Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2005
09/14/2005EP1573823A1 Dense dual-plane devices
09/14/2005EP1573822A2 Complementary analog bipolar transistors with trench-constrained isolation diffusion
09/14/2005EP1573820A1 Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement, and method for the production of a fin field effect transistor memory cell
09/14/2005EP1573812A1 High density package interconnect power and ground strap and method therefor
09/14/2005EP1573810A2 Method for forming patterns aligned on either side of a thin film
09/14/2005EP1573808A1 Ic tiling pattern method, ic so formed and analysis method
09/14/2005EP1573805A2 Method for re-routing lithography-free microelectronic devices
09/14/2005EP1573804A1 Methods of forming structure and spacer and related finfet
09/14/2005EP1573803A2 Integrating n-type and p-type metal gate transistors
09/14/2005EP1573802A1 Method of the production of cavities in a silicon sheet
09/14/2005EP1573801A1 Trench isolation structure for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same
09/14/2005EP1573800A2 Flexible semiconductor device and method of manufacturing the same
09/14/2005EP1573799A1 Three-dimensional device fabrication method
09/14/2005EP1573798A1 Manufacture of trench-gate semiconductor devices
09/14/2005EP1573797A1 Method of manufacture of a trench-gate semiconductor device
09/14/2005EP1573796A1 Sulfide encapsulation passivation technique
09/14/2005EP1573795A1 A system and method for controlling plasma with an adjustable coupling to ground circuit
09/14/2005EP1573794A1 Selective etching of a protective layer
09/14/2005EP1573793A2 Mis transistor with self-aligned gate and method for making same
09/14/2005EP1573792A2 Pre-etch implantation damage for the removal of thin film layers
09/14/2005EP1573791A2 Strained silicon-on-insulator (ssoi) and method to form the same
09/14/2005EP1573790A2 Semiconductor devices with reduced active region defects and unique contacting schemes
09/14/2005EP1573788A2 Method and system for fabricating multi layer devices on a substrate
09/14/2005EP1573787A2 Method for improved alignment tolerance in a bipolar transistor and related structure
09/14/2005EP1573784A2 System and method for suppression of wafer temperature drift in cold-wall cvd system
09/14/2005EP1573783A2 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
09/14/2005EP1573781A2 Device for rapid heat treatment comprising inside the reaction chamber cold-walled halogen infrared lamps
09/14/2005EP1573780A2 Bubbler for substrate processing
09/14/2005EP1573779A2 High pressure processing chamber for semiconductor substrate including flow enhancing features
09/14/2005EP1573778A2 Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
09/14/2005EP1573775A2 Gas distribution apparatus and method for uniform etching
09/14/2005EP1573771A2 System and method for removal of materials from an article
09/14/2005EP1573759A2 Dye sensitized solar cells having foil electrodes
09/14/2005EP1573745A2 Programmable interconnect cell for configuring a field programmable gate array
09/14/2005EP1573366A2 Continuous direct-write optical lithography
09/14/2005EP1573087A1 Copper activator solution and method for semiconductor seed layer enhancement
09/14/2005EP1573086A2 Additives to prevent degradation of alkyl-hydrogen siloxanes
09/14/2005EP1572897A2 Ordered biological nanostructures formed from chaperonin polypeptides
09/14/2005EP1572856A1 Cleaning agent composition, cleaning and production methods for semiconductor wafer, and semiconductor wafer
09/14/2005EP1572833A1 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
09/14/2005EP1572821A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1572820A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1501916A4 Non-corrosive cleaning compositions for removing etch residues
09/14/2005EP1459360A4 Active matrix thin film transistor array backplane
09/14/2005EP1453618A4 An apparatus and method for cleaning glass substrates using a cool hydrogen flame
09/14/2005EP1427865A4 Textured-grain-powder metallurgy tantalum sputter target
09/14/2005EP1412600A4 Smif container latch mechanism
09/14/2005EP1337601A4 Slurry for chemical-mechanical polishing copper damascene structures
09/14/2005EP1327258A4 Chemical-mechanical polishing slurry and method
09/14/2005EP1305673A4 Prioritizing the application of resolution enhancement techniques
09/14/2005EP1236017B1 X-ray tomography bga ( ball grid array ) inspections
09/14/2005EP1196802B1 Optical system
09/14/2005EP1044458B1 Dual face shower head magnetron, plasma generating apparatus and method of coating a substrate
09/14/2005EP1010040A4 Laser-illuminated stepper or scanner with energy sensor feedback
09/14/2005EP0700571B1 Memory material and method for its manufacture
09/14/2005CN2726125Y Contact window of semiconductor fin shaped element
09/14/2005CN2726124Y 半导体装置 Semiconductor device
09/14/2005CN2726123Y Semiconductor assembly
09/14/2005CN2726122Y Digital follower digital storage assemblyl and static random access internal storage
09/14/2005CN2726118Y Fin shaped element with silicon chip on insulation layer and single transistor static random access internal storage using same
09/14/2005CN2726117Y Wafer with semiconductor on insulation layer
09/14/2005CN2726116Y Structure for improving adhesivity between etching stop layer and metal layer
09/14/2005CN2726110Y Structure with multi-thickness insulation layer semiconductor
09/14/2005CN2726109Y Calibration wafer and calibration apparatus
09/14/2005CN2726108Y Multi-layer semiconductor wafer structure
09/14/2005CN2726076Y Inductive comping coil and its inductive coupling plasma apparatus
09/14/2005CN2725320Y Equipment for electrochemial electroplating
09/14/2005CN1669230A Direct conversion receiver using vertical bipolar junction transistor available in deep n-well CMOS technology
09/14/2005CN1669176A 传送线路和半导体集成电路装置 Transmission line and the semiconductor integrated circuit device
09/14/2005CN1669154A Organic semiconductor element, production method therefor and organic semiconductor device
09/14/2005CN1669153A Semiconductor device, production method and production device thereof
09/14/2005CN1669152A Field effect transistor, associated use, and associated production method
09/14/2005CN1669150A Bipolar transistor
09/14/2005CN1669149A 图像传感器以及图像传感器模块 The image sensor and an image sensor module
09/14/2005CN1669148A Semiconductor substrate manufacturing method and semiconductor device manufacturing method, and semiconductor substrate and semiconductor device manufactured by the methods
09/14/2005CN1669146A Ferroelectric gate device
09/14/2005CN1669145A Schottky barrier CMOS device and method
09/14/2005CN1669144A Nanoelectronic devices and circuits
09/14/2005CN1669142A Surface mount solder method and apparatus for decoupling capacitance and process of making
09/14/2005CN1669139A Semiconductor devices with wire bond inductor and method
09/14/2005CN1669137A Semiconductor device and method of manufacturing the same
09/14/2005CN1669136A Method for carrying object to be processed
09/14/2005CN1669135A Sealing ring assembly and mounting method
09/14/2005CN1669134A Selective connection in ic packaging
09/14/2005CN1669133A Method for encapsulating an electronic component using a foil layer
09/14/2005CN1669132A Self-healing polymer compositions
09/14/2005CN1669131A Semiconductor device
09/14/2005CN1669130A Interlayer adhesion promoter for low K material
09/14/2005CN1669129A Method of dry etching, dry etching gas and process for producing perfluoro-2-pentyne
09/14/2005CN1669128A High temperature anisotropic etching of multi-layer structures
09/14/2005CN1669127A Heat treatment method and heat treatment apparatus
09/14/2005CN1669126A Surface treating method for substrate
09/14/2005CN1669125A Heat treatment method and heat treatment device
09/14/2005CN1669124A Heat treatment equipment
09/14/2005CN1669123A Semiconductor element with stress-carrying semiconductor layer and corresponding production method
09/14/2005CN1669122A Methods for transferring a useful layer of silicon carbide to a receiving substrate
09/14/2005CN1669121A Transfer mask for exposure and pattern exchanging method of the same
09/14/2005CN1669120A Angled sensors for detecting substrates
09/14/2005CN1669119A Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor
09/14/2005CN1669117A Susceptor for MOCVD reactor