Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2005
09/20/2005US6946036 Method and device for removing particles on semiconductor wafers
09/20/2005US6946035 Dirt removed by irradiating the substrate with ultraviolet rays in an oxygen-containing atmosphere in advance of wet cleaning with pure water; wet cleaning time and the amount of pure water can be reduced; liquid crystal device glass substrates
09/20/2005US6946033 Heated gas distribution plate for a processing chamber
09/20/2005US6946029 Sheet manufacturing method, sheet, sheet manufacturing apparatus, and solar cell
09/20/2005US6946009 Cerium-based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material
09/20/2005US6945855 Method and apparatus for cleaning a web-based chemical mechanical planarization system
09/20/2005US6945854 Semiconductor device fabrication method and apparatus
09/20/2005US6945853 Methods for cleaning utilizing multi-stage filtered carbon dioxide
09/20/2005US6945746 Semiconductor manufacturing equipment and maintenance method
09/20/2005US6945707 Three-dimensional mounted assembly and optical transmission device
09/20/2005US6945521 Fluid mixing device and cutting device
09/20/2005US6945447 Thermal solder writing eutectic bonding process and apparatus
09/20/2005US6945446 Wire bonding method and apparatus
09/20/2005US6945443 Device for parting laminated substrate and liquid crystal cell
09/20/2005US6945437 Siphon tube of connector adapted to be mounted on reservoir
09/20/2005US6945405 Transport module with latching door
09/20/2005US6945259 Substrate cleaning method and substrate cleaning apparatus
09/20/2005US6945258 Substrate processing apparatus and method
09/20/2005US6945151 Integrated circuit package separators
09/20/2005US6945110 Sensor design and process
09/20/2005CA2205576C An apparatus for generation of a linear arc discharge for plasma processing
09/15/2005WO2005086551A1 Etching solution, method of etching and printed wiring board
09/15/2005WO2005086240A1 Boron phosphide-based semiconductor light-emitting device
09/15/2005WO2005086237A2 Ldmos transistor and method of making the same
09/15/2005WO2005086232A1 Microelectronic interconnect device comprising localised conductive pins
09/15/2005WO2005086231A1 Semiconductor structure
09/15/2005WO2005086228A1 Heat treatment after a smart-cut separation
09/15/2005WO2005086227A1 Method for improving the quality of a taken thin layer
09/15/2005WO2005086226A1 Heat treatment for improving the quality of a taken thin layer
09/15/2005WO2005086225A1 Non-contact holding device, and non-contact holding and conveying device
09/15/2005WO2005086224A1 Semi-conductor component comprising a thin semi-conductor chip and a firm wiring substrate, and method for the production and re-processing of thin semi-conductor chips
09/15/2005WO2005086223A2 Multi-layer overlay measurement and correction technique for ic manufacturing
09/15/2005WO2005086222A1 Method for revealing dislocations emerging in a crystalline material
09/15/2005WO2005086221A1 Method for packaging electronic component
09/15/2005WO2005086220A1 Highly reliable, cost effective and thermally enhanced ausn die-attach technology
09/15/2005WO2005086219A1 Method for sticking adhesive tape for die bonding and method for mounting electronic component
09/15/2005WO2005086218A1 Process for producing semiconductor module
09/15/2005WO2005086217A1 Matrix-type semiconductor package with heat spreader
09/15/2005WO2005086216A1 Semiconductor element and semiconductor element manufacturing method
09/15/2005WO2005086215A1 Plasma processing method and computer storing medium
09/15/2005WO2005086214A1 Two-fluid nozzle for cleaning substrate and substrate cleaning device
09/15/2005WO2005086213A1 Polishing agent and polishing method
09/15/2005WO2005086212A1 Semiconductor device cleaning member and manufacturing method thereof
09/15/2005WO2005086211A1 Method for fabricating a semiconductor device and apparatus for inspecting a semiconductor
09/15/2005WO2005086210A1 Self-cleaning catalyst chemical vapor deposition device and cleaning method therefor
09/15/2005WO2005086209A1 Optical element, projection optical system, and exposure device
09/15/2005WO2005086208A1 Apparatus and method for drying substrates
09/15/2005WO2005086207A1 Transfer device in manipulation and/or processing centres
09/15/2005WO2005086180A1 Thin-film transistor and thin-film transistor substrate and production methods for them and liquid crystal display unit using these and related device and method, and, sputtering target and transparent conductive film formed by using this and transparent electrode and related device and method
09/15/2005WO2005086088A1 Id chip and ic card
09/15/2005WO2005085954A1 Positive resist composition for immersion exposure and method for forming resist pattern
09/15/2005WO2005085951A1 Method for supporting mask manufacture, method for providing mask blank and mask blank dealing system
09/15/2005WO2005085950A1 Method of manufacturing photomask blank
09/15/2005WO2005085947A1 Laser light source device, exposure apparatus using this laser light source device, and mask examining device
09/15/2005WO2005085877A1 Probe and probe manufacturing method
09/15/2005WO2005085876A1 Vibration piezoelectric acceleration sensor
09/15/2005WO2005085791A1 Tightness test for disk bond connections and test structure for carrying out said method
09/15/2005WO2005085496A2 Ferroelectric thin film composites with improved top contact adhesion and devices containing the same
09/15/2005WO2005085495A1 Film forming method
09/15/2005WO2005085494A1 Low zirconium hafnium halide compositions
09/15/2005WO2005085492A1 Film forming equipment and film forming method
09/15/2005WO2005085301A1 Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer
09/15/2005WO2005085175A1 Alkoxide compound, raw material for thin film formation and process for producing thin film
09/15/2005WO2005084788A1 Mechanism and method for supplying liquid, and apparatus and method for developing treatment
09/15/2005WO2005084342A2 A semiconductor device having a silicided gate electrode and method of manufacture therefor
09/15/2005WO2005084231A2 Germanium deposition
09/15/2005WO2005084221A2 Self aligned contact structure for trench device
09/15/2005WO2005084164A2 Nanotube-based switching elements and logic circuits
09/15/2005WO2005084163A2 Method for creating flip-chip conductive polymer bumps using photolithography and polishing
09/15/2005WO2005067634A3 Advanced multi-pressure worpiece processing
09/15/2005WO2005064651A3 Improved gap-fill techniques
09/15/2005WO2005062384A3 Method of forming bridging lateral nanowires and device manufactured thereby
09/15/2005WO2005062374B1 Dicing/die bonding film and method of manufacturing the same
09/15/2005WO2005062349B1 Containing capacitors and method of forming
09/15/2005WO2005053005A3 A method to contact patterned electrodes on porous substrates and devices thereby
09/15/2005WO2005048363A3 Methods of processing semiconductor wafer backsides having light emitting devices (leds) thereon and leds so formed
09/15/2005WO2005047564A3 Method of improving post-develop photoresist profile on a deposited dielectric film
09/15/2005WO2005045892A3 Confined spacers for double gate transistor semiconductor fabrication process
09/15/2005WO2005034194A3 Repairing damage to low-k dielectric materials using silylating agents
09/15/2005WO2005029568A3 INTERFACIAL OXIDATION PROCESS FOR HIGH-k GATE DIELECTRIC PROCESS INTEGRATION
09/15/2005WO2005021842A3 High-purity crystal growth
09/15/2005WO2005020295A3 Filling vias with thick film paste using contact printing
09/15/2005WO2005017983A3 Plasma ashing process
09/15/2005WO2005017974A3 Improved integrated circuit substrate material and method
09/15/2005WO2005017967A3 Nanotube device structure and methods of fabrication
09/15/2005WO2005013363A3 Circuit arrangement placed on a substrate and method for producing the same
09/15/2005WO2005010956A3 Endeffectors for handling semiconductor wafers
09/15/2005WO2005010935A3 Method and system for electronic spatial filtering of spectral reflectometer optical signals
09/15/2005WO2004114386B1 Methods and system for processing a microelectronic topography
09/15/2005WO2004112092A3 Adjustable gas distribution system
09/15/2005WO2004112089A3 Method and system for fabricating multi layer devices on a substrate
09/15/2005WO2004107410B1 Self-aligned bipolar transistor having recessed spacers and method for fabricating same
09/15/2005WO2004107409B1 Method for fabricating a self-aligned bipolar transistor having increased manufacturabily and related structure
09/15/2005WO2004102619A3 Chemical vapor deposition epitaxial growth
09/15/2005WO2004094764A3 Low cost capacitors manufactured from conductive loaded resin-based materials
09/15/2005WO2004070794B1 Method to deposit an impermeable film onto a porous low-k dielectric film
09/15/2005US20050204330 Exposure pattern forming method and exposure pattern
09/15/2005US20050204327 Layout data verification method, mask pattern verification method and circuit operation verification method
09/15/2005US20050204326 Method of configuring information processing system and semiconductor integrated circuit
09/15/2005US20050204322 Design layout preparing method
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