Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2005
02/24/2005US20050040470 Fabrication of self-aligned bipolar transistor
02/24/2005US20050040469 Integrating N-type and P-type metal gate transistors
02/24/2005US20050040468 Semiconductor device and method for fabricating the same
02/24/2005US20050040467 Structure of nonvolatile memory array
02/24/2005US20050040466 Semiconductor integrated circuit device
02/24/2005US20050040465 CMOS device on ultrathin SOI with a deposited raised source/drain, and a method of manufacture
02/24/2005US20050040464 Soi type mosfet
02/24/2005US20050040463 Transistor structures and processes for forming same
02/24/2005US20050040462 Semiconductor device employing SOI substrate and method of manufacturing the same
02/24/2005US20050040461 Semiconductor device
02/24/2005US20050040460 Stress inducing spacers
02/24/2005US20050040459 Method and structure for improving the gate resistance of a closed cell trench power MOSFET
02/24/2005US20050040457 Layout of a flash memory having symmetric select transistors
02/24/2005US20050040456 Semiconductor memory element, production method and operational method
02/24/2005US20050040454 Ferroelectric thin film element and its manufacturing method, thin film capacitor and piezoelectric actuator using same
02/24/2005US20050040453 Magnetoresistive memory device assemblies
02/24/2005US20050040452 Method for fabricating semiconductor integrated circuit
02/24/2005US20050040451 Semiconductor memory device and method for fabricating the same
02/24/2005US20050040450 Selective polysilicon stud growth
02/24/2005US20050040449 Semiconductor device and method for manufacturing same
02/24/2005US20050040448 Semiconductor device including a capacitor having improved structural stability and enhanced capacitance, and method of manufacturing the semiconductor device
02/24/2005US20050040447 Magnetic memory device having a plurality of magneto-resistance effect elements arranged in a matrix form and method for manufacturing the same
02/24/2005US20050040444 Strained-channel fin field effect transistor (FET) with a uniform channel thickness and separate gates
02/24/2005US20050040440 Photo-electric converting device and its driving method, and its manufacturing method, solid-state image pickup device and its driving method and its manufacturing method
02/24/2005US20050040439 Semiconductor device and method of manufacturing the same
02/24/2005US20050040436 Semiconductor integrated circuit and fabrication method thereof
02/24/2005US20050040435 Semiconductor integrated circuit device and its manufacture using automatic layout
02/24/2005US20050040433 Magnetic memory with spin-polarized current writing, using amorphous ferromagnetic alloys, writing method for same
02/24/2005US20050040432 Light emitting device and method
02/24/2005US20050040429 Gaas substrate with sb buffering for high in devices
02/24/2005US20050040425 Light generating semiconductor device and method of making the same
02/24/2005US20050040423 Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
02/24/2005US20050040420 Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
02/24/2005US20050040418 Optical semiconductor device and method of fabricating the same
02/24/2005US20050040412 Semiconductor device and manufacturing method thereof
02/24/2005US20050040411 Ge photodetectors
02/24/2005US20050040407 Semiconductor light emitting device
02/24/2005US20050040403 Semiconductor device and method for manufacturing same
02/24/2005US20050040402 Method for manufacturing semiconductor device
02/24/2005US20050040401 Semiconductor device and fabrication method thereof
02/24/2005US20050040400 Semiconductor device and manufacturing method thereof
02/24/2005US20050040399 [thin film transistor array substrate and photolithography process and design of the mask thereof]
02/24/2005US20050040387 Semiconductor method and device
02/24/2005US20050040385 Non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices
02/24/2005US20050040349 Mapping apparatus and method of controlling the same
02/24/2005US20050040345 Filter window, lithographic projection apparatus, filter window manufacturing method, device manufacturing method and device manufactured thereby
02/24/2005US20050040344 Method for generating backscattering intensity on the basis of lower layer structure in charged particle beam exposure, and method for fabricating semiconductor device utilizing this method
02/24/2005US20050040343 Electron beam writing equipment and electron beam writing method
02/24/2005US20050040338 High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
02/24/2005US20050040331 Inspection method and inspection apparatus using electron beam
02/24/2005US20050040155 Unit for varying a temperature of a test piece and testing instrument incorporating same
02/24/2005US20050040148 Laser crystallizing device and method for crystallizing silicon by using the same
02/24/2005US20050040146 Crystallization apparatus, crystallization method, method of manufacturing thin film transistor, thin film transistor, and display apparatus
02/24/2005US20050040145 Plasma processing method and apparatus
02/24/2005US20050040140 Using a species analyzer that analyzes the slurry resulting from the planarization process to determine the presence of an end-point material implanted beneath the surface of a microelectronic substrate; including a mass spectrometer or a spectrum analyzer or detector of intensity of impinging radiation
02/24/2005US20050040139 For etching an aluminum surface in the presence of solder bumps, containing phosphoric acid, nitric acid, acetic acid, an amine oxide surfactant, a Pb solubilizing additive, and deionized water; solder bumps are phosphate-free after etching.
02/24/2005US20050040137 Low-aberration deflectors for use in charged-particle-beam optical systems, and methods for fabricating such deflectors
02/24/2005US20050040135 Forming an insulating film on a substrate material, forming a contact hole in the insulating film, and coating a region where a transparent conductive film is to be formed with a liquid containing a precursor of the transparent conductive film liquid coats any unnecessary insulating film formed, annealin
02/24/2005US20050040134 Trench isolation having a self-adjusting surface seal and method for producing one such trench isolation
02/24/2005US20050040049 Electrochemical depositing copper on a semiconductor wafer, chemical mechanical polishing of the conductive surface; deliverying solution to anode cavity, applying a potential
02/24/2005US20050040046 Electrochemical deposition system for depositing copper on a semiconductor substrate; transfer system is within same apparatus to prevent contamination of copper seeding layer
02/24/2005US20050040033 Method of metal sputtering for integrated circuit metal routing
02/24/2005US20050039948 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
02/24/2005US20050039945 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
02/24/2005US20050039885 Microchannel heat exchangers and methods of manufacturing the same
02/24/2005US20050039854 Plasma etching method and plasma etching unit
02/24/2005US20050039853 High throughput plasma treatment system
02/24/2005US20050039852 Wafer probe for measuring plasma and surface characteristics in plasma processing enviroments
02/24/2005US20050039840 Circuitized substrate and method of making same
02/24/2005US20050039815 Gas supply apparatus and gas supply method
02/24/2005US20050039794 Method and vessel for the delivery of precursor materials
02/24/2005US20050039783 Wafer transfer system of wet cleaning equipment
02/24/2005US20050039779 For substrates such as semiconductor wafers; shortened cleaning and drying time; atomize nozzle sprays the cleaning liquid and the gas to the holding grooves of the holding member in advance of the cleaning-liquid nozzle by operation of the moving mechanism
02/24/2005US20050039776 Chamber having a drying room over a cleaning room and connected via a separation plate having a center exhaust path; deionized water is drained from the cleaning room during a dry process, the drying room is decompressed, and a drying fluid flows from the drying room to the cleaning room along the path
02/24/2005US20050039773 Particle removal apparatus and method and plasma processing apparatus
02/24/2005US20050039685 Uniform gas cushion wafer support
02/24/2005US20050039683 Plasma processing method
02/24/2005US20050039681 Method and apparatus for depositing materials with tunable optical properties and etching characteristics
02/24/2005US20050039675 Spin coating apparatus and coated substrate manufactured using the same
02/24/2005US20050039674 Atomic layer deposition method
02/24/2005US20050039673 Manufacturing method for semiconductor device, semiconductor device and semiconductor wafer
02/24/2005US20050039671 Silicon single crystal wafer fabricating method and silicon single crystal wafer
02/24/2005US20050039670 Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
02/24/2005US20050039618 Stamp having an antisticking layer and a method of forming of repairing such a stamp
02/24/2005DE4037198B4 Epitaxialwafer und Verfahren zu dessen Herstellung Epitaxial wafer and process for its preparation
02/24/2005DE19837037B4 Retikel, Belichtungsverfahren, Belichtungsgerät und Halbleitervorrichtung Reticle, exposure methods, exposure apparatus and semiconductor device
02/24/2005DE10392336T5 Verfahren zur Herstellung von Siliciumdioxid-Titandioxid-Elementen für Extrem-Ultraviolett-Strahlung A process for preparing silica-titania elements for extreme ultraviolet radiation
02/24/2005DE10392335T5 Montagevorrichtung für elektronische Komponenten und Verfahren zur Montage elektronischer Komponenten Mounting device for electronic components and methods for mounting electronic components
02/24/2005DE10392228T5 Halbleiterplättchenpackung mit Halbleiterplättchen mit seitlichem elektrischen Anschluss Semiconductor die package with semiconductor wafer with a side electrical connection
02/24/2005DE10392226T5 Auslegung eines dicken Pufferbereichs zur Verbesserung der Energiedichte beim selbstsperrenden induktiven Schalten (SCIS) einer IGBT's und der Vorrichtungsherstellbarkeit Interpretation of a thick buffer area to improve the energy density at the self-locking inductive switching (SCIS) an IGBT and the Vorrichtungsherstellbarkeit
02/24/2005DE10349477A1 Semiconductor component especially for low voltage power components has chip with contact bumps surrounded by conductive adhesive and electrodes shorted to a metal contact layer
02/24/2005DE10334841A1 Production of trench capacitor, used for semiconductor memory cell, comprises providing trench in substrate using hard mask with corresponding mask openings, providing capacitor dielectric in trench, and further processing
02/24/2005DE10333841A1 Halbleiterbauteil in Halbleiterchipgröße mit flipchipartigen Außenkontakten und Verfahren zur Herstellung desselben Of the same semiconductor device in the semiconductor chip size flipchipartigen with external contacts and methods for preparing
02/24/2005DE10333557A1 Speicherzelle und Verfahren zur Herstellung einer Speichereinrichtung Memory cell and method for fabricating a memory device
02/24/2005DE10332725A1 Verfahren zur selbstjustierenden Verkleinerung von Strukturen Process for the reduction of self-aligned structures
02/24/2005DE10308926B4 Halbleiterchipanordnung und Verfahren zu ihrer Herstellung A semiconductor chip assembly and process for their preparation
02/24/2005DE10297639T5 Anordnung zur Kurzschluss-Vermeidung in einem Doppel-Polysilizium-Bipolartransistor und ein Verfahren zur Herstellung einer solchen Anordnung Arrangement for short-circuit prevention in a double polysilicon bipolar transistor and a method for producing such an arrangement
02/24/2005DE102004033357A1 Schaltung und Verfahren zur Temperatursensierung Circuit and method for Temperatursensierung
02/24/2005DE102004032910A1 Formation of trench type Schottky device, e.g. diode, by depositing layer of polysilicon into interior of trenches, oxidizing, filling trenches with layer of conductive polysilicon, and applying Schottky contact to top of substrate
02/24/2005DE102004032184A1 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -Vorrichtung Laser beam machining method and laser processing machine