Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/08/2005US6852263 An epoxy resin formulation with suppression in the generation of bowing and high relilability, containing an epoxy resin and phenol-novolak resin as curing agent; curing
02/08/2005US6852253 Thickness of substrate subject to growth made larger than or equal to 200 mu m and curvature thereof made smaller than or equal to 0.03 cm-1, curvature caused by difference in thermal expansion coefficients of the base and substrate
02/08/2005US6852242 Cleaning of multicompositional etchant residues
02/08/2005US6852240 Method of manufacturing a ferroelectric capacitor configuration
02/08/2005US6852209 Insoluble electrode for electrochemical operations on substrates
02/08/2005US6852194 Increasing the number of films to be deposited and decreasing the thickness thereof.
02/08/2005US6852187 Method and apparatus for separating member
02/08/2005US6852173 Use of high vapor pressure liquid with cryogenic cleaning to aid in removal of foreign materials from semiconductor surfaces
02/08/2005US6852168 Reactor for depositing thin film on wafer
02/08/2005US6852161 Method of fabricating group-iii nitride semiconductor crystal, method of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device
02/08/2005US6852136 Method for manufacturing tantalum oxy nitride capacitors
02/08/2005US6852019 Substrate holding apparatus
02/08/2005US6852012 Cluster tool systems and methods for in fab wafer processing
02/08/2005US6852009 Polishing formulation for polishing semiconductor wafer consists of a silicon dioxide, a base selected from inorganic salt of alkali metal, an ammonum salt, piperazine and ethylenediamine, at least one chelating agent free of EDTA
02/08/2005US6852007 Robotic method of transferring workpieces to and from workstations
02/08/2005US6852004 CMP machine dresser and method for detecting the dislodgement of diamonds from the same
02/08/2005US6851939 For forming deposition film of high quality on which adhesion force between a substrate and a metal film
02/08/2005US6851913 Transport system
02/08/2005US6851873 Method and apparatus for removing organic films
02/08/2005US6851872 Substrate processing apparatus and substrate processing method
02/08/2005US6851705 Dual output inflator with independent gas storage vessels
02/08/2005US6851598 Electronic component with a semiconductor chip and method for producing the electronic component
02/08/2005US6851436 Substrate processing using a fluid re-circulation system in a wafer scrubbing system
02/08/2005US6851435 Method and apparatus for localized liquid treatment of the surface of a substrate
02/08/2005US6851432 Aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water for removal of
02/08/2005US6851384 Remote plasma apparatus for processing substrate with two types of gases
02/08/2005US6851184 Method for manufacturing a printed circuit board
02/08/2005US6851170 Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment
02/08/2005US6851152 Substrate cleaning apparatus
02/08/2005US6851151 Brush drive assembly in a substrate processing brush box
02/08/2005CA2320064C Method of making microwave, multifunction modules using fluoropolymer composite substrates
02/08/2005CA2214123C Capacitor structure for an integrated circuit and method of fabrication thereof
02/08/2005CA2173222C Ultra high density, non-volatile ferromagnetic random access memory
02/03/2005WO2005010997A2 Nonplanar device with stress incorporation layer and method of fabrication
02/03/2005WO2005010996A1 Semiconductor device
02/03/2005WO2005010995A1 Electronic element, integrated circuit and process for fabricating the same
02/03/2005WO2005010993A1 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same
02/03/2005WO2005010992A1 A single device equivalent to cmos
02/03/2005WO2005010986A1 In-print method and in-print device
02/03/2005WO2005010984A2 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom
02/03/2005WO2005010983A2 Memory cell and method for producing a memory
02/03/2005WO2005010982A1 Pmos transistor strain optimization with raised junction regions
02/03/2005WO2005010981A2 Array of nanoscopic mosfet transistors and fabrication
02/03/2005WO2005010980A1 Bellows-supporting structure and movable stage device
02/03/2005WO2005010979A1 Laminating method and laminating device
02/03/2005WO2005010978A1 Method and apparatus for performing metrology dispatching based upon fault detection
02/03/2005WO2005010977A1 Methods of controlling properties and characteristics of a gate insulation layer based upon electrical test data, and system for performing same
02/03/2005WO2005010976A1 A programmable multi-chip module
02/03/2005WO2005010975A1 Planar magnetic tunnel junction substrate having recessed alignment marks
02/03/2005WO2005010974A1 Field effect transistor and method for manufacturing same
02/03/2005WO2005010973A1 Method for the self-adjusted reduction in size of structures
02/03/2005WO2005010972A1 Improvements in the use of silyating agents
02/03/2005WO2005010971A2 Ultaviolet curing processes for advanced low-k materials
02/03/2005WO2005010970A1 Substrate processing apparatus and substrate processing method
02/03/2005WO2005010969A1 Gas reaction system and semiconductor processing apparatus
02/03/2005WO2005010968A1 Two-dimensional patterning method, electronic device using same, and magnetic device fabricating method
02/03/2005WO2005010967A2 Device and method for machining the rear side of semiconductor chips
02/03/2005WO2005010966A1 Method for polishing wafer
02/03/2005WO2005010965A2 METHOD AND STRUCTURE OF STRAIN CONTROL OF SiGe BASED PHOTODETECTORS AND MODULATORS
02/03/2005WO2005010964A2 Silicon crystallization using self-assembled monolayers
02/03/2005WO2005010959A1 Development processing device and development processing method
02/03/2005WO2005010958A1 Fabrication of a feram capacitor using a noble metal hardmask
02/03/2005WO2005010957A1 Semiconductor pasted bonding body and production method therefor, and light emitting element and production method therefor
02/03/2005WO2005010956A2 Endeffectors for handling semiconductor wafers
02/03/2005WO2005010955A2 Method and apparatus for real-time in-situ ion implantation with closed loop control
02/03/2005WO2005010954A1 Multi-staged heating system for fabricating microelectronic devices
02/03/2005WO2005010950A2 Ultrasonic assisted etch using corrosive liquids
02/03/2005WO2005010949A2 Solution to thermal budget
02/03/2005WO2005010947A2 Cleaning masks
02/03/2005WO2005010946A2 DEPOSITION OF SiGe ON SILICON-ON-INSULATOR STRUCTURES AND BULK SUBSTRATES
02/03/2005WO2005010945A2 Failure analysis methods and systems
02/03/2005WO2005010944A2 Fet channel having a strained lattice structure along multiple surfaces
02/03/2005WO2005010936A2 Edge bead control method and apparatus
02/03/2005WO2005010935A2 Method and system for electronic spatial filtering of spectral reflectometer optical signals
02/03/2005WO2005010934A2 Three-dimensional integrated circuit structure and method of making same
02/03/2005WO2005010933A2 Micromirrors with mechanisms for enhancing coupling of the micromirrors with electrostatic fields
02/03/2005WO2005010930A2 Method for forming high resolution electronic circuits
02/03/2005WO2005010927A2 Anisotropic electroconductive film and method for the production thereof
02/03/2005WO2005010926A2 Procede de fabrication de film conducteur anisotrope
02/03/2005WO2005010895A1 Liquid composition for ferroelectric thin film formation and process for producing ferroelectric thin film
02/03/2005WO2005010892A1 Polymer memory device formed in via opening
02/03/2005WO2005010891A1 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high density memories, and method of making the same
02/03/2005WO2005010616A1 Positive photosensitive resin composition
02/03/2005WO2005010566A2 A micromirror having reduced space between hinge and mirror plate of the micromirror
02/03/2005WO2005010518A1 Rolled electrode array and its method for manufacture
02/03/2005WO2005010245A1 Method of manufacturing diamond substrates
02/03/2005WO2005010244A1 Silicon carbide product, method for producing same, and method for cleaning silicon carbide product
02/03/2005WO2005010243A1 Process for producing silicon single crystal substrate, method of measuring resistance characteristics and method of warranting resistance characteristics
02/03/2005WO2005010240A2 Low temperature methods for hermetically sealing reservoir devices
02/03/2005WO2005010077A1 Silicon-containing polymer, process for rpoducing the same, heat-resistant resin composition, and heat-resistant film
02/03/2005WO2005009684A1 Method for epiready surface treatment on sic thin films
02/03/2005WO2005009633A1 System and method of dry contract cleaning for removing particles from semiconductor wafers
02/03/2005WO2005009595A1 Unit for separating gas
02/03/2005WO2004109770A3 Through wafer via process and amplifier with through wafer via
02/03/2005WO2004107352A3 Use of voids between elements in semiconductor structures for isolation
02/03/2005WO2004105117A3 Production of an optoelectronic component that is encapsulated in plastic, and corresponding methods
02/03/2005WO2004102635A9 Methods for preserving strained semiconductor layers during oxide layer formation
02/03/2005WO2004097881A3 Beam uniformity and angular distribution measurement system
02/03/2005WO2004095525A3 Gate electrode for mos transistors
02/03/2005WO2004088739A3 Real-time in-line testing of semiconductor wafers