Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/18/2005US20050179065 ISFET using PbTiO3 as sensing film
08/18/2005US20050179062 Semiconductor device and method of manufacturing the same
08/18/2005US20050179061 Semiconductor integrated circuits with stacked node contact structures and methods of fabricating such devices
08/18/2005US20050179060 Semiconductor device for integrated injection logic cell and process for fabricating the same
08/18/2005US20050179059 Well for CMOS imager and method of formation
08/18/2005US20050179057 System semiconductor device and method of manufacturing the same
08/18/2005US20050179054 Semiconductor device and process for production thereof
08/18/2005US20050179050 Highly doped III-nitride semiconductors
08/18/2005US20050179047 Highly doped III-nitride semiconductors
08/18/2005US20050179040 Display device and method of manufacturing the same
08/18/2005US20050179038 Thin film transistor having LDD structure
08/18/2005US20050179036 Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system
08/18/2005US20050179034 Thin film device and its fabrication method
08/18/2005US20050179030 Field effect transistor device with channel fin structure and method of fabricating the same
08/18/2005US20050179029 Methods of fabricating vertical carbon nanotube field effect transistors for arrangement in arrays and field effect transistors and arrays formed thereby
08/18/2005US20050179028 Construction of thin strain-relaxed SiGe layers and method for fabricating the same
08/18/2005US20050179025 Image display unit
08/18/2005US20050178993 Unitary slot valve actuator with dual valves
08/18/2005US20050178979 Light generator and exposure apparatus
08/18/2005US20050178944 Method for optically detecting deviations of an image plane of an imaging system from the surface of a substrate
08/18/2005US20050178815 Method for preparing integrated circuit modules for attachment to printed circuit substrates
08/18/2005US20050178794 System and method to supply chemical during semiconductor device fabrication
08/18/2005US20050178752 Method and device for correcting pattern film on a semiconductor substrate
08/18/2005US20050178742 Compositions and methods for rapidly removing overfilled substrates
08/18/2005US20050178741 Method of etching porous dielectric
08/18/2005US20050178740 Sequentially providing a plurality of dry plasma reaction gas mixtures; dividing the semiconductor structure into a masked portion and an unmasked portion; sequentially exposing the unmasked portion of the semiconductor structure to the dry plasma reaction gas mixtures
08/18/2005US20050178731 Comprises octafluorocyclopentene; for dry etching/chemical vapor deposition/ashing; production of highly integrated/densified/large-sized semiconductor devices
08/18/2005US20050178672 electropolishing a metallic film formed on a substrate by passing an electric current to the metallic film; current passing electrode is used in non-contact state and no pressure is exerted on inter-layer insulation film at the time of passing the electric current, breakage of inter-layer insulation film
08/18/2005US20050178660 Sputter arrangement with a magnetron and a target
08/18/2005US20050178657 Systems and methods of plating via interconnects
08/18/2005US20050178581 Underfilling efficiency by modifying the substrate design of flip chips
08/18/2005US20050178505 Electrode for dry etching a wafer
08/18/2005US20050178504 Apparatus and method for treating disc-shaped substrates
08/18/2005US20050178503 Substrate processing apparatus and substrate processing method
08/18/2005US20050178502 Adhesive, method of connecting wiring terminals and wiring structure
08/18/2005US20050178495 Method for transferring elements between substrates
08/18/2005US20050178471 having a larger low-defective region on its surface; seed crystal portion is formed into stripes on a substrate with a buffer layer sandwiched therebetween
08/18/2005US20050178423 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
08/18/2005US20050178409 Object processing apparatus and processing method
08/18/2005US20050178402 Methods and apparatus for cleaning and drying a work piece
08/18/2005US20050178401 applying heated ozone-solvent solution to the material at the elevated pressure; reduces the rate of loss of ozone from the ozone-solvent solution resulting from heating the ozone-solvent solution
08/18/2005US20050178335 Method and apparatus for active temperature control of susceptors
08/18/2005US20050178334 Susceptor Unit and Apparatus in Which the Susceptor Is Installed
08/18/2005US20050178333 System and method of CVD chamber cleaning
08/18/2005US20050178328 Film forming method and film forming apparatus
08/18/2005US20050178322 Liquid trap for a vacuum line
08/18/2005US20050178321 Semiconductor substrate processing apparatus
08/18/2005US20050178318 Method of growing crystal of compound semiconductor and method of manufacturing compound semiconductor device
08/18/2005US20050178280 Imprinting apparatus with independently actuating separable modules
08/18/2005DE19823742B4 Verfahren zum Bilden eines Isolationsbereichs in einem Halbleitersubstrat A method of forming an isolation region in a semiconductor substrate,
08/18/2005DE19521489B4 Kondensatorplatte und Kondensator, je in einer Halbleitervorrichtung gebildet, die Verwendung eines solchen Kondensators als Speicherkondensator einer Halbleitervorrichtung, Verfahren zur Herstellung eines Kondensators und Verwendung eines solchen Verfahrens zur Herstellung von DRAM-Vorrichtungen Capacitor plate and capacitor, each formed in a semiconductor device, the use of such a capacitor as a storage capacitor of a semiconductor device, and method for manufacturing a capacitor using such a method for the production of DRAM devices
08/18/2005DE10393369T5 Poliervorrichtung, Polierkopf und Polierverfahren Polishing machine, polishing head and polishing method
08/18/2005DE10392913T5 Verfahren zur Behandlung der Oberfläche eines Substrats A method for treating the surface of a substrate
08/18/2005DE10356119B3 Elektronisches Bauelement mit elektrische Kontaktflächen aufweisenden nachgiebigen Erhebungen und Verfahren zu dessen Herstellung Electronic component having electrical contact areas having resilient projections and process for its preparation
08/18/2005DE10329329B4 Hochfrequenz-Gehäuse und Verfahren zu seiner Herstellung High-frequency package and process for its preparation
08/18/2005DE10307822B4 Grabenisolationsprozesse unter Verwendung einer Polysilizium-unterstützten Füllung Grave isolation processes using a polysilicon-supported filling
08/18/2005DE10297788T5 Vorrichtung für die Herstellung einer Halbleitervorrichtung und Verfahren für die Herstellung einer Halbleitervorrichtung unter Verwendung dieser Vorrichtung An apparatus for the production of a semiconductor device and method for manufacturing a semiconductor device using this apparatus,
08/18/2005DE10258423B4 Verfahren zur Charakterisierung eines Linsensystems A method for characterizing a lens system
08/18/2005DE102005003872A1 Verfahren zum Schutz eines Halbleiterwafers und Adhäsivfilm zum Schutz von Halbleiterwafer A method for protecting a semiconductor wafer and adhesive film for protecting semiconductor wafers
08/18/2005DE102005003477A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit Elektroden an Haupt- und Rückseiten eines Halbleiterchips A process for producing a semiconductor device with electrodes at the main and back sides of a semiconductor chip
08/18/2005DE102005002767A1 Halbleiteranordnung Semiconductor device
08/18/2005DE102005002167A1 Gerilltes Polierkissen und Verfahren Grooved polishing pad and method
08/18/2005DE102005000831A1 Contamination control apparatus for reducing contaminants due to leaked gas in clean room, comprises cover for enclosing joint portion, inlet port for supplying gas, and outlet port for exhausting gas and contaminant from cavity
08/18/2005DE102005000727A1 Elektrisches Kontaktelement und Verfahren zu dessen Herstellung sowie Vakuum-Trennschalter, Vakuum-Leistungsschutzschalter und Lastabtrennschalter unter Verwendung desselben The same electrical contact element and method for its preparation and vacuum circuit breakers, vacuum circuit breaker and Lastabtrennschalter using
08/18/2005DE102005000645A1 Treatment of substrate for manufacture of semiconductor device comprises chemically mechanically polishing substrate in intermediate polishing step then in final polishing step
08/18/2005DE102004061930A1 Optischer Koppler und damit ausgerüstete elektronische Einrichtung An optical coupler and thus equipped electronic device
08/18/2005DE102004060633A1 Halbleiterlegierung mit einer geringen Oberflächenrauheit, und entsprechendes Herstellungsverfahren Semiconductor alloy with a low surface roughness, and manufacturing method thereof
08/18/2005DE102004059657A1 Diamanthalbleitervorrichtung und Verfahren zu dessen Herstellung Diamond semiconductor device and process for its preparation
08/18/2005DE102004059620A1 Halbleitervorrichtung Semiconductor device
08/18/2005DE102004058708A1 Polierkopf und Poliervorrichtung Polishing head and polishing machine
08/18/2005DE102004039906A1 Electronic component with a number of integrated members, is formed by producing members with a surface that contains a circuit, and connecting components using bond wires
08/18/2005DE102004039235A1 Read operation performing method for use in memory cell string, involves applying write sense current across magnetic random access memory cell, and determining whether one voltage across string differs from another voltage
08/18/2005DE102004005951A1 Verfahren zur Herstellung von vertikal isolierten Bauelementen auf SOI-Material unterschiedlicher Dicke Process for preparing vertical insulated components on SOI material of different thickness
08/18/2005DE102004005506A1 Verfahren zur Erzeugung von aktiven Halbleiterschichten verschiedener Dicke in einem SOI-Wafer A process for the generation of active semiconductor layers of different thickness in a SOI wafer
08/18/2005DE102004005255A1 Verfahren zum Anordnen einer Leitungsstruktur auf einem Substrat und Substrat mit der Leitungsstruktur A method of disposing a line structure on a substrate and substrate with the conduit structure
08/18/2005DE102004005082A1 Kondensator mit einem Dielektrikum aus einer selbstorganisierten Monoschicht einer organischen Verbindung Capacitor having a dielectric made of a self-assembled monolayer an organic compound
08/18/2005DE102004004942A1 Passivierung isolierender Trenngräben von integrierten Schaltungen Passivation insulating isolation trenches of integrated circuits
08/18/2005DE102004004864A1 Gate structure with layered gate electrode stack comprising doped polysilicon layer and gate metal layer sandwiching barrier layer of metal nitride with metal contact film deposited on polysilicon layer
08/18/2005DE102004004858A1 Implements for simultaneously coating number of wafers during semiconductor manufacture by deposition from gas phase, i.e. chemical vapour deposition (CVD), or compressing chemical vapour deposition (LPCVD) as well as gas injector
08/18/2005DE102004004857A1 Method for characterising regular electronic structure formed in chip by electromagnetically irradiating chip region containing structure elements, picking-up measuring signature of surface radiation and approximating model parameters
08/18/2005DE102004004556A1 Verfahren zur Herstellung der Halbleiterscheibe A process for producing the semiconductor wafer
08/18/2005DE102004004555A1 Verfahren zur Herstellung von hoch dotierten Halbleiterscheiben und versetzungsfreie, hoch dotierte Halbleiterscheiben Process for the preparation of highly doped semiconductor wafers and dislocation-free, highly doped semiconductor wafers
08/18/2005DE102004004512A1 Integrierte Schaltung mit lateraler dielektrischer Isolation aktiver Bereiche über elektrisch kontaktiertem vergrabenem Material und Herstellungsverfahren Integrated circuit with lateral dielectric isolation of active regions on electrically-contacted buried material and manufacturing processes
08/18/2005DE102004004150A1 Connecting semiconductor chips to a metal substrate, comprises directing an energy beam through the chip onto a boundary surface between the chip and the substrate to melt the substrate surface
08/18/2005DE102004003863A1 Technik zur Herstellung eingebetteter Metallleitungen mit einer erhöhten Widerstandsfähigkeit gegen durch Belastung hervorgerufenen Materialtransport Technology for the production of embedded metal lines with increased resistance caused by load material handling
08/18/2005DE102004003363A1 Process to manufacture a nano-storage component for storage of an electronic charge by ion injection and crystallisation
08/18/2005DE102004003337A1 Plasmaangeregtes chemisches Gasphasenabscheide-Verfahren, Silizium-Sauerstoff-Stickstoff-haltiges Material und Schicht-Anordnung Plasma enhanced chemical vapor deposition process, silicon-oxygen-nitrogen-containing material and layer arrangement
08/18/2005DE102004002464A1 Filling contact holes in dielectric layer on substrate, comprises removing impurities from hole walls, gassing out residues, applying adhesive layer, and filling with metal compound
08/18/2005DE10194791B4 Verfahren zum Bilden von Halbleiterstrukturen A method for forming semiconductor structures
08/18/2005DE10011008B4 Verfahren und Vorrichtung zum Anbringen einer Abdeckung auf einem Substrat und Verfahren und Vorrichtung zum Aufbringen eines Dichtungsmittels auf eine Komponente Method and apparatus for attaching a cover on a substrate and method and device for applying a sealant to a component
08/18/2005CA2553669A1 Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
08/18/2005CA2537951A1 Catheter tip
08/17/2005EP1564887A1 Time limit function utilization apparatus
08/17/2005EP1564839A2 Semiconductor chip with coil antenna and communication system with such a semiconductor chip
08/17/2005EP1564815A1 Lateral conduction schottky diode with plural mesas
08/17/2005EP1564814A2 Organic light emitting display
08/17/2005EP1564811A2 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
08/17/2005EP1564810A1 Semiconductor device and manufacturing method thereof
08/17/2005EP1564807A2 Semiconductor device and manufacturing method of the same
08/17/2005EP1564806A1 Semiconductor device and manufacturing method of the same