Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/16/2005US6929784 Chlorotrifuorine gas generator system
08/16/2005US6929774 Method and apparatus for heating and cooling substrates
08/16/2005US6929755 Method of and apparatus for chemical mechanical polishing and slurry supplying device
08/16/2005US6929726 Sputtering target, Al interconnection film, and electronic component
08/16/2005US6929722 Substrate plating apparatus
08/16/2005US6929721 Ion beam modification of residual stress gradients in thin film polycrystalline silicon membranes
08/16/2005US6929713 In-situ photoresist removal by an attachable chamber with light source
08/16/2005US6929712 Plasma processing apparatus capable of evaluating process performance
08/16/2005US6929700 Hydrogen assisted undoped silicon oxide deposition process for HDP-CVD
08/16/2005US6929531 System and method for metal residue detection and mapping within a multi-step sequence
08/16/2005US6929529 Polishing apparatus
08/16/2005US6929471 Heat insulation pedestal and vertical type furnace tube
08/16/2005US6929299 Bonded structures for use in semiconductor processing environments
08/16/2005US6929298 Wafer transfer apparatus and device and method for cleaning robot arm in wafer transfer apparatus
08/16/2005US6929168 Method for determining optimum bonding parameters for bonding with a wire bonder
08/16/2005US6929014 Ultrasonic treatment apparatus employing relatively large tanks with bottom-mounted ultrasonic transducers for simultaneously processing a large plurality of disc-shaped workpieces are replaced with at least one ultrasonic treating
08/16/2005US6928850 Method and tooling for z-axis offset of lead frames
08/16/2005US6928751 Includes rotatable chuck for supporting substrate and splash guard which deflects fluid flung off from centrifugal force; for cleaning semiconductor wafers
08/16/2005US6928748 Method to improve post wafer etch cleaning process
08/16/2005CA2350747C Improved transfer molding of integrated circuit packages
08/11/2005WO2005074346A1 Mounting system for high-mass heatsinks
08/11/2005WO2005074340A1 Multilayer printed wiring board and method for manufacturing same
08/11/2005WO2005074339A1 Partially etched dielectric film with conductive features
08/11/2005WO2005074328A1 Organic el panel
08/11/2005WO2005074052A1 Method for fabricating piezoelectric element
08/11/2005WO2005074048A1 Free-standing semiconductor substrate and the manufacturing method and manufacturing apparatus thereof
08/11/2005WO2005074037A1 Method for manufacturing semiconductor device
08/11/2005WO2005074036A1 Field effect transistor and method for manufacturing same
08/11/2005WO2005074035A1 Field effect transistor and method for manufacturing same
08/11/2005WO2005074034A1 Semiconductor device
08/11/2005WO2005074033A1 Method for manufacturing soi wafer
08/11/2005WO2005074032A1 Semiconductor device and its manufacturing method
08/11/2005WO2005074030A1 Semiconductor device
08/11/2005WO2005074027A2 Integrated circuit chip with electrostatic discharge protection device
08/11/2005WO2005074025A2 Self-aligned trench mos junctions field-effect transistor for high-frequency applications
08/11/2005WO2005074024A1 Semiconductor memory cell and corresponding method of producing the same
08/11/2005WO2005074023A1 Method of forming planarized shallow trench isolation
08/11/2005WO2005074022A1 A method of fabricating a release substrate
08/11/2005WO2005074021A1 Passivation of deep isolating separating trenches with sunk covering layers
08/11/2005WO2005074020A1 Semiconductor manufacturing apparatus and semiconductor manufacturing method using same
08/11/2005WO2005074019A1 Semiconductor device
08/11/2005WO2005074018A1 Structure and method for low vss resisitance and reduced dibl in a floating gate memory cell
08/11/2005WO2005074017A1 A stress-tuned, single-layer silicon nitride film and method of deposition therefore
08/11/2005WO2005074016A1 Method for cleaning process chamber of substrate processing apparatus, substrate processing apparatus, and method for processing substrate
08/11/2005WO2005074013A2 Silicon carbide on diamond substrates and related devices and methods
08/11/2005WO2005073979A1 Non-volatile memory cell using high-k material and inter-gate programming
08/11/2005WO2005073904A1 Semiconductor device
08/11/2005WO2005073812A1 Photoresist composition for photomask, method for forming resist pattern and method for manufacturing photomask
08/11/2005WO2005073811A1 Positive resist composition and method of forming resist pattern
08/11/2005WO2005073810A1 Negative resist composition and method for forming resist pattern
08/11/2005WO2005073692A1 Substrate inspection device, substrate inspection method, and recovery tool
08/11/2005WO2005073430A2 Apparatus for electroless deposition of metals onto semiconductor substrates
08/11/2005WO2005073429A2 Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
08/11/2005WO2005072910A1 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device
08/11/2005WO2005072906A1 Soldering flux and soldering method
08/11/2005WO2005072560A2 Methods and apparatus for installing a scrubber brush on a mandrel
08/11/2005WO2005072489A2 Spin-on protective coatings for wet-etch processing of microelectronic substrates
08/11/2005WO2005072472A2 Method of manufacturing non-volatile dram
08/11/2005WO2005072377A2 Non-volatile dram and a method of making thereof
08/11/2005WO2005072338A2 Multi-step pad conditioningh system and method for chemical planarization
08/11/2005WO2005072302A2 Method for depositing high-quality microcrystalline semiconductor materials
08/11/2005WO2005072224A2 Integrated photonic devices
08/11/2005WO2005072211A2 System and method for removal of photoresist and residues following contact etch with a stop layer present
08/11/2005WO2005072200A2 System for reduction corrosion effects of metallic semiconductor structures
08/11/2005WO2005072154A2 Vertical gate cmos with lithography-independent gate length
08/11/2005WO2005072095A2 Method of treating microelectronic substrates
08/11/2005WO2005072089A2 Controlled nanowire in permanent integrated nano-templates and method of fabricating sensor and transducer structures
08/11/2005WO2005057630A3 Manufacturable low-temperature silicon carbide deposition technology
08/11/2005WO2005055291A9 Apparatus and method for reducing electrical noise in a thermally controlled chuck
08/11/2005WO2005050697A3 Method for forming wavy nanostructures
08/11/2005WO2005050257A8 High temperature imaging device
08/11/2005WO2005048223A8 Light-emitting device and method for manufacturing the same
08/11/2005WO2005048221A8 Display device and method for fabricating the same
08/11/2005WO2005045931A3 Semiconductor chip having flip-chip contacts and method for producing the same
08/11/2005WO2005043602A3 Three-dimensional inductive micro components
08/11/2005WO2005040348A3 Method for two- and three-dimensional microassembly of patterns and structures
08/11/2005WO2005036588A8 Tray with flat bottom reference surface
08/11/2005WO2005013330A3 Crack stop for low k dielectrics
08/11/2005WO2005010955A3 Method and apparatus for real-time in-situ ion implantation with closed loop control
08/11/2005WO2005010944A3 Fet channel having a strained lattice structure along multiple surfaces
08/11/2005WO2005008772A3 Electronic component and flat conductor frame comprising a structured metal layer which is non-wettable by a solder material for the production of the component
08/11/2005WO2004114374A3 Method of using pre-applied underfill encapsulant
08/11/2005WO2004113228A3 Process boat and shell for wafer processing
08/11/2005WO2004104274A3 Zinc oxide crystal growth substrate
08/11/2005WO2004025378A3 Holographic or optically variable printing material and method for customized printing
08/11/2005WO2004010473A3 Bubbler for substrate processing
08/11/2005US20050177811 Method of setting process parameter and method of setting process parameter and/or design rule
08/11/2005US20050177810 Lithographic process window optimization under complex constraints on edge placement
08/11/2005US20050177588 Data communication bus
08/11/2005US20050177343 Method and apparatus for forming a pattern, device and electronic apparatus
08/11/2005US20050177334 Resistance value calculation method
08/11/2005US20050177273 Material supply system in semiconductor device manufacturing plant
08/11/2005US20050177272 Controlling device for monitoring the spatial or mechanical delimitation of producer goods or materials in the production cycle by using of transponder technology
08/11/2005US20050177269 Method for dynamic sensor configuration and runtime execution
08/11/2005US20050177268 Design system for delivering data, system for fabricating a semiconductor device, method of communicating writing data, method for fabricating a semiconductor device
08/11/2005US20050177045 cMUT devices and fabrication methods
08/11/2005US20050176923 Polysulfone compositions exhibiting very low color and high light transmittance properties and articles made therefrom
08/11/2005US20050176882 wires connected using a mixture of curing agents capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, having high bonding strength and connection reliability
08/11/2005US20050176607 Thinner composition and method of removing photoresist using the same
08/11/2005US20050176606 Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device