| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/03/2005 | US20050045870 Strained silicon forming method with reduction of threading dislocation density |
| 03/03/2005 | US20050045868 Optical semiconductor device and method for fabricating the same |
| 03/03/2005 | US20050045867 Nanoscale heterojunctions and methods of making and using thereof |
| 03/03/2005 | US20050045865 [semiconductor device and fabricating method thereof] |
| 03/03/2005 | US20050045836 Dual-mode electron beam lithography machine |
| 03/03/2005 | US20050045829 Spectrum measuring apparatus and method |
| 03/03/2005 | US20050045822 Charged particle beam apparatus |
| 03/03/2005 | US20050045698 Solder-fill application for mounting semiconductor chip on PCB |
| 03/03/2005 | US20050045697 Wafer-level chip scale package |
| 03/03/2005 | US20050045619 Heating apparatus having electrostatic adsorption function |
| 03/03/2005 | US20050045618 Ceramic heater and ceramic joined article |
| 03/03/2005 | US20050045616 Substrate heating apparatus and multi-chamber substrate processing system |
| 03/03/2005 | US20050045604 Laser thermal processing with laser diode radiation |
| 03/03/2005 | US20050045593 Silicon parts having reduced metallic impurity concentration for plasma reaction chambers |
| 03/03/2005 | US20050045591 Patterning contactors on wafer; holes extending through mask; applying adhesive tape; puilling vacuum; polishing |
| 03/03/2005 | US20050045590 FRAM capacitor stack clean |
| 03/03/2005 | US20050045588 Dry etching method |
| 03/03/2005 | US20050045585 Method of electrochemically fabricating multilayer structures having improved interlayer adhesion |
| 03/03/2005 | US20050045488 Copper electrodeposition in microelectronics |
| 03/03/2005 | US20050045486 Plating method and plating solution |
| 03/03/2005 | US20050045485 Reducing or avoiding pitting; utilizing such as amine based polyalkylene oxide; reliable interconnect formation for ultra large scale integration microcircuits |
| 03/03/2005 | US20050045484 Forming multilayer three dimensional microstructures; improving seed layer application and/or removal |
| 03/03/2005 | US20050045379 Circuit board and method of manufacturing the same |
| 03/03/2005 | US20050045375 Reconfigurable logic through deposition of organic pathways |
| 03/03/2005 | US20050045276 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
| 03/03/2005 | US20050045275 Plasma treatment apparatus and surface treatment apparatus of substrate |
| 03/03/2005 | US20050045274 Sample separating apparatus and method, and substrate manufacturing method |
| 03/03/2005 | US20050045262 Attaching a pellicle frame to a reticle |
| 03/03/2005 | US20050045223 Fabricating thin films for solid state storage devices without annealing; low cost, efficient energy conversion |
| 03/03/2005 | US20050045214 Automated semiconductor processing systems |
| 03/03/2005 | US20050045209 Customizing and optimizing for individual conditions; reducing subsurface damage |
| 03/03/2005 | US20050045208 Apparatus and method for cleaning semiconductor substrates |
| 03/03/2005 | US20050045207 Miniaturization, simplification;suppresses particle formation; easy, rapid compounding of accurate solution concentration; cleaning semiconductor wafers |
| 03/03/2005 | US20050045206 Post-etch clean process for porous low dielectric constant materials |
| 03/03/2005 | US20050045202 Method for wafer surface cleaning using hydroxyl radicals in deionized water |
| 03/03/2005 | US20050045106 Electrostatic chuck having a low level of particle generation and method of fabricating same |
| 03/03/2005 | US20050045105 Holder for multiple substrates and chamber with the same |
| 03/03/2005 | US20050045104 Plasma processing apparatus |
| 03/03/2005 | US20050045101 Thin-film deposition system |
| 03/03/2005 | US20050045096 Liquid droplet ejecting apparatus, electro-optical device, method of manufacturing the electro-optical device, and electronic apparatus |
| 03/03/2005 | US20050045092 Method of multi-element compound deposition by atomic layer deposition for IC barrier layer applications |
| 03/03/2005 | US20050045091 Molecular beam epitaxy growth apparatus and method of controlling same |
| 03/03/2005 | US20050045090 Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor device |
| 03/03/2005 | US20050045009 Processing apparatus provided with backpressure sensor |
| 03/03/2005 | US20050044957 System and method for characterizing a textured surface |
| 03/03/2005 | US20050044955 Methods for distributed electrode injection and systems thereof |
| 03/03/2005 | US20050044803 Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal |
| 03/03/2005 | US20050044801 For enhanced wettability/dispersability/bonding; comprises metal oxide layer; chemical mechanical polishing (CMP) |
| 03/03/2005 | US20050044653 Cleaning apparatus and cleaning method |
| 03/03/2005 | DE4319233B4 Epitaxialwafer aus Galliumaresenidphosphid Epitaxial wafer from Galliumaresenidphosphid |
| 03/03/2005 | DE19842419B4 Verfahren zum Bilden eines Halbleiterelements A method of forming a semiconductor element |
| 03/03/2005 | DE19723432B4 Halbleiterspeicher-Bauelement mit Bänken A semiconductor memory device with benches |
| 03/03/2005 | DE19654301B4 Verfahren zur Herstellung eines Substrates mit Silizium auf einem Isolator A process for producing a substrate with silicon on insulator |
| 03/03/2005 | DE19653493B4 Verfahren zur Ausbildung einer integrierten Schaltungseinrichtung mit Titansilicidschicht, integrierte Schaltungseinrichtung mit Titansilicidschicht und Vorrichtung zur Erzeugung derselben A method of forming an integrated circuit device having titanium silicide, titanium silicide layer with integrated circuit device and device for producing same |
| 03/03/2005 | DE19645568B4 Herstellungsverfahren für ein Halbleiterbauelement Manufacturing method of a semiconductor device |
| 03/03/2005 | DE19600427B4 Verfahren zum Ausrichten und Markieren eines Wafers A method for aligning and marking a wafer |
| 03/03/2005 | DE19541496B4 Verfahren zur Herstellung der Gateelektrode einer CMOS-Einrichtung Process for the preparation of the gate electrode of a CMOS device |
| 03/03/2005 | DE19517344B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 03/03/2005 | DE10358939A1 Verfahren zum Herstellen einer MTJ-Zelle eines magnetischen Direktzugriffsspeichers A method for producing an MTJ cell of a magnetic random access memory |
| 03/03/2005 | DE10336328A1 Device for processing a silicon substrate comprises evacuating stations, a silicon deep etching chamber, a plasma chamber and a chlorine trifluoride etching chamber |
| 03/03/2005 | DE10335816A1 Method for adjusting substrate, e.g. semiconductor wafer, prior to projection in exposure appliance, using two planes on test substrate for two subsequently exposed planes |
| 03/03/2005 | DE10335461A1 Production of silicon nitride mask on silicon-containing layer on semiconductor substrate for producing integrated semiconductor circuits comprises forming pad oxide layer on silicon-containing layer, and further processing |
| 03/03/2005 | DE10335336A1 Field effect especially organic component for integrated circuits has planar multiplayer with two coplanar electrodes and an additional electrode capacitively coupled to one electrode |
| 03/03/2005 | DE10335155A1 Anordnung eines elektrischen Bauelements auf einem Substrat und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component on a substrate and methods of making the arrangement |
| 03/03/2005 | DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate |
| 03/03/2005 | DE10335100A1 Technik zur Herstellung verkürzter Seitenabstandselemente für eine Polysiliziumleitung Technique for producing short side spacers for a polysilicon line |
| 03/03/2005 | DE10335099A1 Verfahren zum Verbessern der Dickengleichförmigkeit von Siliziumnitridschichten für mehrere Halbleiterscheiben A method for improving the thickness uniformity of silicon nitride layers for multiple semiconductor wafers |
| 03/03/2005 | DE10335081A1 Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoeleketronischer Halbleiterchip A process for the production of a variety of optoelectronic semiconductor chips and semiconductor chip optoeleketronischer |
| 03/03/2005 | DE10335080A1 Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A process for the production of a variety of optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| 03/03/2005 | DE10335078A1 Process for the form shaping covering of a lead frame with a housing in a tool uses a sealing material in the region of a separation plane |
| 03/03/2005 | DE10335063A1 Automatic process for locking semiconductor bars onto a saw base determines dimensions suitable holder and orientation of the bar and brings up holder to grasp the bar |
| 03/03/2005 | DE10334940A1 Support device for holding semiconductor wafers during coating process comprises adhesion promoting layer on its surface to provide relatively good bonding to material of support device |
| 03/03/2005 | DE10334576A1 Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse und Trägerplatte zur Durchführung des Verfahrens A method of manufacturing a semiconductor device with a plastic housing and carrier plate for carrying out the method |
| 03/03/2005 | DE10334391A1 Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik A process for the production of compounds in microelectronics |
| 03/03/2005 | DE10334113A1 Arrangement of vertical memory cells for DRAMs in a semiconductor substrate has conductive connection to inner electrode of memory cell in trench through trench surroundings |
| 03/03/2005 | DE10333777A1 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell |
| 03/03/2005 | DE10333776A1 Verfahren zur Herstellung einer Gate-Struktur eines FETs A process for producing a gate structure of an FET |
| 03/03/2005 | DE10332921A1 Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas |
| 03/03/2005 | DE10332017A1 Elektronisches Bauteil und Flachleiterrahmen zur Herstellung des Bauteils Electronic component and leadframe for producing the component |
| 03/03/2005 | DE10331030B3 Herstellungsverfahren für einen Grabenkondensator Manufacturing method of a capacitor grave |
| 03/03/2005 | DE10204157B4 Drahtbondverbindung für Leistungshalbleiterbauelemente Wire bonding for power semiconductor components |
| 03/03/2005 | DE102004038874A1 Fabrication of self-aligned 1 bit silicon oxide nitride oxide silicon memory cell, by etching portions of upper oxide layer and nitride layer of oxygen-nitride-oxide layer on insulating layer pattern, using self-aligned etching spacers |
| 03/03/2005 | DE102004037085A1 Drahtlose Halbleiterpackung und Herstellungsverfahren zum fertigen einer solchen drahtlosen Halbleiterpackung Wireless semiconductor package and fabrication method of fabricating a semiconductor package such wireless |
| 03/03/2005 | DE102004036747A1 Fabrication of semiconductor device by forming passivation layer on circuit element, patterning passivation layer, forming photosensitive layer and photoresist layer, and removing photoresist layer and exposed region of photosensitive layer |
| 03/03/2005 | DE102004036435A1 Holding device for disc-shaped objects e.g. semiconductor wafers, has pivotable gripper fingers which are pretensioned by support elements in holding position and actuated by vacuum powered opening mechanism |
| 03/03/2005 | DE102004036295A1 Fabrication of flip-chip light emitting diode device by fabricating light emitting diode devices on epitaxial wafer, dicing the epitaxial wafer, flip chip bonding the device die to mount, and reducing thickness of growth substrate |
| 03/03/2005 | DE102004035788A1 Isolierschicht-Bipolar-Transistor mit eingebauter Freilaufdiode Insulated gate bipolar transistor with a built-in freewheeling diode |
| 03/03/2005 | DE102004034822A1 MRAM und Verfahren zu dessen Herstellung MRAM and methods for its preparation |
| 03/03/2005 | DE102004034820A1 Verfahren zum Herstellen isolierender Attrappen-Füllstrukturen A method for producing insulating dummy dummy |
| 03/03/2005 | DE102004032524A1 Elektronenstrahl-Lithographievorrichtung mit zwei Betriebsarten Electron beam lithography apparatus having two operating modes |
| 03/03/2005 | DE102004031424A1 Mikrochemischer Chip und Verfahren zu dessen Herstellung Microchemical chip and process for its preparation |
| 03/03/2005 | DE102004028709A1 Vertikaldoppelkanal-Silicon-on-Insulator-Transistor und Verfahren zu seiner Herstellung Vertical double-channel silicon-on-insulator transistor and method for its preparation |
| 03/03/2005 | DE102004024924A1 Verfahren zum Herstellen polykristallinen Siliciums sowie Schaltbauteil unter Verwendung polykristallinen Siliciums A method for producing polycrystalline silicon as well as switching device using polycrystalline silicon |
| 03/03/2005 | DE102004024603A1 Verfahren zum Herstellen einer Halbleitereinrichtung mit Oxidfilmschichten verschiedener Stärken A method of manufacturing a semiconductor device with different oxide film thicknesses |
| 03/03/2005 | DE10063443B4 Verfahren zur Herstellung einer Elektrode eines mittels Feldeffekt steuerbaren Halbleiterbauelements und mittels Feldeffekt steuerbares Halbleiterbauelement A method for producing an electrode by means of a controllable field-effect semiconductor device and controllable by means of field-effect semiconductor device |
| 03/03/2005 | DE10044199B4 Ablenkanordnung und Projektionssystem für geladene Teilchen Deflection device and projection system for charged particles |
| 03/03/2005 | DE10037248B4 Verfahren zur Bildung eines Source/Drain-Gebiets eines Transistors und Verfahren zum Herstellen eines elektronischen Bauteils mit komplementären Transistoren A method of forming a source / drain region of a transistor and method for producing an electronic component with complementary transistors |
| 03/03/2005 | CA2556957A1 Enhanced parimutuel wagering |
| 03/03/2005 | CA2536159A1 Stripping and cleaning compositions for microelectronics |
| 03/03/2005 | CA2535723A1 Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |