| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/15/2005 | US6855577 Semiconductor devices having different package sizes made by using common parts |
| 02/15/2005 | US6855576 Method for cleaning a ceramic member for use in a system for producing semiconductors, a cleaning agent and a combination of cleaning agents |
| 02/15/2005 | US6855575 Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof |
| 02/15/2005 | US6855574 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 02/15/2005 | US6855573 Integrated circuit package and manufacturing method therefor with unique interconnector |
| 02/15/2005 | US6855572 Castellation wafer level packaging of integrated circuit chips |
| 02/15/2005 | US6855571 Method of producing GaN-based semiconductor laser device and semiconductor substrate used therefor |
| 02/15/2005 | US6855567 Etch endpoint detection |
| 02/15/2005 | US6855565 Semiconductor device having ferroelectric film and manufacturing method thereof |
| 02/15/2005 | US6855564 Magnetic random access memory having transistor of vertical structure with writing line formed on an upper portion of the magnetic tunnel junction cell |
| 02/15/2005 | US6855563 Method of manufacturing a tunnel magneto-resistance based magnetic memory device |
| 02/15/2005 | US6855486 Lithographic method and apparatus |
| 02/15/2005 | US6855485 Prebaking photoresist film; exposure to ultraviolet radiation through photomask in vacuum; development |
| 02/15/2005 | US6855484 Method of forming a silicon carbide layer for use in integrated circuits is provided. The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a nitrogen source in the presence of an |
| 02/15/2005 | US6855481 Apparatus and a method for forming a pattern using a crystal structure of material |
| 02/15/2005 | US6855475 Photoresist composition |
| 02/15/2005 | US6855466 Planarizing antireflective coating compositions |
| 02/15/2005 | US6855464 Fast and flexible method and system for grating overlay patterns, semiconductors |
| 02/15/2005 | US6855463 Photomask having an intermediate inspection film layer |
| 02/15/2005 | US6855436 Thin, high-quality, substantially relaxed SiGe-on-insulator substrate materials which can then be used as lattice mismatched templates, i.e., substrates, for forming strained Si layers. |
| 02/15/2005 | US6855418 Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same |
| 02/15/2005 | US6855380 Method for the production of optical components with increased stability, components obtained thereby and their use |
| 02/15/2005 | US6855378 Printing of electronic circuits and components |
| 02/15/2005 | US6855377 Deposited film forming apparatus and deposited film forming method |
| 02/15/2005 | US6855370 Fluoropolymer interlayer dielectric by chemical vapor deposition |
| 02/15/2005 | US6855368 Chemisorbing alternating monolayers of two compounds with a carrier gas to control a quantity of the fluorine atoms associated with the monolayer |
| 02/15/2005 | US6855367 Method of producing electronic parts, and member for production thereof |
| 02/15/2005 | US6855267 For horizontally planarizing various kinds of layers, such as oxide layers, nitride layers, metal layers during manufacturing of semiconductor devices |
| 02/15/2005 | US6855266 Liquid carrier, oxidizing agent, carboxylic acid that increases the polishing rate, a polyethylenimine, and a polishing pad and/or an abrasive. |
| 02/15/2005 | US6855207 Apparatus and system for eliminating contaminants on a substrate surface |
| 02/15/2005 | US6855203 Preparation of 157nm transmitting barium fluoride crystals with permeable graphite |
| 02/15/2005 | US6855043 Carrier head with a modified flexible membrane |
| 02/15/2005 | US6855037 Method of sealing wafer backside for full-face electrochemical plating |
| 02/15/2005 | US6855035 Apparatus and method for producing substrate with electrical wire thereon |
| 02/15/2005 | US6855034 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer |
| 02/15/2005 | US6855030 Modular method for chemical mechanical planarization |
| 02/15/2005 | US6854980 Probe card |
| 02/15/2005 | US6854948 Stage with two substrate buffer station |
| 02/15/2005 | US6854671 Nozzle for ejecting molten metal |
| 02/15/2005 | US6854636 Structure and method for lead free solder electronic package interconnections |
| 02/15/2005 | US6854633 Flux includes a dielectric resin such as an epoxy resin, a silicone resin, natural or synthetic rubber that cures to form polymer support members; fluxing agent such as an organic acid for removing oxides from the contact pads |
| 02/15/2005 | US6854583 Conveyorized storage and transportation system |
| 02/15/2005 | US6854514 Temperature control apparatus and method with recirculated coolant |
| 02/15/2005 | US6854484 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve |
| 02/15/2005 | US6854473 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 02/15/2005 | US6854181 Folded-fin heat sink assembly and method of manufacturing same |
| 02/15/2005 | US6854179 Modification of circuit features that are interior to a packaged integrated circuit |
| 02/10/2005 | WO2005013379A2 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip |
| 02/10/2005 | WO2005013375A1 Semiconductor device and its manufacturing method |
| 02/10/2005 | WO2005013374A1 Semiconductor device and method for manufacturing semiconductor device |
| 02/10/2005 | WO2005013373A1 Eeprom with multi-member floating gate |
| 02/10/2005 | WO2005013372A2 Spin injection devices |
| 02/10/2005 | WO2005013371A2 Semiconductor device including band-engineered superlattice |
| 02/10/2005 | WO2005013368A1 Semiconductor device |
| 02/10/2005 | WO2005013363A2 Circuit arrangement placed on a substrate and method for producing the same |
| 02/10/2005 | WO2005013358A2 Arrangement of an electrical component placed on a substrate, and method for producing the same |
| 02/10/2005 | WO2005013357A1 Method of manufacturing multi-level contacts by sizing of contact sizes in integrated circuits |
| 02/10/2005 | WO2005013356A1 Semiconductor device having trench wiring and process for fabricating semiconductor device |
| 02/10/2005 | WO2005013355A1 Method of detaching a semiconductor layer |
| 02/10/2005 | WO2005013354A1 Work transfer means, image recognition device, and positioning method |
| 02/10/2005 | WO2005013353A2 Method for producing reduced-thickness electronic components |
| 02/10/2005 | WO2005013352A2 Method for the production of a semiconductor element with a plastic housing and support plate for carrying out said method |
| 02/10/2005 | WO2005013351A1 Method for recognizing work in die bonder and die bonder |
| 02/10/2005 | WO2005013350A1 Method of manufacturing a semiconductor device with a bipolar transistor and device with a bipolar transistor |
| 02/10/2005 | WO2005013349A2 Controlled growth of highly uniform, oxide layers, especially ultrathin layers |
| 02/10/2005 | WO2005013348A2 Formation of ultra-thin oxide and oxynitride layers by self-limiting interfacial oxidation |
| 02/10/2005 | WO2005013347A2 Precise patterning of high-k films |
| 02/10/2005 | WO2005013346A1 Method and apparatus for etching disk-like member |
| 02/10/2005 | WO2005013345A1 Substrate-treating apparatus |
| 02/10/2005 | WO2005013344A1 Method for slowing down dopand diffusion in semiconductor substrates and devices fabricated therefrom |
| 02/10/2005 | WO2005013343A1 Vapor deposition apparatus and vapor deposition method |
| 02/10/2005 | WO2005013342A1 Resist removing apparatus |
| 02/10/2005 | WO2005013340A1 Eddy current system for in-situ profile measurement |
| 02/10/2005 | WO2005013339A2 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 02/10/2005 | WO2005013338A2 Production of a structure comprising a protective layer against chemical treatment |
| 02/10/2005 | WO2005013335A2 Method of depositing patterned films of materials using a positive imaging process |
| 02/10/2005 | WO2005013334A2 Holder for supporting wafers during semiconductor manufacture |
| 02/10/2005 | WO2005013331A2 Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 02/10/2005 | WO2005013330A2 Crack stop for low k dielectrics |
| 02/10/2005 | WO2005013326A2 Epitaxial growth of relaxed silicon germanium layers |
| 02/10/2005 | WO2005013325A2 System for processing a treatment object |
| 02/10/2005 | WO2005013323A2 Methods and apparatus for fabricating solar cells |
| 02/10/2005 | WO2005013320A2 A semiconductor device having an organic anti-reflective coating (arc) and method therefor |
| 02/10/2005 | WO2005013319A2 Semiconductor device with strain relieving bump design |
| 02/10/2005 | WO2005013318A2 Method for obtaining a thin high-quality layer by co-implantation and thermal annealing |
| 02/10/2005 | WO2005013317A2 Stressed semiconductor-on-insulator structure resistant to high-temperature stress |
| 02/10/2005 | WO2005013316A2 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip |
| 02/10/2005 | WO2005013282A1 Wordline latching in semiconductor memories |
| 02/10/2005 | WO2005013281A2 Nonvolatile memory and method of making same |
| 02/10/2005 | WO2005013026A1 Device for feeding gas to chamber and method for controlling chamber inner pressure using the device |
| 02/10/2005 | WO2005013011A1 Material for thickening resist pattern, method for producing resist pattern using same, and method for manufacturing semiconductor device |
| 02/10/2005 | WO2005013005A1 Pattern drawing method and pattern drawing device |
| 02/10/2005 | WO2005013002A2 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing |
| 02/10/2005 | WO2005012600A1 Electrolytic processing apparatus and electrolytic processing method |
| 02/10/2005 | WO2005012451A2 Slurries and methods for chemical-mechanical planarization of copper |
| 02/10/2005 | WO2005012144A1 Work carrying equipment and die bonder using the equipment |
| 02/10/2005 | WO2005011927A1 Work transfer means |
| 02/10/2005 | WO2005011908A1 Method for producing connections in a micro electronics system |
| 02/10/2005 | WO2005006419A3 Substrate assembly for stressed systems |
| 02/10/2005 | WO2004114395A3 Dual damascene interconnect structures having different materials for line and via conductors |