Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/17/2005DE10334353A1 Verfahren zur Herstellung eines Kontaktes und elektronisches Bauelement, umfassend derartige Kontakte A process for preparing a contact and an electronic device comprising such contacts
02/17/2005DE10334124A1 Haftung von Strukturen aus schlecht haftenden Materialien Liability of structures from poorly adhering materials
02/17/2005DE10333439A1 Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes Process for the preparation of a multi-wiring planes hybrid product
02/17/2005DE10332877A1 Vorrichtung und Verfahren zur Rückseitenbearbeitung von Halbleiterbausteinen Apparatus and method for backworking of semiconductor devices
02/17/2005DE10332573A1 Verfahren zum Erzeugen von Lotkontakten auf Bauelementen und Bauelement bzw. Lotdepot-Trägerplatte mit Eignung zur Anwendung in diesem Verfahren A method for generating Lotkontakten on components and component or solder deposit base board with suitability for use in this process,
02/17/2005DE10332572A1 Fabrication installation for semiconductor wafers and components, includes measurement module for registering wafer surfaces
02/17/2005DE10332295A1 Method for removing metal traces/tracks from solid silicon e.g. for manufacture of integrated circuits, involves bringing arsenic-containing gaseous mixture into contact with silicon
02/17/2005DE10332294A1 Sensorchip, Optiksensor etc. nebst Verfahren zu seiner Herstellung sowie Erfassungseinrichtung Sensor chip, optical sensor, etc., together with processes for its preparation, and detecting means
02/17/2005DE10332163A1 Vacuum deposition installation for coating photovoltaic cells or flat screen displays comprises an input station and an output station arranged on a coupling chamber
02/17/2005DE10330795A1 Kohlenstoff-Hartmaske mit haftfähiger Schicht zur Haftung auf Metall Carbon hard mask with adherent film layer for adhesion on metal
02/17/2005DE10330456A1 Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer Apparatus for creating a surface structure on a wafer
02/17/2005DE10330430A1 Composite used e.g. in displays and in the production of optoelectronic components comprises an extremely thin substrate connected to a support substrate by a connecting material
02/17/2005DE10330359A1 Verfahren zur Herstellung von InP-basierten Heterostruktur-Bipolartransistoren auf der Grundlage von III/V-Halbleitern A process for the production of InP-based heterostructure bipolar transistors on the basis of III / V semiconductors
02/17/2005DE10329329A1 Kostengünstiges Hochfrequenz-Package Low-cost high-frequency Package
02/17/2005DE10329325A1 Structuring treatment of surface with edge, on which protection layer is deposited and then removed by etching together with edge
02/17/2005DE10306076B4 Quantenpunkt aus elektrisch leitendem Kohlenstoff, Verfahren zur Herstellung und Anwendung Quantum point of electrically conducting carbon, process for the preparation and application
02/17/2005DE10297664T5 Verfahren zur Anwendung von Streuungsmessungen mit statistisch relevanten Spektren zur Steuerung von Halbleiterfertigungsprozessen und Systeme, um dies zu erreichen A process for the application of scatter measurements with statistically relevant spectra for controlling semiconductor production processes and systems to reach this
02/17/2005DE102004035151A1 Spannungserhöhungsschaltung und -verfahren Voltage step-up circuit and method
02/17/2005DE102004034828A1 Eingangsschutzschaltkreis Input protection circuit
02/17/2005DE102004032468A1 Kleines, skalierbares Widerstandselement und Verfahren zu dessen Herstellung Small, scalable resistance element and process for its preparation
02/17/2005DE102004029355A1 Selbstausgerichtete Maske zum Verringern der Zellenlayoutfläche Self-Aligned mask to reduce the cell layout area
02/17/2005DE102004028716A1 Halbleitervorrichtung Semiconductor device
02/17/2005DE102004026534A1 Halbleiter-Montageeinrichtung Semi-conductor mounting means
02/17/2005DE102004025413A1 Verfahren zum Ausbilden eines Kondensators und Kondensator A method of forming a capacitor and capacitor
02/17/2005DE102004010688A1 Bearbeitungsgegenstands-Bearbeitungseinrichtung, Bearbeitungssgegenstands-Bearbeitungsverfahren, Drucksteuerverfahren, Bearbeitungsgegenstands-Transportverfahren, und Transporteinrichtung Processing the article processing device, Bearbeitungssgegenstands processing method, printing control method, article transport processing method, and transport means
02/17/2005DE102004003597A1 Nichtflüchtige Halbleiterspeichervorrichtung A non-volatile semiconductor memory device
02/17/2005DE102004003521B3 Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced
02/17/2005CA2521513A1 Method for producing single crystal ingot from which semiconductor wafer is sliced
02/16/2005EP1507442A2 Method of manufacturing electrical resistance heating element
02/16/2005EP1507297A2 Method for obtaining reversible resistance switches in a PCMO thin film deposited on a highly crystallized seed layer
02/16/2005EP1507295A2 Method for manufacturing solid-state imaging devices
02/16/2005EP1507294A2 Semiconductor device with surrounding gate
02/16/2005EP1507293A1 Method for forming quantum dot, quantum semiconductor device, and its manufacturing method
02/16/2005EP1507292A1 Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method
02/16/2005EP1507289A2 Diffusion barrier for copper lines in integrated circuits
02/16/2005EP1507288A2 High temperature annealing of spin coated Pr(1-x)Ca(x)MnO3 thin film for RRAM application
02/16/2005EP1507287A2 Method for implanting ions into semiconductor substrate
02/16/2005EP1507286A2 Formation process under a thin layer of a first material from portions of another material and/or from vacuum gaps
02/16/2005EP1507285A2 Capacitor of semiconductor device and memory device using the same
02/16/2005EP1507284A2 Apparatus and method for indexing and severing film
02/16/2005EP1507267A1 Wiring material and wiring board using the same
02/16/2005EP1507266A1 Semiconductor memory device with magnetoresistance elements and method of writing data into the same
02/16/2005EP1507222A1 System large scale integrated circuit (LSI) designing method
02/16/2005EP1507172A1 Lithographic apparatus and apparatus adjustment method
02/16/2005EP1507025A1 Device and method for forming thin-film, and method of manufacturing electronic component using the device
02/16/2005EP1506699A2 Method and device for generating an activated gas curtain for surface treatment
02/16/2005EP1506580A1 Floating gate memory cells with increased coupling ratio
02/16/2005EP1506579A2 Schottky barrier cmos device and method
02/16/2005EP1506578A2 Glass material for use at high frequencies
02/16/2005EP1506574A1 Method of manufacturing a semiconductor non-volatile memory
02/16/2005EP1506573A1 Ultra small thin windows in floating gate transistors defined by lost nitride spacers
02/16/2005EP1506572A1 Substrate processing apparatus and substrate processing method
02/16/2005EP1506571A2 Large substrate test system
02/16/2005EP1506570A1 Reduced cross-contamination between chambers in a semiconductor processing tool
02/16/2005EP1506569A1 Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method
02/16/2005EP1506563A1 Capacitively coupled plasma reactor with magnetic plasma control
02/16/2005EP1506503A2 Method and apparatus for optimizing distributed multiplexed bus interconnects
02/16/2005EP1506455A2 Method for the targeted deformation of an optical element
02/16/2005EP1506454A2 Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing
02/16/2005EP1506414A2 High peformance probe system for testing semiconductor wafers
02/16/2005EP1506329A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
02/16/2005EP1506206A1 Method of depositing copper on a support
02/16/2005EP1242223B1 Method for molding materials on a planar substrate
02/16/2005EP1082271A4 Wet processing methods for the manufacture of electronic components using liquids of varying temperature
02/16/2005EP0860027B1 Charge coupled device, and method of manufacturing such a device
02/16/2005CN1582520A Method for fabricating semiconductor light emitting element, semiconductor light emitting element, method for fabricating semiconductor element, semiconductor element, method for fabricating element a
02/16/2005CN1582505A Organic thin film transistor with siloxane polymer interface
02/16/2005CN1582500A Trench DMOS device with improved drain contact
02/16/2005CN1582499A High K dielectric film and method for making
02/16/2005CN1582498A Non-volatile memory, method of manufacture, and method of programming
02/16/2005CN1582495A Wirebond structure and method to connect to a microelectronic die
02/16/2005CN1582493A Double densed core gates in SONOS flash memory
02/16/2005CN1582492A Process for producing metal-containing thin films with a low electrical resistance
02/16/2005CN1582491A Method of forming reliable Cu interconnects
02/16/2005CN1582490A Method for planarization etch with in-situ monitoring by interferometry prior to recess etch
02/16/2005CN1582489A Substrate treating device and substrate treating method
02/16/2005CN1582486A Semiconductor device and method for fabricating same
02/16/2005CN1582481A Electrodes, method and apparatus for memory structure
02/16/2005CN1582480A Control device for reversing the direction of magnetisation without an external magnetic field
02/16/2005CN1582417A Agent for forming coating for narrowing pattern and method for forming fine pattern using the same
02/16/2005CN1582414A Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern
02/16/2005CN1582413A 有源矩阵像素器件 Active matrix pixel devices
02/16/2005CN1582398A Reconditioning integrated circuit for integrated circuit testing
02/16/2005CN1582395A Method and system for compensating thermally induced motion of probe cards
02/16/2005CN1582346A Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
02/16/2005CN1582345A Method of eliminating voids in W plugs
02/16/2005CN1582343A Physical vapor deposition target constructions, and methods of treating physical vapor deposition targets
02/16/2005CN1582256A 烧结的多晶氮化镓 Sintered polycrystalline gallium nitride
02/16/2005CN1582221A Substrate layer cutting device and method
02/16/2005CN1582202A Nozzle device and substrate treating apparatus having using the device
02/16/2005CN1582094A Figure-forming method and wire-layout figure forming method and photoelectronic device
02/16/2005CN1582093A Figure-forming method and wire-layout figure forming method, photoelectronic device and electronic apparatus
02/16/2005CN1582092A Method for forming wire-layout pattern and method for making semiconductor device and photoelectronic device
02/16/2005CN1581738A Dynamic ageing device and its control method
02/16/2005CN1581686A Conductive adhesive and piezoelectric device using it
02/16/2005CN1581651A Reacting force treating system of operation table device
02/16/2005CN1581585A Method for setting conduction terminal for electronic element and special equipment thereof
02/16/2005CN1581526A Semiconductor device and making method
02/16/2005CN1581525A Light-emitting semiconductor device and its manufacturing method
02/16/2005CN1581512A Control of carrier density of semimetal field effect tube channel material using ion beam modifying technique