Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2005
07/07/2005WO2005062370A1 A method of making a microelectronic assembly
07/07/2005WO2005062369A1 Combinations of resin compositions and methods of use thereof
07/07/2005WO2005062368A1 Semiconductor device and method of manufacturing thereof
07/07/2005WO2005062367A1 I/o sites for probe test and wire bond
07/07/2005WO2005062366A1 Method for improving transistor performance through reducing the salicide interface resistance
07/07/2005WO2005062364A1 Contoured insulator layer of silicon-on-onsulator wafers and process of manufacture
07/07/2005WO2005062363A1 Method of etching a semiconductor device
07/07/2005WO2005062362A1 Plasma processing apparatus
07/07/2005WO2005062361A1 Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source
07/07/2005WO2005062360A1 Electrostatic chuck and chuck base having cooling path for cooling wafer
07/07/2005WO2005062359A1 Method and apparatus for seasoning semiconductor apparatus of sensing plasma equipment
07/07/2005WO2005062358A1 Method and device for drying circuit substrates
07/07/2005WO2005062357A1 Strained semiconductor substrate and processes therefor
07/07/2005WO2005062356A1 Device and method of manufacturing the same
07/07/2005WO2005062355A1 Capacitor
07/07/2005WO2005062354A1 A semiconductor substrate with solid phase epitaxial regrowth with reduced junction leakage and method of producing same
07/07/2005WO2005062353A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
07/07/2005WO2005062352A1 A semiconductor substrate with solid phase epitaxial regrowth with reduced junction leakage and method of producing same
07/07/2005WO2005062351A1 Exposure apparatus and device manufacturing method
07/07/2005WO2005062350A1 Light flux conversion element, exposure system, lighting optical system and exposure method
07/07/2005WO2005062349A1 Containing capacitors and method of forming
07/07/2005WO2005062348A1 Method for producing a semiconductor product
07/07/2005WO2005062346A1 Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling
07/07/2005WO2005062345A2 A method of forming a silicon oxynitride layer
07/07/2005WO2005062344A1 Method of operating a system for chemical oxide removal
07/07/2005WO2005062336A2 Processing system with protective barrier and method for impregnating
07/07/2005WO2005062310A1 Flash memory device
07/07/2005WO2005062103A1 Optical system with a cameras device for viewing several objects arranged remotely from each other
07/07/2005WO2005062101A1 Projection optical system and exposure apparatus with the same
07/07/2005WO2005062079A2 Generating multiple bandgaps using multiple epitaxial layers
07/07/2005WO2005061762A1 Nano-array electrode manufacturing method and photoelectric converter using same
07/07/2005WO2005061758A1 Transfer system
07/07/2005WO2005061752A2 Method for patterning films
07/07/2005WO2005061587A1 Adamantyl monomers and polymers for low-k-dielectric applications
07/07/2005WO2005061575A1 Encapsulant mixture having a polymer bound catalyst
07/07/2005WO2005061378A2 Equipment and process for creating a custom sloped etch in a substrate
07/07/2005WO2005061377A1 Method for manufacturing a nanostructure
07/07/2005WO2005061375A1 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
07/07/2005WO2005061374A1 Microcomponent comprising a hermetic microcavity and method for production of such a microcomponent
07/07/2005WO2005061227A1 Multilayer body
07/07/2005WO2005061178A1 Chemical mechanical polishing method for reducing slurry reflux
07/07/2005WO2005061177A1 Pad assembly for electrochemical mechanical processing
07/07/2005WO2005061131A1 Water-based cleaning
07/07/2005WO2005060723A2 Wafer bonded epitaxial templates for silicon heterostructures
07/07/2005WO2005060676A2 A method for manufacturing a superjunction device with wide mesas
07/07/2005WO2005060671A2 Polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silsesquioxanes as coatings, composites and additives
07/07/2005WO2005060548A2 Method of preventing damage to porous low-k materials during resist stripping
07/07/2005WO2005060464A2 Method and apparatus for forming an soi body-contacted transistor
07/07/2005WO2005060450A2 Land grid array packaged device and method of forming same
07/07/2005WO2005053893A3 Laser thin film poly-silicon annealing optical system
07/07/2005WO2005052990A3 Semiconductor device with magneticaly permeable heat sink
07/07/2005WO2005048268A3 Nrom flash memory with self-aligned structural charge separation
07/07/2005WO2005038085A3 Selective self-initiating electroless capping of copper with cobalt-containing alloys
07/07/2005WO2005036613A3 Ultra high-speed si/sige modulation-doped field effect transistors on ultra thin soi/sgoi substrate
07/07/2005WO2005029583A3 Schottky barrier integrated circuit
07/07/2005WO2005024897A3 Systems and methods having a metal-semiconductor-metal (msm) photodetector with buried oxide layer
07/07/2005WO2005021828A3 Copper-containing pvd targets and methods for their manufacture
07/07/2005WO2005015611A3 Device for stabilising thin discs
07/07/2005WO2005015189A3 X-ray fluorescence system with apertured sample mask for analyzing patterned surfaces
07/07/2005WO2005013352A3 Method for the production of a semiconductor element with a plastic housing and support plate for carrying out said method
07/07/2005WO2005010950A3 Ultrasonic assisted etch using corrosive liquids
07/07/2005WO2005006556A3 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit
07/07/2005WO2005005088A3 Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps
07/07/2005WO2004114368A3 METHOD FOR PREPARING GE1-x-ySnxEy (E=P, As, Sb) SEMICONDUCTORS AND RELATED Si-Ge-Sn-E AND Si-Ge-E ANALOGS
07/07/2005WO2004111727A3 Methods of removing photoresist from substrates
07/07/2005WO2004111319A3 Sacrificial template method of fabricating a nanotube
07/07/2005WO2004097836A3 Mirror image memory cell transistor pairs featuring poly floating spacers
07/07/2005WO2004075309A3 Reflective ohmic contact for silicon carbide, light emitting diode in including the same, and manufacturing method
07/07/2005WO2004061924A8 Method of producing thin films of compound i-iii-vi, promoting the incorporation of iii elements in the film
07/07/2005WO2004042797A3 Sacrificial compositions, methods of use thereof, and methods of decomposition thereof
07/07/2005WO2004038764A8 Semiconductor device with quantum well and etch stop
07/07/2005WO2003057943A3 Electroless plating system
07/07/2005WO2002099849A3 Apparatus for microdeposition of multiple fluid materials
07/07/2005WO2000009976A9 Tuning a substrate temperature measurement system
07/07/2005US20050149902 Eigen decomposition based OPC model
07/07/2005US20050149900 Feature optimization using enhanced interference mapping lithography
07/07/2005US20050149895 Delay library generation method and delay library generation device
07/07/2005US20050149894 Design method for semiconductor integrated circuit suppressing power supply noise
07/07/2005US20050149886 Methods for adaptive real time control of a thermal processing system
07/07/2005US20050149798 Semiconductor integrated circuit
07/07/2005US20050149477 Workstation and method for transforming information
07/07/2005US20050149222 Thermal processing apparatus and thermal processing method
07/07/2005US20050149217 Semiconductor manufacturing system, work manufacturing system, and conveyance system
07/07/2005US20050148695 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders
07/07/2005US20050148455 High purity silicon carbide articles and methods
07/07/2005US20050148292 Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
07/07/2005US20050148290 Chemical-mechanical polishing of metals in an oxidized form
07/07/2005US20050148237 Electronic circuit device
07/07/2005US20050148211 Device manufacturing method and a lithographic apparatus
07/07/2005US20050148210 Lithographic projection apparatus, reflector assembly for use therein, and device manufacturing method
07/07/2005US20050148209 Method for preventing metalorganic precursor penetration into porous dielectrics
07/07/2005US20050148208 Method and apparatus for forming polycrystalline layer using laser crystallization
07/07/2005US20050148207 Method of forming a semi-insulating region
07/07/2005US20050148203 Method, apparatus, system and computer-readable medium for in situ photoresist thickness characterization
07/07/2005US20050148202 Method for sealing porous materials during chip production and compounds therefor
07/07/2005US20050148201 Method for forming a low-k dielectric layer for a semiconductor device
07/07/2005US20050148200 Film forming apparatus, substrate for forming oxide thin film and production method thereof
07/07/2005US20050148199 Apparatus for atomic layer deposition
07/07/2005US20050148198 Texturing a semiconductor material using negative potential dissolution (NPD)
07/07/2005US20050148197 Substrate proximity processing structures and methods for using and making the same
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