 Electronic memory circuit and related manufacturing method
02/08/2005US6852595 Method of manufacturing a flash memory cell
02/08/2005US6852594 Two-step source side implant for improving source resistance and short channel effect in deep sub-0.18μm flash memory technology
02/08/2005US6852593 Haze-free BST films
02/08/2005US6852592 Methods for fabricating semiconductor devices
02/08/2005US6852591 Method of forming CMOS imager with storage capacitor
02/08/2005US6852590 Deep trench capacitor and method of fabricating the same
02/08/2005US6852589 Method to modify 0.25 μm 1T-RAM by extra resist protect oxide (RPO) blocking
02/08/2005US6852588 Methods of fabricating semiconductor structures comprising epitaxial Hf3Si2 layers
02/08/2005US6852587 Method for fabricating a semiconductor device
02/08/2005US6852585 Semiconductor circuit arrangement and a method for producing same
02/08/2005US6852584 Method of trimming a gate electrode structure
02/08/2005US6852583 Method for the production and configuration of organic field-effect transistors (OFET)
02/08/2005US6852582 Carbon nanotube gate field effect transistor
02/08/2005US6852581 Methods of manufacturing a semiconductor device having increased gaps between gates
02/08/2005US6852580 Method of fabricating semiconductor device
02/08/2005US6852579 Method of manufacturing a semiconductor integrated circuit device
02/08/2005US6852577 Method for forming a low temperature polysilicon CMOS thin film transistor
02/08/2005US6852576 Method for forming structures in finfet devices
02/08/2005US6852575 Method of forming lattice-matched structure on silicon and structure formed thereby
02/08/2005US6852574 Method of forming a leadframe for a semiconductor package
02/08/2005US6852572 Method of manufacturing semiconductor device
02/08/2005US6852571 Method of manufacturing stacked semiconductor device
02/08/2005US6852570 Method of manufacturing a stacked semiconductor device
02/08/2005US6852569 Method of fabricating multilayer ceramic substrate
02/08/2005US6852567 Method of assembling a semiconductor device package
02/08/2005US6852566 Self-aligned rear electrode for diode array element
02/08/2005US6852565 CMOS image sensor with substrate noise barrier
02/08/2005US6852564 Semiconductor device and method of fabricating the same
02/08/2005US6852562 Low-cost method of forming a color imager
02/08/2005US6852560 Fabrication of a microchip-based electrospray device
02/08/2005US6852559 Transistor of semiconductor device, and method for manufacturing the same
02/08/2005US6852555 Method in the fabrication of organic thin-film semiconducting devices
02/08/2005US6852553 Semiconductor device fabrication method and semiconductor device fabrication apparatus
02/08/2005US6852551 Method of forming a ferroelectric film and fabrication process of a semiconductor device having a ferroelectric film
02/08/2005US6852549 Ferroelectric thin film processing for ferroelectric field-effect transistor
02/08/2005US6852474 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
02/08/2005US6852473 Anti-reflective coating conformality control
02/08/2005US6852472 Removal of defect particles that may be created during polysilicon hard mask etching, and that are embedded within the polysilicon layer, is disclosed. Oxide is first grown in the polysilicon layer exposed through the patterned hard mask
02/08/2005US6852471 Exposure control for phase shifting photolithographic masks
02/08/2005US6852467 Positive resist composition
02/08/2005US6852466 For producing well-resolved images
02/08/2005US6852454 Multi-tiered lithographic template and method of formation and use
02/08/2005US6852453 Fabrication method for semiconductor hole
02/08/2005US6852421 Microelectronic wafers having photosensitive antireflective polyester and photoresist multilayers used to form integrated circuits; relief images
02/08/2005US6852390 Ultraphobic surface for high pressure liquids
02/08/2005US6852373 Method for depositing a silicon-containing dielectric material on copper
02/08/2005US6852371 Metal processing for impurity gettering in silicon
02/08/2005US6852370 Composition for film formation and material for insulating film formation
02/08/2005US6852299 Having uniform mesopores, that is applicable to catalyst carrier, adsorbent, light functional material, electron functional material