| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/07/2005 | US20050145837 Enhancement of electron and hole mobilities in <110> Si under biaxial compressive strain |
| 07/07/2005 | US20050145836 Influence of surface geometry |
| 07/07/2005 | US20050145835 Emitter for electron-beam projection lithography system and manufacturing method thereof |
| 07/07/2005 | US20050145834 Methods of forming switchable circuit devices |
| 07/07/2005 | US20050145805 Lithographic apparatus and device manufacturing method |
| 07/07/2005 | US20050145803 Moving lens for immersion optical lithography |
| 07/07/2005 | US20050145793 Electron microscope |
| 07/07/2005 | US20050145614 Rapid temperature compensation module for semiconductor tool |
| 07/07/2005 | US20050145602 Test patterns and methods of controlling CMP process using the same |
| 07/07/2005 | US20050145601 Structure having a substrate, patterned metal layer and a catalyst island formed on the metal layer, surface of the substrate upon which the metal layer is formed may be oxidized, to support the successful growth of nanotubes on a resulting structure for a reliable electrical connection to the nanotubes |
| 07/07/2005 | US20050145584 Wafer boat with interference fit wafer supports |
| 07/07/2005 | US20050145507 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent |
| 07/07/2005 | US20050145500 Plating apparatus, plating method, and manufacturing method of semiconductor device |
| 07/07/2005 | US20050145489 Electroetching process and system |
| 07/07/2005 | US20050145484 Apparatus for avoiding particle accumulation in electrochemical processing |
| 07/07/2005 | US20050145482 Apparatus and method for processing substrate |
| 07/07/2005 | US20050145477 Device for targeted application of deposition material to a substrate |
| 07/07/2005 | US20050145464 Stabilizing substrate carriers during overhead transport |
| 07/07/2005 | US20050145341 Plasma processing apparatus |
| 07/07/2005 | US20050145339 Ecr plasma source and ecr plasma device |
| 07/07/2005 | US20050145338 Shower head of a wafer treatment apparatus having a gap controller |
| 07/07/2005 | US20050145336 Plasma processor electrode and plasma processor |
| 07/07/2005 | US20050145335 Installation for the vacuum treatment in particular of substrates |
| 07/07/2005 | US20050145334 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters |
| 07/07/2005 | US20050145333 Processing device and processing method |
| 07/07/2005 | US20050145328 Die molding for flip chip molded matrix array package using UV curable tape |
| 07/07/2005 | US20050145285 Fluid handling component with ultraphobic surfaces |
| 07/07/2005 | US20050145271 Megasonic cleaning vessel using supercritical CO2 |
| 07/07/2005 | US20050145268 Substrate meniscus interface and methods for operation |
| 07/07/2005 | US20050145267 Apply fluid meniscus to the surface of a substrate; reduce evaporation of fluids from a surface by control of process environment |
| 07/07/2005 | US20050145265 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 07/07/2005 | US20050145264 Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display |
| 07/07/2005 | US20050145263 Curved edges connecting center to expertior; cutting printing paper; thermal printing |
| 07/07/2005 | US20050145181 Method and apparatus for high speed atomic layer deposition |
| 07/07/2005 | US20050145180 Non-contact cool-down station for wafers |
| 07/07/2005 | US20050145178 Microwave-excited plasma processing apparatus |
| 07/07/2005 | US20050145171 Processing method utilizing an apparatus to be sealed against workpiece |
| 07/07/2005 | US20050145170 Substrate processing apparatus and cleaning method therefor |
| 07/07/2005 | US20050145168 Substrate treatment apparatus |
| 07/07/2005 | US20050145166 Jet singulation |
| 07/07/2005 | US20050145163 Composition for forming silicon film and method for forming silicon film |
| 07/07/2005 | US20050145012 Two pipes connected by a joint portion, allows a process fluid to flow, and a cover to enclose the joint; an enclosed cavity with inlet port to supply a gas to the cavity, an outlet port to exhaust the gas and contaminants from the cavity; analyzer, monitor, and alarm |
| 07/07/2005 | US20050144915 [pipe trap] |
| 07/07/2005 | US20050144782 Method of fabricating printhead IC using CTE matched wafer and sacrificial materials |
| 07/07/2005 | US20050144767 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 07/07/2005 | DE4425943B4 Verfahren zur Herstellung eines mehrschichtigen Leiter- bzw. Anschlusselements und Leiter- bzw. Anschlusselement A method for producing a multilayer printed circuit or of the connecting element and conductor terminal element, or |
| 07/07/2005 | DE202005002728U1 Positioning device for chuck of substrate tester has transfer element with inner and outer parts opposite each other on closed tester housing wall with magnetic force connection between the parts |
| 07/07/2005 | DE19957540B4 Verfahren zum Herstellen eines Feldeffekttransistors mit Anti-Punch-Through-Implantationsgebiet A method of manufacturing a field effect transistor with non-punch-through implant region |
| 07/07/2005 | DE19912220B4 Halbleiterspeicherbauelement und Verfahren zu dessen Herstellung The semiconductor memory device and method for its production |
| 07/07/2005 | DE19906805B4 Vorrichtung und Verfahren zum Transportieren von zu bearbeitenden Substraten Apparatus and method for transporting substrates to be processed |
| 07/07/2005 | DE19860701B4 Integrierte Schaltungsanordnung und Verfahren zur Herstellung einer solchen An integrated circuit assembly and method for producing such |
| 07/07/2005 | DE19853433B4 Herstellungsverfahren einer Halbleitervorrichtung Manufacturing method of a semiconductor device |
| 07/07/2005 | DE19727261B4 Verfahren zum Herstellen einer Phasenschiebemaske A method of manufacturing a phase shifting mask |
| 07/07/2005 | DE19718870B4 Prüfgerät für ungekapselte Halbleiterchips Tester for unencapsulated semiconductor chips |
| 07/07/2005 | DE19700650B4 Metallleitungsstruktur und Verfahren zu deren Herstellung Metal line structure and process for their preparation |
| 07/07/2005 | DE19640443B4 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method |
| 07/07/2005 | DE19640003B4 Halbleitervorrichtung und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 07/07/2005 | DE19639899B4 Verfahren zur Herstellung einer Speicheranordnung A method for fabricating a memory array |
| 07/07/2005 | DE10392892T5 Reflektierender Maskenrohling Reflective mask blank |
| 07/07/2005 | DE10392705T5 Verfahren zur Musterprüfung Method for pattern inspection |
| 07/07/2005 | DE10361521A1 Method of alternate contacting of two wafers especially a semiconductor and a functional component wafer uses selected laser wavelength to fuse contact metallization only |
| 07/07/2005 | DE10358691A1 Sockel- bzw. Adapter-Einrichtung, sowie Vorrichtung und Verfahren zum Beladen einer Sockel- bzw. Adapter-Einrichtung mit einem entsprechenden Halbleiter-Bauelement Socket or adapter device, and apparatus and method for loading a socket or adapter device with a corresponding semiconductor device |
| 07/07/2005 | DE10358682A1 Carrier for holding electronic components mounted on support substrates, e.g. for component testing or for final assembly, with mask releasably fitted on deposition surface of carrier |
| 07/07/2005 | DE10358046A1 Bipolartransistor mit erhöhtem Basisanschlussgebiet und Verfahren zu seiner Herstellung Bipolar transistor with increased base connection region and method for its manufacture |
| 07/07/2005 | DE10357822A1 Schneidvorrichtung Cutter |
| 07/07/2005 | DE10356885A1 Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement A method for housings of components and a housed component |
| 07/07/2005 | DE10356519A1 Process to determine a geometric shape on a semiconductor layer surface irradiates with radiation to which the layer is transparent and analyses transmitted or reflected image |
| 07/07/2005 | DE10356153A1 Modul für kontaktlose Chipkarten oder Identifizierungssysteme Module for contactless chip cards or identification systems |
| 07/07/2005 | DE10356035A1 Reflection or transmission photomask for projection onto semiconductor substrate, e.g. wafer, in integrated circuit production, has substrate with opaque or semitransparent layer(s) covered by passivating layer with unpolar surface |
| 07/07/2005 | DE10355953A1 Verfahren zum Galvanisieren und Kontaktvorsprungsanordnung Method of electroplating and contact projection arrangement |
| 07/07/2005 | DE10355587A1 Manufacturing method for vertical semiconductor power transistor, whose source-body zones in substrate zones are formed by ion implantation with following rapid thermal annealing (RTA) |
| 07/07/2005 | DE10355586A1 Improved chip-on-chip structure includes intervening layers of bonding agent with two photoimide layers |
| 07/07/2005 | DE10355573A1 Verfahren und System zum Erhöhen der Produktionsausbeute durch Steuern der Lithographie auf der Grundlage elektrischer Geschwindigkeitsdaten A method and system for increasing the production yield by controlling the lithography on the basis of electrical speed data |
| 07/07/2005 | DE10355572A1 Reduction of edge roughness in dry etched semiconductors in order to carry nanostructures includes coating the surface with a deposited dielectric, followed by isotropically etching |
| 07/07/2005 | DE10355508A1 Ultradünne Halbleiterschaltung mit Kontakt-Bumps sowie zugehöriges Herstellungsverfahren Ultra-thin semiconductor circuit with contact bumps and manufacturing method thereof |
| 07/07/2005 | DE10297731T5 Umkehrprägetechnik Reverse embossing technology |
| 07/07/2005 | DE10297676T5 Verfahren und Struktur zum Kalibrieren einer Messanlage auf Streumessungsbasis, die zum Messen von Abmessungen von Strukturelementen auf einem Halbleiterbauelement verwendet wird A method and structure for calibrating a measuring system based on scatter measurement, which is used for measurement of dimensions of structural elements on a semiconductor component |
| 07/07/2005 | DE102004059034A1 Ein Verfahren zum Herstellen einer Hartmaske in einem Kondensatorbauelement und eine Hartmaske zur Verwendung in einem Kondensatorbauelement A process for producing a hard mask in a capacitor device and a hard mask for use in a capacitor device |
| 07/07/2005 | DE102004058603A1 Electrically erasable and programmable read only memory cell, has common source region with lightly doped drain structure whose impurity region has higher dopant concentration than region of double diffused drain structure |
| 07/07/2005 | DE102004056350A1 Capacitor, for e.g. dynamic random access memory, includes storage electrode having storage conductive pattern and complementary member, dielectric layer and plate electrode |
| 07/07/2005 | DE102004051180A1 Waferteilungsverfahren Wafer dividing method |
| 07/07/2005 | DE102004049249A1 Wafer-level electronic module, has monolithic substrate with redistribution structure for providing connector contact coupled to integrated circuit dice, where structure provides electronic device coupled to circuit dice |
| 07/07/2005 | DE102004042783A1 Halbleitervorrichtung und Herstellungsverfahren von dieser A semiconductor device and manufacturing method of this |
| 07/07/2005 | DE102004040484A1 Auswählen eines Schreibstroms einer magnetischen Speicherzelle Selecting a write current to a magnetic memory cell |
| 07/07/2005 | DE102004037834A1 Speichervorrichtung Memory device |
| 07/07/2005 | DE102004031517A1 Verfahren zur Herstellung eines Flash-Speicherbauelements A method for producing a flash memory device |
| 07/07/2005 | DE102004030920A1 Formation of trench for isolation film in semiconductor device comprises forming etching mask on semiconductor substrate, etching semiconductor substrate to form trench, performing first cleaning, and performing sidewall oxidation process |
| 07/07/2005 | DE102004015929A1 Electronic component, typically memory module, containing semiconductor element on main face of circuit board, and heat convecting element extending along entire semiconductor element and thermally coupled to circuit board |
| 07/07/2005 | DE102004007060B3 Semiconductor wafer bonding device using application of adhesive before alignment and contacting of corresponding surfaces of semiconductor wafers |
| 07/07/2005 | DE102004004476B3 Resin cover application to a system wafer, comprises applying a cover to a carrier via a connection layer, and then mechanically removing the carrier and connection layer |
| 07/07/2005 | DE10053885B4 Verfahren zur Erzeugung von Maskendaten für die Einzelaufnahme-Teilbelichtung sowie zugehöriges Belichtungsverfahren A method for generating mask data for the individual female part as well as associated exposure exposure method |
| 07/07/2005 | CA2551542A1 Laminate |
| 07/07/2005 | CA2550882A1 Capacitor |
| 07/07/2005 | CA2546632A1 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 07/06/2005 | EP1551059A2 Semiconductor device with modified mobility and thin film transistor having the same |
| 07/06/2005 | EP1551058A1 Annealed wafer and annealed wafer manufacturing method |
| 07/06/2005 | EP1551057A1 Composition for forming silicon film and method for forming silicon film |
| 07/06/2005 | EP1551056A2 Nitride semiconductor thin film having fewer defects and method of growing the same |
| 07/06/2005 | EP1551055A1 Method for manufacturing semiconductor device |
| 07/06/2005 | EP1551041A1 Thin film capacitors on ceramic substrate |